SolidRun BEDROCK R7000 BASIC TILE

The SolidRun Bedrock R7000 Basic boasts the AMD Ryzen 7 7840HS / 7840U processor, featuring 8 Zen 4 cores and 16 threads that clock up to 5.1 GHz. This APU is complemented by an integrated AMD Radeon 780M GPU, containing 12 CUs that operate at 2700 MHz. Crafted using TSMC's cutting-edge 4nm FinFET process, this chip stands as the pinnacle of power efficiency in high-performance x86 CPUs, excelling in both compute and graphics tasks. The SolidRun’s Bedrock R7000 Basic is also distinguished by its robust I/O, storage, and networking capabilities. It supports 4 display outputs (HDMI 2.1 / DP 2.1), each with the ability to handle 8K or four 4K outputs, all powered by the formidable Radeon 780M GPU. Other specifications include 64 GB DDR5 with ECC, 3x NVME Gen4 2280 slots, 2x 2.5 GbE ports, WiFi 6E, a 5G modem with dual SIM, and 4 USB ports. All these top-tier components are snugly housed in a compact, fanless enclosure measuring less than 1 liter.

High-performance chips demand creative cooling solutions. Bedrock has been engineered from the outset for efficient fanless thermal management. The CPU is seamlessly integrated with the chassis using a liquid metal Thermal Interface Material (TIM) to minimize thermal resistance. Integrated heatpipes distribute the heat uniformly across the all-aluminum chassis. To enhance convective heat transfer, each side of the chassis boasts dual heat exchange layers: aluminum air-ducts promoting airflow through the chimney effect, followed by a layer of traditional cooling fins. Consequently, Bedrock can disperse heat at over triple the capacity of similarly sized fanless systems. With the Bedrock R7000, you're not left wondering about the system's power consumption. You can accurately set the CPU power limit within an impressively wide range from 8W to 54W. This feature proves invaluable in situations where power distribution is essential between the industrial PC and other devices, or when certain constraints impact optimal heat dispersion.

Designed as a fanless and ventless IPC, the Bedrock demands no upkeep. Its design minimizes any need for field openings. SIM cards can be easily accessed via pin-hole trays on the panel. The remote power button connector is strategically positioned on the top panel for convenience. Additionally, all brackets and mounting fixtures can be assembled externally. On the rare occasion that you need to access the inside of the Bedrock, perhaps to add storage or change the RTC battery, it can be opened by simply unscrewing one screw. Bedrock's compact design, combined with its sturdy construction, efficient fanless cooling, and adaptable DC input, make its integration a breeze. All of its I/O components are conveniently located on the front panel, while the DC input and antennas are on the top. The bottom and rear panels are dedicated for mounting purposes, ensuring the device remains fully functional whether mounted on a wall or a desk. For versatile installation options, the Bedrock R7000 Basic provides a range of mounting brackets. These include a lever-based DIN-Rail bracket with a locking mechanism, wall mount, compact stand, and a reinforced stand.