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Diamond Systems GEODE

Modular Rugged Mission Computer with MIL-STD-461/704/1275

Linux
Windows IoT / Professional
Dual Display Support
USB3
2 M2 Expansion
2 mPCIe Expansion
4G LTE Cellular
WiFi
NVMe SSD
Fanless
Extended Temperature
CE
FCC

Things Embedded are an official Diamond Systems UK distributor and can supply the GEODE fully configured and imaged.

Manufacturer:

Diamond Systems

Key Features

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The GEODE rugged modular mission computer system platform offers easy customization and quick availability for rugged computers due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O, plus the use of COM Express modules to support flexible CPU choices. The COM is thermally coupled to the top surface of the enclosure with a conduction cooling heat spreader and mounting plate. (Heat spreader removed for illustration purposes, normally present in the open rectangle in the mounting plate.

With Diamond Systems’ GEODE you can add up to 3 I/O boards in the system without requiring any change to the enclosure or cabling. The elimination of custom enclosure and cabling design effort dramatically reduces up-front costs and delivery times, and the resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs. The entire system is housed in a rugged 3-part enclosure that eliminates all T joints and includes seals at all joints to ensure IP67 compliance.

A MIL-grade rugged power supply with MIL-STD-461, -704, and -1275 compatibility and wide input range is available with both isolated and non-isolated output configurations. As a cost and weight reduction alternative, a MIL-STD-461 filter circuit can be built right into the connector board, eliminating the separate power supply. Both the processor and power supply are direct-coupled to the enclosure for efficient conduction cooling.

Internal cables are a leading cost, leadtime, and size driver for rugged systems, as well as usually the most failure-prone element in the design. With Geode, most I/O connectors are mounted on a circuit board that plugs directly into the main computer board and eliminates most internal cables. This design reduces cost, reduces failure, reduces size, increases ruggedness, and simplifies assembly. Attachment points are provided for optional dust caps for all connectors. The rightmost connector is on a breakaway portion of the circuit board and can be removed to support smaller systems that have lesser I/O requirements. One front panel I/O connector is reserved for cable connection to allow flexibility and support high speed interfaces such as USB 3.0, high speed graphics, and 10G Ethernet. The default system configuration provides USB 3.0 in this position.

Mass storage is provided by an M.2 2242/2280 size solid-state disk module with capacity up to 2TB. Additional storage can be provided with an add-on drive using the built-in SATA connector. I/O expansion is readily accomplished with the use of PCIe / USB minicards as well as PCIe/104 I/O modules. The PCIe/104 socket supports up to 4 x1 links and 1 x16 link, depending on the installed COM. A Core i7 or lower performance COM will typically support 3-4 PCIe x1 links. A Xeon or higher COM will typically support the x1 links as well as the x16 link.

Specification

Overview
Brand & Model Diamond Systems GEODE
Modular Rugged Mission Computer with MIL-STD-461/704/1275
Features Embedded
Expandable
Fanless
Industrial
Rugged
Waterproof
Performance
Processor Series 11th Gen Tiger Lake
Processor Models Intel Core i7-1185G7E: 1.8~4.4GHz, 4 Cores, 8 Threads, 12MB Cache, 15W
Intel Core i7-1185GRE: 1.8~4.4GHz, 4 Cores, 8 Threads, 12MB Cache, 15W
Memory 2x DDR4 3200MHz SO-DIMM Slots, 64GB
Operating System Linux
Windows 10
Graphics
Multi Display Support Dual Display Support
Display Outputs 2x HDMI
2x LVDS
I/O
Ethernet 2x Ethernet Ports
2 x GbE LAN [Board]
LAN Controllers Intel I210
USB 4x USB Ports
2 x USB 2.0 [Board]
2 x USB 3.1 Gen 1 [Board]
Serial 4x Serial Ports
4 x RS232/422/485 [Board]
GPIO GPIO [4-in, 4-out]
Expansion
M.2 2x M.2 Expansion Slots
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x4/SATA] [2280]
mPCIe 2x mPCIe Slots
2 x mPCIe [SATA/USB/PCIe]
Wireless Connectivity Optional 4G Modem
Optional 5G Modem
Optional WiFi/Bluetooth
Storage
Storage 1x M.2 SSD
2x mSATA
NVMe NVMe SSD Support
Power
Power Input 12V DC
18-36V DC [Terminal Block]
Environmental Conditions
Thermal Dissipation Fanless Passively Cooled Chassis
Operating Temperature -40°C to 85°C [-40°F to 185°F]
Storage Temperature -40°C to 85°C [-40°F to 185°F]
Humidity 5% - 95% (Non-condensing)
Ingress Protection IP67
IP67 [Dustproof, Protection against immersion in water up to 1 meter for 30 minutes]
Certification CE
FCC

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