What Is TDP? CPU Thermal Design Power Explained
TDP (thermal design power) is the heat, in watts, a processor’s cooler must remove at base frequency. This guide explains TDP, PL1, PL2 and cTDP, and how to size a fanless industrial computer around them.
TDP (thermal design power) is the average heat, in watts, that a processor’s cooling system must be able to remove while the chip runs at its base frequency under a demanding workload. It is a cooling target set by the chip maker, not a measure of speed and not the most power the processor can draw.
That is the short answer to what TDP means, and to what TDP stands for. The figure tells a system designer how big the heatsink, heat pipes or fan need to be. Intel has called the same figure processor base power since its 12th Gen Core processors, and both Intel and AMD let a processor run above it for short periods when there is thermal headroom.
For an industrial PC the number matters more than it does on a desk. A sealed, fanless chassis has a fixed ability to shed heat, so the processor’s TDP decides how hot the enclosure can get, how much of the turbo performance you keep, and how long the system will run without slowing down. This guide explains TDP alongside the power limits that now sit around it (PL1, PL2 and cTDP), then shows how to size a fanless computer around them.
Key takeaways
- 01A cooling target, in watts
- TDP is the sustained heat the cooler must remove at base frequency. It is not the maximum power the processor can draw.
- 02Processor base power is the new name
- Since 12th Gen Core, Intel lists processor base power (PBP) and maximum turbo power instead of a single TDP.
- 03PL1 and PL2 do the real work
- PL1 caps sustained power, usually at the TDP; PL2 allows a higher turbo level for a limited time.
- 04cTDP moves the target
- Configurable TDP lets a system maker run a processor at a lower or higher sustained level to suit the chassis.
- 05Fanless builds trade TDP for temperature
- In the same fanless chassis, a 65 W processor typically lowers the maximum ambient by 15–20 °C compared with a 35 W part.
TDP, PL1, PL2 and cTDP compared
Processor datasheets now list several power figures. They describe different things, and mixing them up is the most common reason a system runs hotter or slower than expected.
| Term | What it is | What it controls | Who sets it |
|---|---|---|---|
| TDP (thermal design power) | Average heat at base frequency under a heavy workload | The size of cooler the processor needs | Chip maker, per model |
| Processor base power (PBP) | Intel’s name for TDP from 12th Gen Core onwards | The same cooling target as TDP | Intel, per model |
| PL1 (power limit 1) | Long-duration power limit | Sustained power; usually set equal to TDP or PBP | System maker in the BIOS |
| PL2 / maximum turbo power | Short-duration power limit | How high power can rise during turbo bursts | Chip maker default, adjustable in the BIOS |
| Tau | Turbo time window | How long the processor may average above PL1 | System maker in the BIOS |
| cTDP (configurable TDP) | Alternative base power levels (cTDP-down, cTDP-up) | A lower or higher sustained target, with a matching base frequency | System maker, from the levels the chip supports |
| TjMax | Maximum junction temperature | The point where the processor starts to throttle | Chip maker; typically around 100 °C |
Two corrections to older guides, including an earlier version of this one. First, maximum turbo power is Intel’s current name for the PL2 value, not for cTDP. Second, TDP is not a power consumption figure: during turbo the processor can draw well above it for a while, and at idle it draws far less.
How PL1 and PL2 work together
When a heavy task starts, the processor is allowed to rise to PL2 and run at high turbo frequencies. It tracks its average power over the Tau window, and once that average reaches PL1 it drops back to the sustained limit. If the cooler cannot hold the die below TjMax at either level, the processor slows itself further; our guide to thermal throttling explains what that looks like in practice. On desktop motherboards PL2 is sometimes left on indefinitely, which is why the same processor can score very differently from one system to the next.
AMD and GPU equivalents
AMD lists a TDP for its processors too, and on socketed desktop Ryzen it also sets a package power tracking (PPT) limit above the TDP that plays a similar role to PL2. AMD embedded and mobile processors usually quote a configurable TDP range rather than one number.
Graphics processors follow the same idea under different names. Discrete GPUs list total graphics power or total board power, and MXM modules usually have a range the system maker chooses within. NVIDIA Jetson modules use selectable power modes, from about 7 W on the smallest Orin Nano modules to 60 W on Jetson AGX Orin 64GB. Our Jetson thermal design guide covers how those modes map onto a cooling design.
Sizing a fanless computer around TDP
A fanless chassis sheds a fixed amount of heat at a given ambient temperature. These four steps match the processor to it.
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Ambient
Worst-case airStart with the hottest air the computer will sit in, measured inside the cabinet or enclosure rather than in the room. A cabinet in the sun or next to drives can run 10–20 °C above the room, and that figure decides everything that follows.
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Sustained
PL1 at ambientCheck the manufacturer’s rated operating range for each processor class in that chassis. Fanless datasheets usually give one range for 35 W processors and a narrower one for 65 W parts. Pick the class whose range covers your worst-case ambient with some margin.
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Bursts
PL2 and TauDecide whether the workload needs short bursts of turbo or steady output. A fanless heatsink can absorb a short PL2 burst, but a long one heats the chassis and ends in throttling. For steady workloads, a slightly lower PL2 often gives more consistent performance.
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Configure
BIOS power limitsSet PL1, PL2 and, where the processor supports it, cTDP to match the enclosure. We configure these limits in the BIOS as part of every build, so the system runs inside its thermal envelope from the first boot.
What our fanless computers are rated for
Manufacturer ratings show the trade-off clearly. In the same fanless chassis, moving from a 35 W to a 65 W processor typically takes 15–20 °C off the top of the operating range, while the cold end stays the same.
| Computer | Processor range | Fanless rating with 35 W processors | Fanless rating with 65 W processors |
|---|---|---|---|
| Vecow ECX-3000 | 12th Gen Intel Core, up to Core i9-12900E at 65 W | −40 to 75 °C | −40 to 55 °C |
| Vecow VCM-1000 | 12th or 13th Gen Intel Core, up to Core i9-13900E at 65 W | −25 to 60 °C | −25 to 45 °C |
| Neousys Nuvo-9531-FT | Intel 12th to 14th Gen Core, up to Core i9-14900 | 65 W processors run at a 35 W TDP for the fanless envelope | Configured down to 35 W |
| Vecow SPC-7000 | 11th Gen Intel Core i5-1145G7E or i7-1185G7E | Configurable at 12 W or 15 W TDP | Not applicable (15 W class) |
The Nuvo-9531-FT shows the other route: rather than accept a narrower temperature range, it runs 65 W desktop processors at a 35 W sustained limit, keeping most of their core count while staying inside a fanless envelope. The SPC-7000 does the same at the low end with configurable TDP on 15 W mobile processors.
A fanless design moves heat from the processor through a heat spreader and heat pipes into the finned case. Our guides to how a fanless PC works and to active vs passive cooling go further, and sealed or rugged systems can also use conduction cooling into a cold plate or vehicle chassis.
Fanless computers sized by TDP
Four fanless computers from the table above, from 65 W Core i9 processors down to configurable 12–15 W mobile parts.

12th Gen Intel Core i9-12900E Fanless Industrial PC with Dual LAN
- CPU
- Intel Core 12th Gen (Alder Lake)
- Ethernet
- 1× 2.5GbE, 1× GbE
- Temp
- −40 to +75 °C

Intel Core i9-13900E Fanless Compact Embedded Computer
- CPU
- Intel Core 13th Gen (Raptor Lake)
- Ethernet
- 2× GbE
- Temp
- −25 to +60 °C

Intel 14th/13th/12th Gen Core Flattop Embedded Industrial PC with 4x 2.5GbE
- CPU
- Intel Core 13th Gen (Raptor Lake)
- Ethernet
- 4× 2.5GbE
- Temp
- −25 to +60 °C

Intel Core i7-1185G7E Tiger Lake Ultra-Compact Embedded Computer
- CPU
- Intel Core 11th Gen (Tiger Lake)
- Ethernet
- 1× 2.5GbE, 1× GbE
- Temp
- −40 to +60 °C
Choosing a TDP class: 15 W, 35 W or 65 W
Embedded processors cluster into three TDP classes, and most industrial projects can be placed in one of them before looking at model numbers.
| TDP class | Typical processors | Suits | Cooling |
|---|---|---|---|
| About 6–15 W | Intel Atom and N-series, mobile Core U-series, low-power Arm | Gateways, data logging, signage, light control | Fanless in a compact case, often wide temperature |
| About 35 W | Intel Core T and TE processors, desktop parts with PL1 set to 35 W | Machine vision, multi-display HMIs, mixed workloads | Fanless in a larger finned chassis |
| About 65 W | Intel Core E processors and other 65 W desktop parts | Heavy CPU workloads, many camera streams, virtualization | Fanless with a narrower temperature range, or active cooling |
In Intel’s embedded line the suffix tells you the class: “E” marks an embedded part with long-term availability, and “TE” marks the 35 W version. Our guide to embedded processors explains the naming in more depth, and Intel Core Ultra covers the newer processors that add an NPU inside a similar power budget.
Does a higher TDP mean better performance?
Within one generation, a higher TDP usually buys more sustained performance, because the processor can hold higher clocks or run more cores before it reaches its limit. Across generations it does not: a newer 35 W processor can outperform an older 65 W one. Compare benchmark results for the workload you plan to run, then pick the lowest TDP class that meets it. Hybrid processors complicate the picture further, as P-core vs E-core sets out.
TDP and running costs
TDP also gives an upper bound on energy use. A processor running at its rated power around the clock uses its TDP in watts multiplied by 8,760 hours a year:
| TDP | Energy per system per year | Energy for 100 systems per year |
|---|---|---|
| 15 W | about 131 kWh | about 13,100 kWh |
| 35 W | about 307 kWh | about 30,700 kWh |
| 65 W | about 569 kWh | about 56,900 kWh |
| 95 W | about 832 kWh | about 83,200 kWh |
Real systems spend much of their time below base power, so treat these as worst-case figures and multiply by your own tariff. The gap between classes is still useful: across a 100-system deployment, choosing 35 W over 65 W processors saves up to about 26,000 kWh a year, and the lower heat usually means a smaller, sealed chassis.
TDP: common questions
Quick answers
What does TDP stand for?
Thermal design power. It is sometimes expanded as thermal design point or thermal design profile, but all three describe the same cooling target in watts.
How do manufacturers determine TDP?
By testing at base frequency. Intel and AMD run a heavy, sustained workload on the processor at its base frequency and maximum junction temperature, and publish the average heat it produces. Each uses its own method, so TDPs from different makers are not directly comparable.
Is TDP the same as power consumption?
No. TDP is a cooling target. Actual power draw is lower at idle and can be well above TDP during turbo, up to the PL2 limit.
Does TDP change with the workload?
The rating does not, but the power does. The published TDP is fixed per model. The heat a processor actually produces varies with workload, clock speed, voltage, core count in use and ambient temperature, and BIOS power limits can raise or lower the sustained level.
Why does TDP matter for system design and maintenance?
It sets the cooling. An undersized cooler causes throttling and higher component temperatures; a fanless design sized for the TDP removes fans and filters from the maintenance schedule.
Can I change a processor’s TDP?
Within limits, in the BIOS. PL1, PL2 and cTDP can be set lower to suit a fanless chassis or higher where cooling allows. Raising them without matching cooling only leads to throttling.
What is TDP in a GPU?
The same idea: heat to remove. GPU makers usually quote total graphics power or total board power, which covers the GPU and its memory. Jetson modules use selectable power modes instead.
Is 65 W TDP good for a fanless PC?
Yes, with a large enough chassis. Many fanless industrial PCs accept 65 W processors, usually with a narrower operating temperature range than with 35 W parts.
TDP and cooling FAQs
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What Are the Advantages of Fanless Computers?
Fanless computers cool themselves passively, through a finned heatsink chassis and heat pipes, instead of a fan. With no moving parts and no airflow drawing in dirt, they are more reliable in dusty or vibrating places, silent, low maintenance and easy to seal, which is why they are the standard choice for industrial and embedded use.
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What Is Conduction Cooling?
Conduction cooling moves heat out of a computer through solid materials rather than moving air. Thermal pads, heat spreaders and heat pipes carry heat from the processor, memory and storage into the metal chassis, which passes it to the surface it is mounted on or to the surrounding air. With no fans or vents, the system can be fully sealed.
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What Is a CPU?
A CPU, or central processing unit, is the chip that runs a computer’s software. It fetches instructions from memory, decodes them and carries them out, billions of times a second. A modern CPU packs several cores, cache memory and often graphics and an NPU into one package.
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Intel Core Ultra vs Core i7: What Is the Difference?
Core Ultra is the brand Intel introduced with Meteor Lake, replacing Core i5, i7 and i9 on its newest chips. Core Ultra 7 sits where Core i7 did, but adds a built-in NPU for AI and Intel Arc or Xe graphics. Core i7 ended with the 14th Gen, and newer non-Ultra chips are named Core 5 and Core 7.
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iGPU vs dGPU: What Is the Difference?
An iGPU (integrated GPU) is built into the processor and shares the system memory, so it adds little power, heat or cost. A dGPU (discrete GPU) is a separate graphics processor with its own memory, offering far more performance but needing more power, cooling and space. For edge AI, iGPUs suit lighter inference and dGPUs suit heavy workloads.
Need help sizing a fanless system?
Tell us the workload, the enclosure and the hottest ambient it will see, and we will recommend a processor class and set its power limits to match.