Things Embedded are an official Nexcom USA distributor and can supply the X200 fully configured and imaged.
Overview | |
---|---|
Brand & Model | Nexcom X200-i3 |
3.5" Industrial Dual Core Embedded Computing Board with i3-1115G4E | |
Features | Compact Embedded Fanless Industrial |
Performance | |
Processor Series | 11th Gen Tiger Lake |
Processor Models | Intel Core i3-1115G4E: 2.2~3.6GHz, 2 Cores, 4 Threads, 6MB Cache, 15W |
Memory | 1x DDR4 3200MHz SO-DIMM Slot, 32GB |
Operating System | Linux Windows 10 |
Graphics | |
Integrated GPU | Intel UHD Series |
Display Standards | eDP 1.4b |
Multi Display Support | Triple Display Support |
Display Outputs | 1x Display Port 1x eDP 1x HDMI |
Audio | |
Interface | Line-In Line-Out Mic-In |
I/O | |
Ethernet | 2x Ethernet Ports |
2 x GbE LAN [RJ45] | |
LAN Controllers | Intel i211AT Intel I219LM |
USB | 8x USB Ports |
4 x USB 2.0 [Board] 4 x USB 3.2 Gen 2 [Type A] |
|
Serial | 2x Serial Ports |
1 x RS232 [Board] 1 x RS232/422/485 [Board] |
|
GPIO | GPIO [3-in, 3-out] |
Expansion | |
M.2 | 2x M.2 Expansion Slots |
1x M.2 E-Key [PCIe x1/USB 2.0] [2230] 1x M.2 M-Key [PCIe x4] [2280] |
|
Wireless Connectivity | Optional WiFi/Bluetooth |
Storage | |
Storage | 1x M.2 SSD 1x SATA Port |
NVMe | NVMe SSD Support |
Power | |
Power Input | 12V DC [Barrel Connector] |
Environmental Conditions | |
Thermal Dissipation | Optional Heat Spreader Optional Heatsink |
Operating Temperature | -20°C to 70°C [-4°F to 158°F] |
Storage Temperature | -40°C to 85°C [-40°F to 185°F] |
Humidity | 5% - 95% (Non-condensing) |
Certification | CE FCC |
Mechanical Properties | |
Weight | 0.2 Kg (0.44 Lbs) |
Dimensions | 146mm x 102mm (5.75" x 4.02") |
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