Things Embedded are an official Diamond Systems UK distributor and can supply the EPSM-10GX fully configured.
The EPSM-10GX is a managed Ethernet switch module in an ultra-compact 2.2″ x 3.3″ (55 x 84mm) size offering 24 10/100/1000Mbps copper ports + 2 10Gbps SFI ports. The core Ethernet switching technology is almost fully encapsulated on the module; for many applications, only the “last inch” of magnetics and I/O connectors is required to complete the circuit, enabling easy development of custom form factor compact, rugged Ethernet switch solutions.
The small size, based on the industry-standard COM Express Mini form factor, makes EPSM-10GX a perfect choice for use as a building block for creating custom Ethernet switch solutions in a variety of space-demanding applications, such as drones, ground and underwater vehicles, and robots.
Two software packages are available, Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision time protocol support is available with a minor modification to support an external precision clock circuit and 1pps signal source provided by the carrier board. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port.
Two cooling accessory options are available: A heat sink provides convection cooling in a low profile, while a heat spreader provides improved conduction cooling for superior high temperature performance in applications where physical contact with the system enclosure is available.
Two high-speed fine-pitch connectors provide all power and data communications between the module and the carrier board. The first connector provides power, 9 10/100/1000 ports, the serial interface, and a serial LED data stream. Applications requiring 9 ports or less may use just this connector. The second connector contains 3 more 10/100/1000 ports, QSGMII signals for an additional 12-port PHY to provide 12 additional 10/100/1000 ports, and the 2 10G SFI ports.
EPSM-10GX is designed to meet the challenges of vehicle environments with its 50% thicker PCB, -40/+85°C operating temperature range, and MIL-STD-202G shock/vibration resistance.
Embedded Software
Two software packages are available for EPSM-10GX, Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision time protocol support is available with a minor modification to support an external precision clock circuit and 1pps signal source provided by the carrier board. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port.
The table below shows some of the more popular features available.
Layer 2+ software highlights include the following:
Layer3 software additional highlights:
Cooling Options
Both heat sink and heat spreader cooling options are available. The heat spreader is the preferred choice for applications where the packaging design permits its use. It includes an integrated thermal pad for improved contact with the enclosure wall. For customer’s designing their own cooling solutions, Diamond can provide 3D files and other design support.
Development Support
A design guide is available with circuit details and other technical information necessary to design a carrier board around the EPSM-10GX. A complete development kit is also available including the technical design package (schematics, PCB layout, and BOM) of our EPS-24G4X carrier board, along with a complete EPS-24G4X switch and cable kit. Contact Diamond Systems for further information and ordering instructions.
Custom Carrier Board Design
Diamond Systems engages in the design and manufacturing of of custom carrier boards for various computing technologies, including COM Express, Nvidia Jetson GPU modules, and Ethernet switch modules. Contact us to learn more about how we can provide a cost-effective, low-risk, quick time to market solution for your Ethernet switch project using the EPSM-10GX switch module and a custom carrier board that fits your exact needs.
| Overview | |
|---|---|
| Brand & Model | Diamond Systems EPSM-10GX-L3 |
| Rugged COM Express Mini 26 Port Managed Layer 3 Ethernet Switch Module | |
| Number of Ports | 24 10/100/1000Mbps Ethernet ports with non-blocking wire-speed performance |
| 2 10G SFI ports for fiber or copper transceivers | |
| Magnetics and 10G transceivers required on carrier board | |
| Implementation | 12 PHYs integrated on main board; QSGMII signals for additional 12-port PHY on carrier board |
| On-board Memory | 4MB packet memory |
| Network Management | SNMP v1/v2c/v3; Web GUI and command line interface (CLI) |
| Power Management | ActiPHY and PerfectReach power management reduce power for shorter cable lengths and shut down power to disconnected ports |
| Serial Port | 1 serial port for host interface; RS-232 transceiver required on carrier board |
| Indicator lights | Serial data stream provided for 2 LEDs per port; decoder logic required on carrier board |
| Form Factor | 55x84mm / 2.17×3.31” (Same as COM Express Type 10) |
| Interconnect | Dual Samtec ERF5 series connectors, 120 pins each, 10mm board to board spacing |
| Input voltage | 5VDC +/-5% |
| Power consumption | 20W max, all ports active |
| Operating temperature | -40 to +85°C with DSC-provided heat sink or heat spreader |
| Cooling | Heat sink, 55x84mm, 16.6mm height |
| Heat spreader, 55x104mm, 7.6mm height | |
| Weight | 85G / 3.0 oz |
| Rohs | Compliant |
Tell us about your application and a member of the team will get right back to you.