Fanless IPC with Dual-Layer Heatsink Boosts Convection Cooling by 1.7x

As the demand for high-performance edge computing continues to surge, industries are seeking fanless industrial PCs that can handle complex compute and graphics workloads without compromising reliability or efficiency. The Bedrock R8000 from SolidRun rises to meet these challenges, redefining the standards for high-performance solid-state computers with their innovative thermal design.

At the heart of the Bedrock R8000 is the AMD Ryzen Embedded 8000 processor, a state-of-the-art x86 CPU with 8 Zen 4 cores and 16 threads, capable of reaching speeds up to 5.1 GHz. Renowned for its power efficiency, this processor is designed for compute-intensive and graphics-heavy applications, making it an ideal choice for demanding edge computing scenarios. With a guaranteed 10-year availability, AMD Ryzen Embedded CPUs ensure long-term support and sustainability for deployment in industrial applications. On top of that, the Bedrock R8000 incorporates AMD Pro technology, delivering enhanced security and reliability.

“With its advanced dual-layer heatsink design enhancing convective cooling by 1.7x, the Bedrock R8000 stands out as a fanless IPC capable of dissipating significantly more heat than systems of a similar size. This blend of high-performance processing power and superior thermal management makes it an ideal solution for edge computing in harsh or remote environments.” Andrew Whitehouse, Managing Director at Things Embedded

Remarkable Fanless Cooling with Adjustable CPU Power from 8-54W

Built from the ground up to handle the high-performance AMD Ryzen Embedded 8000 processors, the Bedrock R8000 achieves unmatched cooling efficiency even under heavy workloads with it’s advanced engineering for both convection and conduction cooling. The CPU is thermally coupled to the aluminium chassis using liquid metal TIM, dramatically reducing thermal resistance for optimal heat transfer. Stacked copper heat pipes evenly distribute heat to all side of the IPC chassis, allowing the innovative dual-layer heatsink design to maximise convective heat transfer.

For convective cooling, the aluminium air-ducts onboard the fanless IPC stimulate natural airflow through the chimney effect and an additional layer of conventional cooling ribs. Together, these elements enable the Bedrock R8000 to dissipate over three times the thermal energy of fanless PCs of a similar size. To integrate the fanless IPC within sealed enclosures lacking adequate airflow, the ribbed chassis walls can be substituted with flat walls featuring blind threadings, allowing secure attachment to a cold plate. This low-profile, compact design, achieved with the Bedrock Tile chassis, streamlines installation in tight, space-constrained environments while maintaining exceptional performance across an extended operating temperatures of -40ºC to 85ºC.

Harnessing Over 100 TOPS with AMD Ryzen NPU and Hailo AI Accelerators

Setting a new benchmark for generative AI and AI inferencing at the edge, the fanless IPC features an integrated Ryzen AI NPU, delivering 16 TOPS of AI performance, and its full processing power scales up to an impressive 39 TOPS. What sets the Bedrock R8000 apart from it’s competitors is its support for integrating additional AI accelerators such as the Hailo-8. The Hailo-8 achieves 26 TOPS, making it ideal for high-efficiency AI inferencing workloads, while the newly introduced Hailo-10 is tailored for generative AI applications, offering a remarkable 40 TOPS of performance. With capacity for up to three AI accelerators, the Bedrock R8000 can deliver a combined AI performance of over 100 TOPS, ensuring it can tackle the most demanding AI tasks at the edge. Learn more about the benefits of Hailo-8 for Edge AI.

Rock Solid Reliability Featuring Next-Generation Technology

For flexible field usability, the Bedrock R8000 offers an impressive array of I/O, storage, and networking options. Its modular design offers several configurations, supporting either 4 displays and 2 GbE ports or 4 GbE ports and 2 displays. The fanless IPC can be equipped with up to 96 GB of DDR5 ECC memory, three NVMe Gen4 2280 slots, or up to three Hailo AI accelerators. Connectivity options include WiFi 6E, a 5G modem with dual SIM support, USB4 supporting 40 Gbps bandwidth, four USB 3.2 ports, and a console port. DC power is supplied via a screw-locking terminal block, supporting a wide voltage range of 12V to 60V and featuring dual-stage regulation for enhanced stability. Despite its robust capabilities, all these features are seamlessly integrated into a compact, fanless chassis with a volume of less than 1 liter.

Block diagram highlighting the system flexibility for configuring the Bedrock R8000 from SolidRun.