COM-HPC vs COM Express

COM Express is the go-to architecture for applications prioritizing power efficiency, cost-effectiveness, and diverse I/O options over peak performance. It is particularly suited for a variety of embedded and industrial applications, including industrial automation, military, aerospace, transportation, and other fields where the advanced capabilities of COM-HPC would be excessive. Its well-established ecosystem, widespread adoption, and dependable reliability make COM Express an ideal solution for most embedded computing needs.

Since COM Express architecture was introduced, it has become a staple in industrial automation and control systems. These applications demand dependable, long-lasting components with balanced processing power and versatile I/O options. COM Express provides a trusted solution that combines energy efficiency with the processing capability necessary for a wide range of automation tasks, making it ideal for industrial environments where reliability and longevity are key. As an example, COM Express is a core technology integrated onboard reverse vending machines (RVMs), which scans recyclable material such as plastic, glass, or aluminium for crushing and sorting accordingly.

A key advantage of the COM Express architecture is its capacity for rugged systems to endure intense shock and vibration. COM Express carrier boards can be tailored precisely to specific dimensions, enabling direct soldering of I/O connectors and eliminating the need for internal cabling. Mating the COM module with a heat spreader allows for the embedded system to cool passively through conduction. This enables fanless designs when using low-power processors, making them highly suited for aerospace and military applications where a rugged design and SWaP-C2 (Size, Weight, Power, and Cost) optimisation are essential. See our range of COM Express SBCs which are preconfigured carrier board designs with COM module, heat spreader, and cable assembly kits.

COM Express is also a popular technology for Mission Computer designs where connector reliability is critical. These rugged mission computers built on COM Express often utilize specialized expansion breakout boards to simplify routing without internal cabling and securely integrate a range of I/O connections. By using these breakout boards, I/O signals are directed to MIL-DTL-38999 or MIL-DTL-5015 connectors, known for their durability, resistance to environmental factors, and ability to maintain signal integrity under harsh conditions. This approach not only enhances reliability by eliminating loose connections and minimising internal cabling but also facilitates modularity and ease of maintenance in the field. The rugged MIL connectors ensure that cables remain securely attached even under extreme vibration and shock, supporting mission-critical operations that require consistent and robust connectivity.

For pushing beyond what even high-end COM Express modules can deliver, COM-HPC is the preferred choice for it’s exceptional processing power, high data throughput, and advanced connectivity.

In data centers, COM-HPC’s ability to handle server-grade processors, large memory capacities, and extensive I/O options makes it the preferred choice for high-density data processing units and compact, energy-efficient servers. This specification is especially valuable for cloud and data center applications that benefit from powerful yet compact computing nodes.

In advanced medical imaging, such as MRI, CT, or 3D ultrasound, COM-HPC’s multi-core processor support and high-speed interfaces enable the real-time image processing and analysis required for these demanding applications.

For real-time data processing in AI-driven applications like smart cities, autonomous vehicles, and industrial automation, COM-HPC stands out. These environments demand substantial computational power, low latency, and high-bandwidth memory for running complex AI models and real-time analytics, all of which COM-HPC is built to support.

COM-HPC is also becoming increasingly popular for high-performance AR/VR systems used in training, gaming, or simulations. Its capability to deliver high graphics processing power, low latency, and high data throughput makes it perfect for handling complex 3D graphics and real-time processing in these immersive environments.

“With a form-factor sitting between the original COM Express Mini and COM Express Compact, we expect to see the COM-HPC Mini play a significant role in rugged edge computing applications where compact size, high performance, and low power consumption are essential. Its small form factor makes it ideal for deployment in space-constrained environments, while its support for high-performance processors and high-bandwidth memory ensures it can handle complex workloads such as AI inference at the edge.” Andrew Whitehouse, CEO at Things Embedded