Diamond Systems JASPER Rugged COM Express Type 6 SBCs and Carrier Boards with Data Acquisition

A conventional SBC ties its lifetime to the processor soldered on it, so an end-of-life notice can force a redesign. The Diamond Systems JASPER series avoids that by splitting the computer in two: a COM Express Type 6 module carries the processor, and a rugged carrier provides the I/O. When a module is discontinued or a faster one is needed, a replacement in the same size fits the same carrier and the rest of the system stays unchanged. Diamond also notes that swapping a COM is easier than replacing a whole SBC when supply is uncertain.

Every JASPER carrier takes Type 6 Basic and Compact modules on its underside, with the COM heat spreader framed by an integrated mounting plate so heat conducts straight into the enclosure. Graphics from the module reach two HDMI outputs, dual-channel 24-bit LVDS and VGA. The fuller builds add two Gigabit Ethernet ports, three USB 3.1 and two USB 2.0 ports, four RS-232/422/485 ports, HD audio, an M.2 socket for NVMe or SATA, two PCIe MiniCard sockets, an M.2 Key E socket and a PCIe/104 Type 1 socket with x1 and x16 links.

The JSP-1185G7E-64G-02D and JSP-1185G7E-64G-03A ship as complete SBCs with an 11th Gen Intel Core i7-1185G7E module and 64 GB of RAM, with digital I/O or full data acquisition respectively. The JSP-BB02D and JSP-BB03A are the same carriers without a module, for a COM of your choice. The JSP-BB01D is the low cost carrier. On A models the data acquisition circuit gives 16 single-ended or 8 differential 16-bit analogue inputs at 250 kHz, four 16-bit analogue outputs, 22 digital I/O lines, eight counter/timers and four PWMs.

Input is 18 to 36 V DC, and operation is rated -40 to 85 °C depending on the installed COM. Positive-latching connectors in a single front-edge row resist shock and vibration, and the single row lets a system builder plug in an I/O connector board with commercial or MIL-DTL-38999 connectors in place of cables. Diamond Systems designed JASPER for applications that require ruggedness, a high level of I/O or extended product lifetime.