UK AMD Ryzen AI 300
Ryzen AI 9 HX 370 Computers for Edge AI
AMD Ryzen AI 300 puts a 50 TOPS XDNA 2 neural processing unit beside twelve Zen 5 CPU cores and Radeon 890M graphics, so heavier vision and AI models run on the processor without a separate accelerator. The range covers fanless edge AI computers on the Ryzen AI 9 HX 370.
Options include up to 128 GB DDR5, CPU power set from 8 to 54 W in the BIOS, compact tile and 60 W fanless builds and M.2 slots for Hailo modules, suited to machine vision, robotics, retail analytics and multi-camera inspection.
Speak to an AMD Ryzen AI 300 specialist to match the processor, the I/O and the enclosure to your application.
Browse Our Ryzen AI 9 HX 370 Computers
Or choose a range below.
- CPU: AMD Ryzen AI 300 Series Krackan Point
- GPU / AI Accelerator: AMD Ryzen AI NPU
- AI Performance: 50 TOPS
- Memory: 2x DDR5 5600MHz SO-DIMM Slot, 96GB
- OS: Linux, Windows 11
- Display Outputs: 2x HDMI, 2x USB Type C
- Ethernet: 1x 2.5 GbE LAN [RJ45], 1x GbE LAN [RJ45]
- USB: 1x USB 3.2 Gen 2 [Type A], 2x USB 2.0 [Board], 2x USB 3.2 Gen 1 [Type A], 2x USB 4 [Type C]
- M.2: 1x M.2 E-Key [PCIe x1 Gen4/USB 2.0] [2230], 1x M.2 M-Key [PCIe x4 Gen4] [2242/2280], 1x M.2 M-Key [PCIe x4 Gen4] [2242]
- Storage: 2x M.2 SSD
- Power: 12-24V DC [Barrel Connector]
- Temp: 0°C to 70°C [32°F to 158°F]
- Certification: CE, FCC
- CPU: AMD Ryzen AI 300 Series Krackan Point
- GPU / AI Accelerator: AMD Ryzen AI NPU
- AI Performance: 50 TOPS
- Memory: 2x DDR5 5600MHz SO-DIMM Slot, 96GB
- OS: Linux, Windows 11
- Display Outputs: 2x HDMI, 2x USB Type C
- Ethernet: 1x 2.5 GbE LAN [RJ45], 1x GbE LAN [RJ45]
- USB: 1x USB 3.2 Gen 2 [Type A], 2x USB 3.2 Gen 1 [Type A], 2x USB 4 [Type C]
- M.2: 1x M.2 E-Key [PCIe x1 Gen4/USB 2.0] [2230], 1x M.2 M-Key [PCIe x4 Gen4] [2242/2280], 1x M.2 M-Key [PCIe x4 Gen4] [2242]
- Storage: 2x M.2 SSD
- Power: 12-24V DC [Barrel Connector], AC Power Supply Included
- Temp: 0°C to 40°C [32°F to 104°F]
- Certification: CE, FCC
- Mounting Options: VESA Mount
- CPU: AMD Ryzen AI 300 Series Strix Point
- GPU / AI Accelerator: Hailo-10 AI Accelerator, AMD Ryzen AI NPU, Hailo-8 AI Accelerator
- AI Performance: 26–50 TOPS
- Memory: 2x DDR5 5600MHz SO-DIMM Slot, 128GB
- OS: Linux, Windows 11
- Display Outputs: 4x Display Ports, 4x HDMI
- Ethernet: 4x 2.5 GbE LAN [RJ45]
- USB: 1x USB 2.0 [Mini USB], 1x USB 4 [Type C], 3x USB 3.2 Gen 2 [Type A]
- M.2: 1x M.2 B-Key [PCIe x1/USB/SIM] [3042/3052], 3x M.2 M-Key [PCIe x4] [2280]
- Storage: 3x M.2 SSD
- Power: 12-60V DC Input [Terminal Block]
- Temp: -40°C to 85°C [-40°F to 185°F]
- Mounting Options: Desktop, DIN Mount, VESA Mount, Wall Mount
All AMDBack to the full rangeAMD Ryzen AI 300 Ranges Configured by Things Embedded
We work with the leading manufacturers of AMD edge AI computers, so the ranges below are the ones we specify on this generation. Compare them by size, I/O and cooling, then browse the products above or ask a specialist which range suits your application.
Bedrock RAI300 SolidRun Edge AI Computers
Ryzen AI 9 HX 370 computers with twelve Zen 5 cores and a 50 TOPS NPU, in compact tile and 60 W fanless builds.
Not sure which range fits? Tell us the application and we will recommend the right model.
What to Specify in a Ryzen AI 9 HX 370 System
Our edge AI specialists specify every system on this generation against the workload, the enclosure and the years it has to stay in production. These are the choices we work through with you before recommending a range.
Processor and NPU
Twelve Zen 5 cores with a 50 TOPS XDNA 2 NPU on the Ryzen AI 9 HX 370.
Extra Acceleration
M.2 slots for Hailo modules when the model or the camera count needs more.
Memory
Up to 128 GB DDR5 for larger models.
Cooling
Compact tile and 60 W fanless chassis.
Power Tuning
CPU power set from 8 to 54 W in the BIOS to match the enclosure.
Power Input
Wide DC input for cabinets, vehicles and sites without a regulated supply.
Ryzen AI 300 Innovation & Edge Inference Insights
Speak to an AMD Ryzen AI 300 Specialist.
Tell us where the system will be installed, the approvals it must meet and the interfaces you need to connect. We will recommend the right form factor, then configure, image and test it before it ships.