DFI ARS103-H810 Intel LGA 1851 Core Ultra 200S Thin Mini-ITX Motherboard with H810 Chipset, Dual 2.5GbE and 12 to 28 V DC Input

An operator panel on a packaging machine or a line-side HMI usually takes its power from the machine’s 24 V DC rail and needs a clear display and a few serial links rather than remote management. The ARS103-H810 is the H810 build in the DFI ARS103 series of Thin Mini-ITX SBCs, and it puts a socketed Intel Core Ultra 200S board on that supply through a 12 to 28 V DC input.

The LGA 1851 socket takes the same eight Arrow Lake-S processors as the other builds, from the 10-core Core Ultra 5 225T at 35 W, a good fit for a sealed panel, to the 24-core Core Ultra 9 285 at 65 W. Two DDR5 SO-DIMMs support up to 96 GB in dual channel. Integrated Intel graphics drives HDMI 1.4b and DP++ outputs at 4K, and DFI’s optional M2A module on the M.2 A-key adds an eDP or LVDS connection for a built-in touch panel.

Two 2.5GbE ports on Intel I226-V connect the machine network and a plant uplink. Three USB 3.2 Gen 1 and three USB 2.0 Type-A ports sit at the rear with two USB 2.0 headers inside, and two RS-232/422/485 headers and 8-bit DIO link drives, PLCs and indicator lamps. A PCIe x16 slot accepts an I/O or graphics card, the M.2 M-key takes an SSD at PCIe x1 or SATA, the B-key a cellular module with Nano SIM and the E-key Wi-Fi, with two SATA 3.0 ports for further drives.

The ARS103-H810 runs from -5 to 65 °C with CE, FCC, UKCA and RoHS compliance, on a barrel jack or 4-pin connector. ARS103-Q870 adds Intel AMT, USB-C display and NVMe at PCIe Gen4 x4, and ARS103-W880 adds ECC memory support and a sixth USB 3.2 Gen 2 port.