DFI GH551-EC1-V1605B 3.5″ SBC with AMD Ryzen Embedded V1605B, Quad 4K DP++ and -30 to 80 °C

Four-screen signage outdoors has to cope with the temperature swings of a sealed cabinet in sun and frost. The GH551-EC1-V1605B is the V1605B build in the DFI GH551 series: a 3.5 inch SBC with three GbE ports, four DP++ outputs and a single 12 V DC input, rated -30 to 80 °C.

The AMD Ryzen Embedded V1605B is a quad-core, eight-thread processor at 2.0 GHz base and 3.6 GHz boost at 15 W, which suits video, signage and multi-screen software. One DDR4-2400 SO-DIMM socket takes up to 16 GB in single channel, with ECC or non-ECC modules. AMD Radeon Vega Graphics drives four DP++ outputs for four displays; DP++ runs at up to 4096 x 2160 at 60 Hz.

The rear edge carries three GbE ports on Realtek RTL8111HN/RTL8119I controllers, two USB 3.1 Gen 2 ports and one USB 2.0. Internal headers add one RS-232/422/485 port with RS-485 auto flow control, one USB 2.0, 8-bit DIO, one SATA 3.0 port and Realtek ALC888S audio with a 2 x 3 W speaker-out. Expansion is a full-size Mini PCIe socket, an M.2 2280/2242 M key for a SATA or PCIe SSD and an optional Nano SIM slot. The GH551-BC1-V1605B is the same V1605B build rated -5 to 65 °C, and the GH551-EC1-V1404I is the V1404I build with the same -30 to 80 °C rating.

Power is a single 12 V DC input on a 4-pin right-angle connector, with a DC jack or vertical 4-pin connector on request. DFI quotes 16.2 W typical and 28.44 W maximum for the V1605B. The GH551-EC1-V1605B operates from -30 to 80 °C and ships with a 44.9 mm heatsink, with a heat spreader as an option. Firmware TPM 2.0 is standard, with discrete TPM 2.0 as an option. The board measures 146 x 102 mm, supports Windows 10 IoT Enterprise (64-bit) and Linux, carries CE and FCC Class B marks and is RoHS compliant.