Nexcom X304-Q670W Mini-ITX Motherboard for 12th/13th Gen Intel Core with LVDS and Wide-Range DC Input

Vision, edge and test systems need recent Core processors and fast networking in an enclosure sized for Mini-ITX. The X304-Q670W is the Q670E build in the Nexcom X304 series: a Mini-ITX motherboard with an LGA1700 socket for 12th and 13th Gen Intel Core processors up to 35 W, three HDMI outputs, LVDS and a 12 to 24 V DC input.

Nexcom lists the 35 W T-series parts, from the four-core i3-12100TE and i3-13100TE to the 16-core i9-12900TE and 24-core i9-13900TE, all with Intel UHD Graphics 770. Two 262-pin SO-DIMM sockets run in dual channel and take up to 64 GB of non-ECC memory. Three HDMI 2.0 outputs each run at up to 4096 x 2160 at 60 Hz, and an internal dual-channel LVDS connector drives a panel at up to 1920 x 1200 at 60 Hz, with eDP selected by jumper.

I/O covers one 2.5GbE port on an Intel i226-V and one Gigabit Ethernet port on an Intel i219-LM with wake on LAN, four USB 3.2 on the edge and four USB 2.0 internally, one RS-232/422/485 and one RS-232 port with two more ports by request, 4-in/4-out TTL GPIO, Realtek ALC888S audio, a watchdog timer and an onboard TPM 2.0, with Intel AMT on the Q670E. Storage is an M.2 2280 Key M socket with PCIe x4 and SATA signals plus a SATA port, and expansion is an M.2 2230 Key E socket for Wi-Fi and Bluetooth and an M.2 3052 Key B socket for LTE or 5G. The X304-H610 is the H610E build on 12 V DC without LVDS.

Power arrives on an ATX 4-pin connector at 12 V DC or across a 12 to 24 V DC wide range. The X304-Q670W operates from 0 to 60 °C, stores from -20 to 80 °C and handles humidity up to 95%, non-condensing. The board measures 170 x 170 mm in the standard Mini-ITX size, Windows 10 64-bit, Windows 11 and Linux are supported, and it carries CE approval under EN 55032/EN 55035 and an FCC Class A mark under Part 15B.