Skip to main content
Loading...

Diamond Systems GEODE Intel Core i7-1185GRE Modular Rugged Mission Computer with IP67 and 9-60 V DC MIL Power

The GEODE is a modular mission computer from Diamond Systems, built on a COM Express 11th Gen Intel Core i7 module and Diamond's Jasper carrier. A direct-mount connector board removes most internal cables and leaves room for up to 110 extra I/O signals, all in an IP67 enclosure designed to MIL-STD-810H.

  • Up to 110 Expansion I/O Signals: Up to three I/O boards add as many as 110 signals without changes to the enclosure or cabling, through PCIe/104 and minicard modules.
  • COM Express 11th Gen Intel Core i7: The base model uses an 11th Gen Core i7 such as the i7-1185GRE with up to 64 GB of RAM on Diamond's Jasper carrier.
  • Direct-Mount Connector Board: Most I/O connectors sit on a board that plugs straight into the Jasper SBC, removing most internal cables and their failure points.
  • Sealed IP67 Three-Part Enclosure: A three-part enclosure with no T joints and seals at every joint targets IP67 and MIL-STD-810H shock and vibration.
  • MIL-STD Power, -40 to +80 °C: The optional JMM-7500 supply accepts 9-60 V DC with MIL-STD-461/704/1275 compliance, and the system operates from -40 to +80 °C.
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Dual Display SupportDual Display Support
USB Generation: USB3USB3
M.2: 22x M.2
mPCIe: 22x mPCIe
Connectivity: 4G4G
Connectivity: 5G5G
Connectivity: WirelessWi-Fi
 NVMe: NVMe SSD SupportNVMe SSD
Thermal Dissipation: FanlessFanless
Operating Temperature: Extended TemperatureExtended Temp
Operating Temperature: Wide Temperature [-40 to 85°C]Wide Temp
Certification: CECE
Certification: FCCFCC
UK Support Team: +44 (0)1785 558 300 Call
Select section
  • Overview
  • Specifications
  • Downloads

GEODE Overview

Rugged programmes often need a handful of extra signals that a standard mission computer does not offer, and adding them usually means a new enclosure, new cables and a long lead time. The Diamond Systems GEODE is a mission computer designed to avoid that. Its I/O connectors sit on a board that plugs directly into Diamond’s Jasper carrier board, which removes most internal cables, and pre-integrated expansion connectors take up to 110 additional I/O signals without any change to the enclosure.

Compute comes from a COM Express Type 6 module, so the processor can be changed later without mechanical changes. The base GEODE uses an 11th Gen Intel Core i7, with the i7-1185GRE as the default in Diamond’s configuration worksheet, and up to 64 GB of RAM. The COM is thermally coupled to the top of the enclosure through a conduction cooling heat spreader. Storage is an M.2 2242 or 2280 SSD up to 2 TB, with a SATA connector for an add-on drive, and the operating system is Windows 10 or Ubuntu Linux.

Standard I/O on the GEODE covers HDMI, two Gigabit Ethernet ports, three USB 3.0 and two USB 2.0 ports and four RS-232/422/485 ports. HDMI and USB 3.0 use high-speed rugged circular connectors, and the remaining I/O uses MIL-DTL-38999 connectors. Expansion runs through two minicard sockets and a PCIe/104 socket with up to four x1 links and one x16 link, depending on the COM, and the Jasper data acquisition option adds 16 analog inputs, four analog outputs and 22 GPIO with autocalibration.

The GEODE is housed in a three-part enclosure that eliminates T joints and seals every joint for IP67, and it is rated to MIL-STD-810H shock and vibration. Diamond’s optional JMM-7500 supply accepts 9-60 V DC with MIL-STD-461, MIL-STD-704 and MIL-STD-1275 compliance, and a MIL-STD-461 filter on the connector board suits applications where filtering alone is enough. The system operates from -40 to +80 °C. For NVIDIA AI in the same enclosure family, see the GEODE-OSB.

GEODE Specifications

Overview
Brand & ModelDiamond Systems GEODE
FeaturesEmbedded
Expandable
Fanless
Rugged
Waterproof
Performance
Processor SeriesIntel Core 11th Gen Tiger Lake
Processor ModelsIntel Core i7-1185G7E: 1.8~4.4GHz, 4 Cores, 8 Threads, 12MB Cache, 15W
Intel Core i7-1185GRE: 1.8~4.4GHz, 4 Cores, 8 Threads, 12MB Cache, 15W
Performance Cores4 Cores
Memory2x DDR4 3200MHz SO-DIMM Slots, 64GB
Operating SystemLinux
Windows 10
Graphics
Multi Display SupportDual Display Support
Display Outputs2x HDMI
2x LVDS
I/O
Ethernet2x Ethernet Ports
2x GbE LAN [MIL-STD]
LAN ControllersIntel I210
USB5x USB Ports
3x USB 3.0 [MIL-STD]
2x USB 2.0 [MIL-STD]
Serial4x Serial Ports
4x RS232/422/485 [MIL-STD]
GPIOGPIO [4-in, 4-out]
Expansion
M.22x M.2 Expansion Slots
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x4/SATA] [2280]
mPCIe2x mPCIe Slots
2x mPCIe [SATA/USB/PCIe]
Wireless ConnectivityOptional 4G Modem
Optional 5G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
2x mSATA
NVMeNVMe SSD Support
Power
Power Input12V DC
18-36V DC [MIL-STD]
Environmental Conditions
Thermal DissipationFanless Passively Cooled Chassis
Operating Temperature-40°C to 85°C [-40°F to 185°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 95% (Non-condensing)
Ingress ProtectionIP67
IP67 [Dustproof, Protection against immersion in water up to 1 meter for 30 minutes]
CertificationCE
FCC

Official Diamond Systems UK Distributor

Things Embedded is an official Diamond Systems UK distributor, supplying the GEODE with the processor, memory, storage, power option and expansion I/O defined for each programme. The GEODE-OSB carries the Geode design over to NVIDIA Jetson AGX Orin for sealed AI, and the SABRECOM-JSP offers COM Express Intel Core i7 and Xeon W options with three expansion connector positions. Both share Diamond's rugged connector and sealing methods, and the Geode family has passed MIL-STD-810H testing, which gives a programme a documented starting point for its own qualification work.

Across our range, the GEODE sits with our rugged mission computers and our IP67 sealed computers, where sealed circular connectors and room for programme-specific I/O matter most. Its isolated supply and -40 to +80 °C rating also place it among our in-vehicle computers for vehicles and unheated equipment bays. Programmes with unusual I/O lists can often stay on the standard enclosure, because up to 110 extra signals fit through the pre-integrated expansion connectors.

Consult. Design. Integrate.

Things Embedded is a leading UK supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.