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Diamond Systems JASPER : JSP-1185G7E-64G-02D COM Express SBC with 11th Gen Intel Core i7-1185G7E, 64 GB and Digital I/O

The JSP-1185G7E-64G-02D is the digital I/O SBC build in the Diamond Systems JASPER series, a COM Express SBC that pairs an 11th Gen Intel Core i7 module with 64 GB of RAM and a rugged 3.5 inch carrier. It suits long-life rugged systems that need Core i7 performance and plenty of I/O.

  • 11th Gen Core i7 Module: Intel Core i7-1185G7E on a COM Express Type 6 module with 64 GB of RAM, replaceable later without a redesign.
  • Rich Carrier I/O: Two Gigabit Ethernet, three USB 3.1, two USB 2.0 and four RS-232/422/485 ports, plus two HDMI and dual-channel LVDS.
  • PCIe/104 and MiniCard: PCIe/104 Type 1 socket with x1 and x16 links, two PCIe MiniCard sockets and an M.2 Key E socket.
  • Bottom-Mounted COM: COM and heat spreader mount underneath inside a mounting plate, conducting heat directly into the enclosure.
  • Rugged Carrier Design: Positive-latching connectors in one front-edge row, a plug-in I/O connector board option and -40 to 85 °C operation depending on the COM.
View JASPER Series
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Dual Display SupportDual Display Support
USB Generation: USB3USB3
M.2: 22x M.2
mPCIe: 22x mPCIe
Connectivity: 4G4G
Connectivity: 5G5G
Connectivity: WirelessWi-Fi
 NVMe: NVMe SSD SupportNVMe SSD
Operating Temperature: Extended TemperatureExtended Temp
Operating Temperature: Wide Temperature [-40 to 85°C]Wide Temp
Certification: CECE
Certification: FCCFCC
UK Support Team: +44 (0)1785 558 300 Call
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JSP-1185G7E-64G-02D Overview

Rugged systems that must stay in service for years face a redesign whenever the processor on a conventional SBC reaches end of life. The JSP-1185G7E-64G-02D is the digital I/O SBC build in the Diamond Systems JASPER series: a COM Express SBC that pairs an 11th Gen Intel Core i7 COM Express Type 6 module with a rugged carrier, so the module can be swapped later while the rest of the system stays the same.

The installed module carries an 11th Gen Intel Core i7-1185G7E with 64 GB of RAM, which suits demanding control, data processing and multi-application software. Graphics drive two HDMI outputs, dual-channel 24-bit LVDS and VGA. The COM mounts on the underside of the carrier with its heat spreader facing the enclosure, framed by an integrated mounting plate, so heat passes straight into the chassis rather than into the air inside it.

The carrier provides two Gigabit Ethernet ports (one on an Intel I210), three USB 3.1 and two USB 2.0 ports, four RS-232/422/485 ports, HD audio and four general-purpose inputs and four outputs at 3.3 V, with the digital I/O features of the D build. Storage is an M.2 socket for NVMe or SATA plus a 7-pin SATA connector. Expansion covers two PCIe MiniCard sockets with PCIe, SATA and USB, an M.2 Key E socket for Wi-Fi and networking modules and a PCIe/104 Type 1 socket with x1 and x16 links, where the x16 link depends on the installed COM. The JSP-1185G7E-64G-03A adds the full analogue data acquisition circuit, and the JSP-BB02D is this carrier without a module.

Input is 18 to 36 V DC. Operation is rated -40 to 85 °C depending on the installed COM, with the carrier components rated or tested for that range. Positive-latching connectors in a single row along the front edge resist shock and vibration, and the single row also allows a plug-in I/O connector board in place of cables. The JSP-1185G7E-64G-02D uses the 3.5 inch form factor. Windows and Linux are supported as standard, with other operating systems on request.

JSP-1185G7E-64G-02D Specifications

Overview
Brand & ModelDiamond Systems JASPER : JSP-1185G7E-64G-02D
FeaturesCompact
Embedded
Fanless
Industrial
Rugged
Performance
Processor SeriesIntel Core 11th Gen Tiger Lake
Processor ModelsIntel Core i7-1185G7E: 1.8~4.4GHz, 4 Cores, 8 Threads, 12MB Cache, 15W
Intel Core i7-1185GRE: 1.8~4.4GHz, 4 Cores, 8 Threads, 12MB Cache, 15W
Performance Cores4 Cores
Memory2x DDR4 3200MHz SO-DIMM Slots, 64GB
Operating SystemLinux
Windows 10
Graphics
Multi Display SupportDual Display Support
Display Outputs2x HDMI
2x LVDS
I/O
Ethernet2x Ethernet Ports
2x GbE LAN [Board]
LAN ControllersIntel I210
USB4x USB Ports
2x USB 2.0 [Board]
2x USB 3.1 Gen 1 [Board]
Serial4x Serial Ports
4x RS232/422/485 [Board]
GPIOGPIO [4-in, 4-out]
Expansion
M.22x M.2 Expansion Slots
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x4/SATA] [2280]
mPCIe2x mPCIe Slots
2x mPCIe [SATA/USB/PCIe]
Wireless ConnectivityOptional 4G Modem
Optional 5G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
2x mSATA
NVMeNVMe SSD Support
Power
Power Input12V DC
18-36V DC [Terminal Block]
Environmental Conditions
Thermal DissipationOptional Heat Spreader
Optional Heatsink
Operating Temperature-40°C to 85°C [-40°F to 185°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 95% (Non-condensing)
CertificationCE
FCC
Mechanical Properties
Weight0.2 Kg (0.44 Lbs)
Dimensions146mm x 102mm (5.75" x 4.02")

Official Diamond Systems UK Distributor

Things Embedded is an official Diamond Systems UK distributor, supplying the JSP-1185G7E-64G-02D configured for UK rugged vehicle and industrial projects. Within the Diamond Systems range the VNS776KL-4GD is a soldered Core i7 board of the same size, and the GEMINI takes Compact modules on a PCI/104-Express board.

As a COM-based Core i7 board the JSP-1185G7E-64G-02D sits among our 3.5 inch SBCs, our Intel single board computers and our rugged SBCs. Where a long-life rugged system needs Core i7 performance on a replaceable module, with digital I/O and PCIe/104 stacking, this is the model to specify.

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