COM Express is a standard defined by PICMG that specifies a Computer-On-Module (COM). Adopting COM Express technology enables the creation of highly flexible, expandable, and feature-rich embedded systems that can be configured for a broad spectrum of industrial applications while ensuring the longest possible lifecycle with future-proof upgradeability.
The goal of the COM Express specification is to provide a standardized, modular approach to embedded computing that balances performance, cost, and flexibility. By using a two-board system, with the carrier board managing all I/O and subsystems, and the COM Express processor module housing the CPU and other processing components, COM Express allows for scalable and customizable designs, suitable for various applications such as automation, defense, transportation, robotics, and medical technology. It ensures ease of integration, rapid development, and long-term upgradeability, ultimately lowering the cost of ownership.
Our range of COM Express solutions includes a comprehensive selection of modules, carrier boards, SBCs, and rugged systems, empowering our customers to innovate with top-tier industry solutions.
COM Express modules are compact circuit boards that interface with an application-specific carrier board through standardized connectors. Each COM-e module includes all essential embedded computing components, such as the CPU, GPU, and RAM, as well as a broad array of standard interfaces.
COM Express carrier boards serve as the foundation for integrating COM Express modules into an embedded system, providing essential connectivity and power. Our COM-e carrier boards are available for all industrial applications and can be custom-designed to meet specific requirements.
COM Express SBCs are designed for demanding edge applications, offering low power and high computing performance, cost-effective embedded features, and industrial-grade reliability. Available in traditional 3.5" and PC/104 form factors, they are ideal for integration inside compact embedded systems.
Rugged COM Express systems guarantee robust performance and reliability in harsh environments. Designed to withstand extreme temperatures, shock, and vibration, the COM-e standard ensure consistent operation and durability, making them suitable for demanding applications in military, aerospace, and industrial sectors.
The COM Express standard, first introduced in 2005, has grown to become one of the most widely adopted embedded hardware standards globally. Since it’s initial conception, PICMG have released a variety of types and sizes to accommodate to a multitude of industries and applications.
Type: This denotes the interface and connectivity options of the module. Each type specifies a different set of available interfaces such as PCIe lanes, Ethernet ports, USB ports, and other I/O connections.
Size: This refers to the physical dimensions of the module. The sizes (Mini, Compact, Basic, and Extended) dictate the module’s footprint and are designed to accommodate different levels of performance and thermal requirements.
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