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DFI GH551 3.5" AMD Ryzen Embedded SBCs with up to Four DP++ and Triple GbE

The DFI GH551 series is a family of 3.5 inch SBCs on AMD Ryzen Embedded V1000, R1000 and R2000 processors, with one DDR4-2400 SO-DIMM for up to 16 GB, up to four DP++ outputs or three plus LVDS, three GbE ports and a 12 V DC input. The series suits multi-screen signage, HMI and gateway designs, with -30 to 80 °C builds for harsher sites.

  • AMD Ryzen Embedded: V1000, R1000 and R2000 processors from dual-core to eight-thread, with DDR4-2400 up to 16 GB.
  • Up to Four Displays: Up to four DP++ outputs at up to 4096 x 2160, or three DP++ plus LVDS for a built-in panel.
  • Three GbE Ports: Three GbE ports keep up to three networks on separate interfaces.
  • M.2, Mini PCIe and SIM: An M.2 M key for a SATA or PCIe SSD, a full-size Mini PCIe socket and an optional Nano SIM slot.
  • 12 V DC, Two Ranges: Single 12 V DC input, with -5 to 65 °C and -30 to 80 °C builds and a matched heatsink.
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UK Support Team: +44 (0)1785 558 300

GH551 Description

Signage walls, operator desks and gateways often need several screens and several networks from a board small enough to hide behind a display. The DFI GH551 series is built for that brief: a family of 3.5 inch SBCs on AMD Ryzen Embedded processors with up to four DP++ outputs, three GbE ports and a single 12 V DC input.

Every GH551 shares one layout. One DDR4-2400 SO-DIMM socket takes up to 16 GB in single channel, with ECC or non-ECC modules, and AMD Radeon Vega Graphics drives DP++ outputs at up to 4096 x 2160 at 60 Hz and an LVDS connector at up to 1920 x 1200 on the builds that use it. Three GbE ports on Realtek RTL8111HN/RTL8119I controllers, two USB 3.1 Gen 2 and one USB 2.0 sit on the rear, with an RS-232/422/485 port, 8-bit DIO, SATA 3.0 and Realtek ALC888S audio inside. Expansion is a full-size Mini PCIe socket, an M.2 2280/2242 M key for a SATA or PCIe SSD and an optional Nano SIM slot.

The -5 to 65 °C builds cover the range: the GH551-BC1-R1505G (two DP++ plus LVDS), the GH551-BC1-R1606G (three DP++), the GH551-BC1-R2312 (dual-core R2000, two DP++ plus LVDS), the GH551-BC1-R2314 (quad-core R2314, three DP++ plus LVDS), the GH551-BC1-R2514 (eight-thread R2514, four displays), the GH551-BC1-V1202B (three DP++ plus LVDS) and the GH551-BC1-V1605B (eight-thread, four DP++). The -30 to 80 °C builds are the GH551-EC1-R1606G with three DP++, the GH551-EC1-V1404I with four DP++ and the GH551-EC1-V1605B with four DP++.

Power is a single 12 V DC input on a 4-pin right-angle connector, with a DC jack or vertical 4-pin connector on request; DFI quotes 16.2 W typical and 28.44 W maximum for the V1605B. Each build ships with a heatsink sized to its temperature range, 35.0 mm for -5 to 65 °C and 44.9 mm for -30 to 80 °C, and storage is rated -40 to 85 °C. Firmware TPM 2.0 is standard with discrete TPM 2.0 as an option. The boards measure 146 x 102 mm, support Windows 10 IoT Enterprise (64-bit) and Linux, carry CE and FCC Class B marks and are RoHS compliant.

GH551 Specifications

Overview
Brand & ModelDFI GH551
FeaturesCompact
Embedded
Fanless
Industrial
Performance
Processor SeriesSee Variant Specifications
Processor ModelsSee Variant Specifications
Performance CoresSee Variant Specifications
Memory1x DDR4 3200MHz SO-DIMM Slot, 16GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Windows 10
Graphics
Integrated GPUAMD Radeon Series
Multi Display SupportTriple Display Support
Display OutputsSee Variant Specifications
Audio
InterfaceLine-Out
Mic-In
I/O
Ethernet3x Ethernet Ports
3x GbE LAN [RJ45]
USB4x USB Ports
1x USB 2.0 [Board]
1x USB 2.0 [Type A]
2x USB 3.1 Gen 1 [Type A]
Serial1x Serial Ports
1x RS232/422/485 [Board]
Digital I/ODIO [8-lines]
Expansion
M.21x M.2 Expansion Slots
1x M.2 M-Key [PCIe x4] [2242/2280]
mPCIe1x mPCIe Slots
1x mPCIe [PCIe/USB]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional 4G Modem
Optional 5G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
1x SATA Port
NVMeNVMe SSD Support
Power
Power Input12V DC [4-Pin]
Environmental Conditions
Thermal DissipationOptional Heat Spreader
Optional Heatsink
Operating TemperatureSee Variant Specifications
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity10-90% (Non-condensing)
CertificationCE
FCC
RoHS
Mechanical Properties
Weight0.2 Kg (0.44 Lbs)
Dimensions146mm x 102mm (5.75" x 4.02")

GH551 Variants

Overview
Brand & ModelDFI GH551-BC1-R2312
Performance
Processor SeriesR-Series, R2000
Processor ModelsR2312
Performance Cores2
Graphics
Display Outputs1x LVDS, 2x Display Port
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Overview
Brand & ModelDFI GH551-BC1-R2314
Performance
Processor SeriesR-Series, R2000
Processor ModelsR2314
Performance Cores4
Graphics
Display Outputs1x LVDS, 3x Display Port
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Overview
Brand & ModelDFI GH551-BC1-R2514
Performance
Processor SeriesR-Series, R2000
Processor ModelsR2514
Performance Cores4
Graphics
Display Outputs4x Display Ports
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Overview
Brand & ModelDFI GH551-EC1-R1606G
Performance
Processor SeriesR-Series
Processor ModelsR1606G
Performance Cores2
Graphics
Display Outputs3x Display Port
Environmental Conditions
Operating Temperature-30°C to 80°C [-22°F to 176°F], Extended Temperature
Overview
Brand & ModelDFI GH551-EC1-V1605B
Performance
Processor SeriesV-Series
Processor ModelsV1605B
Performance Cores4
Graphics
Display Outputs4x Display Ports
Environmental Conditions
Operating Temperature-30°C to 80°C [-22°F to 176°F], Extended Temperature
Overview
Brand & ModelDFI GH551-BC1-R1505G
Performance
Processor SeriesR-Series
Processor ModelsR1505G
Performance Cores2
Graphics
Display Outputs1x LVDS, 2x Display Port
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Overview
Brand & ModelDFI GH551-BC1-R1606G
Performance
Processor SeriesR-Series
Processor ModelsR1606G
Performance Cores2
Graphics
Display Outputs3x Display Port
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Overview
Brand & ModelDFI GH551-EC1-V1404I
Performance
Processor SeriesV-Series
Processor ModelsV1404I
Performance Cores4
Graphics
Display Outputs4x Display Ports
Environmental Conditions
Operating Temperature-30°C to 80°C [-22°F to 176°F], Extended Temperature
Overview
Brand & ModelDFI GH551-BC1-V1202B
Performance
Processor SeriesV-Series
Processor ModelsV1202B
Performance Cores2
Graphics
Display Outputs1x LVDS, 3x Display Port
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Overview
Brand & ModelDFI GH551-BC1-V1605B
Performance
Processor SeriesV-Series
Processor ModelsV1605B
Performance Cores4
Graphics
Display Outputs4x Display Ports
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]

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Official DFI UK Distributor

Things Embedded is an official DFI UK distributor, supplying the GH551 series configured for UK signage, HMI and gateway projects. Within the DFI range the EHL556 is a 3.5 inch Intel Elkhart Lake board rated -40 to 85 °C, and the PCSF51 puts an R2000 processor on a 1.8 inch board.

The GH551 series sits among our AMD Ryzen SBCs, our 3.5 inch SBCs and our AMD Ryzen Embedded computers. Where a compact board has to drive up to four screens and three networks, this is the DFI series to specify.

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