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Nexcom NDiS B338

Slim Embedded Computer with Elkhart Lake J6412 Celeron CPU

Linux
Windows IoT / Professional
TPM
Triple Display Support
USB3
2 M2 Expansion
1 mPCIe Expansion
1 SIM Slot
4G LTE Cellular
WiFi
NVMe SSD
Fanless
Wide Temperature
CE
FCC

Things Embedded are an official Nexcom USA distributor and can supply the NDiS B338 fully configured and imaged.

Manufacturer:

Nexcom

Specification

Overview
Brand & Model Nexcom NDiS B338
Slim Embedded Computer with Elkhart Lake J6412 Celeron CPU
Features Compact
Embedded
Fanless
Industrial
Low Profile
Performance
Processor Series Celeron J Series Elkhart Lake
Processor Models Intel Celeron J6412: 2~2.6GHz, 4 Cores, 4 Threads, 1.5MB Cache, 10W
Memory 2x DDR4 3200MHz SO-DIMM Slots, 32GB
Secure Crypto Processor TPM 2.0 (Trusted Platform Module)
Operating System Linux
Windows 10
Graphics
Integrated GPU Intel UHD Series
Display Standards HDMI 2.0
Multi Display Support Triple Display Support
Display Outputs 3x HDMI
Audio
Codec Realtek HD Audio
Interface Line-Out
Mic-In
I/O
Ethernet 2x Ethernet Ports
2 x GbE LAN [RJ45]
USB 6x USB Ports
1 x USB 3.1 Gen 1 [Type A]
5 x USB 2.0 [Type A]
Serial 4x Serial Ports
1 x RS232/422/485 [DB9]
3 x RS232 [DB9]
GPIO GPIO [4-in, 4-out]
Expansion
M.2 2x M.2 Expansion Slots
1x M.2 B-Key [PCIe/USB] [3042/3052]
1x M.2 M-Key [PCIe x4] [2280]
mPCIe 1x mPCIe Slots
1x mPCIe [PCIe/USB/SATA]
SIM Slots 1x SIM Slots
Wireless Connectivity Optional 4G Modem
Optional WiFi/Bluetooth
Storage
Storage 1x M.2 SSD
1x mSATA
NVMe NVMe SSD Support
Power
Power Input 12V DC [Barrel Connector]
AC Power Supply Included
Power Support Modes AT: PWR on Input
ATX: Press Button to Power
Environmental Conditions
Thermal Dissipation Fanless Passively Cooled Chassis
Operating Temperature -20°C to 60°C [-4°F to 147°F]
Storage Temperature -20°C to 80°C [-4°F to 176°F]
Humidity 10% - 95% (Non-condensing)
Certification CE
FCC
Mechanical Properties
Dimensions 224mm x 39mm x 150mm (8.82" x 1.54" x 5.91")
Mounting Options Desktop
Wall Mount

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