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Diamond Systems OSBOURNE : OSB-BB01 NVIDIA Jetson AGX Orin Rugged Carrier Board with 10GbE, Supplied Without Module

The OSB-BB01 is the Diamond Systems Osbourne rugged carrier board for the NVIDIA Jetson AGX Orin, supplied without a module. Diamond designs it for industrial, airborne and rugged military use, with 10GbE, four 4-lane CSI-2 camera inputs, a PCIe x8 slot and all I/O on one board-edge connector.

  • For Jetson AGX Orin 32GB and 64GB: Carrier board only, supplied without a module; it takes the AGX Orin 32GB and 64GB at up to 275 TOPS.
  • 10GbE and GbE Networking: One 1G/2.5G/5G/10G multi-gigabit port plus a 10/100/1000 port through Diamond’s RGMII adapter, for high-bandwidth camera links.
  • One High-Density I/O Connector: All I/O leaves through one board-edge connector, so a panel board, breakout board or MIL-DTL-38999 connector board sets the interface.
  • Camera Socket and PCIe x8 Slot: A camera adapter socket for 4x 4-lane or 8x 2-lane CSI-2 and a PCIe x16 connector wired for x8 add-in cards.
  • Industrial to Airborne Use: Diamond positions the board for industrial, airborne and rugged military use, rated -25 to +80 °C on a 7-20 V DC input.
Operating Software: LinuxLinux
Ethernet Speed: 10GbE10GbE
USB Generation: USB3USB3
M.2: 22x M.2
mPCIe: 22x mPCIe
Connectivity: 4G4G
Connectivity: WirelessWi-Fi
 NVMe: NVMe SSD SupportNVMe SSD
Thermal Dissipation: FanlessFanless
Operating Temperature: Extended TemperatureExtended Temp
Certification: CECE
Certification: FCCFCC
UK Support Team: +44 (0)1785 558 300 Call
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OSB-BB01 Overview

AGX Orin designs differ most at the connector panel: a lab rig wants commercial connectors, while an airborne or military system usually needs circular connectors. The OSB-BB01 is the Diamond Systems Osbourne rugged carrier board for the NVIDIA Jetson AGX Orin, supplied without a module, with every interface routed to a single high-density connector along one edge. Diamond designs it for applications from commercial and industrial to airborne and rugged military use.

The OSB-BB01 takes the AGX Orin 32GB and 64GB modules, at 200 and 275 TOPS, from 15 W up to 60 W; the 64GB module has a 2048-core Ampere GPU and a 12-core Arm Cortex-A78AE CPU. A 120-pin camera adapter socket, matching the NVIDIA developer kit connector, takes four 4-lane or eight 2-lane CSI-2 cameras, and adapter boards extend it to GMSL and other camera types. A PCIe x16 connector wired for x8 accepts a standard add-in card, and it shares lanes with one minicard socket through a jumper.

The OSB-BB01 has one 1G/2.5G/5G/10G multi-gigabit Ethernet port and a 10/100/1000 port through Diamond’s ACC-ETHRGM1 RGMII adapter, three USB 3.2 and four USB 2.0 ports, HDMI 2.0a/b and audio. Serial runs to two software-configurable RS-232/422/485 ports, one with a TTL option, and two fixed RS-232 ports, with two CAN 2.0 ports and eight digital I/O lines. Storage and expansion cover an M.2 M-key 2280 or 2242 NVMe socket on four PCIe Gen 3 lanes, an M.2 E-key 2230 socket for Wi-Fi, two full-size minicard sockets with PCIe and USB, and microSD.

The OSB-BB01 takes 7-20 V DC and is rated from -25 to +80 °C, the same range as the AGX Orin module. Diamond offers OSB-PNL01 and OSB-PNL02 commercial I/O adapters for panel mounting, and shows an example connector board with MIL-DTL-38999 connectors for a rugged system. The OSB-BB01 has no on-board Ethernet magnetics or panel connectors of its own, so a panel or breakout board completes a working system. Diamond builds this carrier into the fanless JETBOX-OSBOURNE edge AI computers and the sealed IP67 Geode-OSB. Diamond provides a Linux image based on NVIDIA L4T as a free download.

OSB-BB01 Specifications

Overview
Brand & ModelDiamond Systems OSBOURNE : OSB-BB01
FeaturesCompact
Embedded
GPU
Industrial
Rugged
Performance
AI Performance200–275 TOPS
System-on-ModuleNVIDIA Jetson AGX Orin 32GB: 200 TOPS, 1792-core Ampere GPU with 56 Tensor Cores, 8-core Arm Cortex-A78AE 2.2GHz, 32GB 256-bit LPDDR5, 64GB eMMC, 15-40W
NVIDIA Jetson AGX Orin 64GB: 275 TOPS, 2048-core Ampere GPU with 64 Tensor Cores, 12-core Arm Cortex-A78AE 2.2GHz, 64GB 256-bit LPDDR5, 64GB eMMC, 15-60W
Operating SystemLinux
Graphics
Display Outputs1x HDMI
I/O
Ethernet2x Ethernet Ports
1x 10 GbE LAN [RJ45]
1x GbE LAN [RJ45]
USB4x USB Ports
4x USB 3.2 Gen 1 [Type A]
Serial4x Serial Ports
2x RS232 [RJ11]
2x RS232/422/485 [DB9]
CANbus2x CANbus Ports
2x CANbus [RJ11]
Digital I/ODIO [8-lines]
Expansion
M.22x M.2 Expansion Slots
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x4] [2280]
mPCIe2x mPCIe Slots
2x mPCIe [PCIe/USB]
Wireless ConnectivityOptional 4G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
64GB eMMC
NVMeNVMe SSD Support
Power
Power Input7-20V DC
Environmental Conditions
Thermal DissipationOptional Heatsink
Operating Temperature-25°C to 80°C [-13°F to 176°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
CertificationCE
FCC
Mechanical Properties
Dimensions120mm x 115mm (4.72" x 4.53")

Official Diamond Systems UK Distributor

Things Embedded is an official Diamond Systems UK distributor, and the OSB-BB01 is the Osbourne carrier for AGX Orin, supplied without a module. The JetBox Osbourne is the enclosed Osbourne computer, Geode-OSB is the sealed IP67 build, and the JACKSON carrier covers Orin NX and Orin Nano.

The OSB-BB01 sits with our Jetson AGX Orin carrier boards and the wider Jetson Orin carrier boards range.

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