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DFI IRN556-TN-x7211RE Intel Amston Lake Atom x7211RE 3.5″ Embedded Board with 9 to 36 V DC Input and -40 to 85 °C

The IRN556-TN-x7211RE is the low-power wide-temperature build in the DFI IRN556 series, a dual-core 6 W Intel Atom x7211RE rated from -40 to 85 °C with four COM ports and dual GbE. It suits serial-to-Ethernet gateways, remote telemetry units and data loggers in sealed outdoor enclosures.

  • Dual-Core Intel Atom x7211RE: Two Amston Lake cores from 1.0 to 3.2 GHz within a 6 W TDP, keeping heat low in sealed enclosures.
  • -40 to 85 °C Operation: Extended temperature for remote cabinets, pump stations and roadside units, cooled by a fanless passive heatsink.
  • Four COM Ports and DIO: Two RS-232/422/485 and two RS-232 headers plus 8-bit DIO bring meters, sensors and alarms onto one board.
  • Dual GbE on Intel I210IT: Two Gigabit Ethernet ports separate the local device network from the backhaul link.
  • Cellular-Ready Wide DC Input: An M.2 B-key socket with nano SIM takes a cellular modem, and 9 to 36 V DC suits site supplies.
View IRN556 Series
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Dual Display SupportDual Display Support
USB Generation: USB3USB3
M.2: 33x M.2
SIM Slots: 11x SIM
Connectivity: 4G4G
Connectivity: WirelessWi-Fi
 NVMe: NVMe SSD SupportNVMe SSD
Operating Temperature: Extended TemperatureExtended Temp
Operating Temperature: Wide Temperature [-40 to 85°C]Wide Temp
Certification: CECE
Certification: FCCFCC
UK Support Team: +44 (0)1785 558 300 Call
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  • Overview
  • Specifications
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IRN556-TN-x7211RE Overview

A remote telemetry unit on a pump station or roadside cabinet usually has one job: read serial instruments, buffer the data and send it home over cellular. It needs ports and a wide temperature rating more than processing. The IRN556-TN-x7211RE is the 6 W Amston Lake option in the IRN556 series, a 3.5″ embedded board with four COM ports, rated from -40 to 85 °C.

The Intel Atom x7211RE is a dual-core Amston Lake processor running from 1.0 to 3.2 GHz within a 6 W TDP. Two cores cover Modbus polling, protocol conversion and a local web interface, and the low TDP leaves thermal margin at 85 °C. One DDR5 4800 MHz SO-DIMM slot takes up to 16 GB. A discrete TPM 2.0 helps protect credentials on unattended sites, and the programmable 1 to 255 s watchdog can reset the board after a software hang.

Two RS-232/422/485 and two RS-232 ports sit on internal headers with 8-bit DIO for alarm and status signals, plus two USB 2.0 ports. The rear carries two GbE ports on Intel I210IT controllers, four USB 3.2 Gen 2 Type-A ports and HDMI, with dual-channel LVDS for a local panel. The M.2 B-key 3052 socket with nano SIM takes a cellular modem, the E-key socket takes Wi-Fi and the M-key 2242 socket a PCIe or SATA SSD.

The IRN556-TN-x7211RE runs fanless on 9 to 36 V DC through a 4-pin connector, with CE, FCC, UKCA and RoHS compliance. For a local HMI on the same rating, the IRN556-TN-x7433RE offers four cores at 9 W. For an indoor cabinet at the same 6 W, the IRN556-BN-N150 doubles the core count to four, rated from -5 to 65 °C.

IRN556-TN-x7211RE Specifications

Overview
Brand & ModelDFI IRN556-TN-x7211RE
FeaturesEmbedded
Fanless
Industrial
Performance
Processor SeriesIntel Atom X Series Amston Lake
Processor ModelsIntel Atom x7211RE: Up to 3.2GHz, 2 Cores, 2 Threads, 6MB Cache, 6W
Performance Cores2 Cores
Memory1x DDR5 4800MHz SO-DIMM, 16GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Windows 11
Graphics
Integrated GPUIntel UHD Series
Display StandardsDual Channel LVDS
Multi Display SupportDual Display Support
Display Outputs1x HDMI
1x LVDS
Audio
InterfaceLine-Out
Mic-In
I/O
Ethernet2x Ethernet Ports
2x GbE LAN [RJ45]
LAN ControllersIntel I210IT
USB6x USB Ports
2x USB 2.0 [Board]
4x USB 3.2 Gen 2 [Type A]
Serial4x Serial Ports
2x RS232 [Board]
2x RS232/422/485 [Board]
Digital I/ODIO [8-lines]
Expansion
M.23x M.2 Expansion Slots
1x M.2 B-Key [PCIe x1/USB/SIM] [3052]
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x2 Gen3/SATA] [2242]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional 4G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
NVMeNVMe SSD Support
Power
Power Input9-36V DC [4-Pin]
Environmental Conditions
Operating Temperature-40°C to 85°C [-40°F to 185°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 90% (Non-condensing)
CertificationCE
FCC
RoHS
UKCA
Mechanical Properties
Dimensions146mm x 102mm (5.75" x 4.02")

Official DFI UK Distributor

Things Embedded is an official DFI UK distributor, supplying the IRN556-TN-x7211RE configured with memory, M.2 storage, wireless and your OS image, fitted with its cooling and tested before it ships. If your software is already qualified on Intel Elkhart Lake, the EHL556 is the Elkhart Lake alternative in the DFI range. We can advise on I/O cabling, wireless modules and thermal design for the enclosure it goes into.

For alternatives, browse our Amston Lake products and wide temperature boards and systems, or compare Linux single board computers.

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