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Diamond Systems OSBOURNE-ER

The Diamond Systems OSBOURNE-ER series is a family of rugged Jetson carrier boards for the NVIDIA Jetson AGX Orin, each built as a complete assembly with module and SSD. Latching connectors carry 10GbE and Gigabit Ethernet, four serial ports, two CAN ports and on-board data acquisition, with a heat spreader mounting plate. The OSBOURNE-ER series suits robotics, vehicle, airborne and outdoor vision deployments.

  • NVIDIA Jetson AGX Orin: Every model carries an AGX Orin module, 32GB, 64GB or Industrial 64GB, which NVIDIA rates from 200 to 275 TOPS.
  • Latching Connectors Throughout: All I/O sits on latching connectors, from the 10GbE port and serial lines to CAN, USB and the power input.
  • 10GbE and Gigabit Ethernet: One 1G/2.5G/5G/10G multi-gigabit port for cameras or uplink, plus a separate Gigabit port for a control network.
  • On-Board Data Acquisition: Six 12-bit A/D inputs, two 12-bit D/A outputs and 12 GPIO, alongside two CAN 2.0 ports and eight digital I/O lines.
  • Heat Spreader Mounting Plate: A bottom-mounted heat spreader with embedded thermal pads conduction-cools the assembly into the enclosure and simplifies installation.
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UK Support Team: +44 (0)1785 558 300

OSBOURNE-ER Description

Commercial Jetson carriers with RJ-45 and USB type A connectors work well on the bench, but connectors can work loose once a system meets shock and vibration. The Diamond Systems OSBOURNE-ER series answers that with rugged Jetson carrier boards for the NVIDIA Jetson AGX Orin, designed for applications that need any combination of high performance, wide temperature and shock and vibration resistance, with latching connectors on every interface.

Each OSBOURNE-ER is a two-board design. Diamond’s Osbourne carrier board connects to a latching I/O adapter through a single 150-pin high-speed connector, and both sit on a bottom-mounted heat spreader mounting plate with embedded thermal pads, so the assembly conduction-cools into the enclosure wall. I/O covers one 1G/2.5G/5G/10G multi-gigabit and one Gigabit Ethernet port, three USB 3.2 ports and one USB 2.0 port, HDMI 2.0a/b, audio, two RS-232/422/485 ports and two RS-232 ports, two CAN 2.0 ports and eight digital I/O lines. A data acquisition circuit adds six 12-bit A/D inputs, two 12-bit D/A outputs and 12 GPIO. A camera adapter socket takes four 4-lane or eight 2-lane CSI-2 cameras, including GMSL through adapters, and expansion runs to M.2 NVMe, M.2 E-key and one full-size minicard socket.

The OSBOURNE-ER range has three models, one per AGX Orin module, and each can be ordered with a 1TB or 2TB SSD. The OSB-ER-32G uses the AGX Orin 32GB at up to 200 TOPS for workloads that fit within 32 GB, ordered from Diamond as OSB-ER-32G-1T or OSB-ER-32G-2T. The OSB-ER-64G moves to the AGX Orin 64GB at up to 275 TOPS for larger models and more streams, as OSB-ER-64G-1T or -2T. The OSB-ER-64GXT fits the AGX Orin Industrial 64GB at up to 248 TOPS and widens the rating from -25 to 78 °C to -40 to 83 °C, as OSB-ER-64GXT-1T or -2T.

Every OSBOURNE-ER takes 7-20 V DC on a latching connector and ships with a Linux image based on NVIDIA L4T, with Diamond’s JetPack 6.2 board support package. Typical installations include autonomous vehicles, robots, airborne payloads and outdoor vision systems. Diamond Systems also builds the Osbourne carrier into the fanless JetBox Osbourne and the sealed Geode-OSB, so OSBOURNE-ER sits between the bare carrier and a fully enclosed computer. We supply each model configured, with the module fitted, storage installed, the image loaded and the assembly tested.

OSBOURNE-ER Specifications

Overview
Brand & ModelDiamond Systems OSBOURNE-ER
FeaturesCompact
Embedded
GPU
Industrial
Rugged
Performance
AI PerformanceSee Variant Specifications
MemorySee Variant Specifications
System-on-ModuleSee Variant Specifications
PCIe Gen SupportPCIe 3.0
Operating SystemLinux
Jetpack VersionJetPack 6.2
Graphics
Display StandardsHDMI 2.0
Multi Display SupportSingle Display Support
Display Outputs1x HDMI
Audio
InterfaceLine-Out
Mic-In
I/O
Ethernet2x Ethernet Ports
1x 10 GbE LAN [Board]
1x GbE LAN [Board]
USB4x USB Ports
3x USB 3.2 [Board]
1x USB 2.0 [Board]
Serial4x Serial Ports
2x RS232 [Board]
2x RS232/422/485 [Board]
CANbus2x CANbus Ports
2x CANbus [Board]
Digital I/ODIO [8-lines]
GPIOGPIO [12-lines]
MIPI Interface4x 4 Lane MIPI CSI-2
Data Acquisition
Analog Inputs6x Analog Inputs
6x 12-bit A/D
Analog Outputs2x Analog Outputs
2x 12-bit D/A
Expansion
M.22x M.2 Expansion Slots
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x4] [2242/2280]
mPCIe1x mPCIe Slots
1x mPCIe [PCIe/USB]
Wireless ConnectivityOptional WiFi/Bluetooth
Storage
Storage1x M.2 SSD [M-Key 2242/2280, PCIe Gen 3 x4]
NVMeNVMe SSD Support
Power
Power Input7-20V DC [Latching]
Environmental Conditions
Operating TemperatureSee Variant Specifications
Mechanical Properties
Weight704 g (24.8 oz)
Dimensions165mm x 137mm x 36mm (6.50" x 5.39" x 1.42")

OSBOURNE-ER Variants

Overview
Brand & ModelDiamond Systems OSB-ER-64GXT
Performance
AI Performance248
Memory64GB Soldered On-board
System-on-ModuleAGX Orin Industrial
Environmental Conditions
Operating Temperature-40°C to 85°C [-40°F to 185°F], Extended Temperature, Wide Temperature [-40 to 85°C]
Overview
Brand & ModelDiamond Systems OSB-ER-64G
Performance
AI Performance275
Memory64GB Soldered On-board
System-on-ModuleAGX Orin (64GB)
Environmental Conditions
Operating TemperatureExtended Temperature, -25°C to 78°C [-13°F to 172°F]
Overview
Brand & ModelDiamond Systems OSB-ER-32G
Performance
AI Performance200
Memory32GB Soldered On-board
System-on-ModuleAGX Orin (32GB)
Environmental Conditions
Operating TemperatureExtended Temperature, -25°C to 78°C [-13°F to 172°F]

Official Diamond Systems UK Distributor

Things Embedded is an official Diamond Systems UK distributor, supplying the OSBOURNE-ER series configured for UK defence, vehicle and robotics projects. The OSB-BB01 is the Osbourne carrier on its own, the JetBox Osbourne is the fanless enclosed computer and the Geode-OSB is the sealed IP67 build. For Orin NX and Orin Nano the JACKSON-ER applies the same latching approach on a smaller board.

The OSBOURNE-ER series sits among our Jetson AGX Orin carrier boards, the wider Jetson Orin carrier boards range and our NVIDIA Jetson carrier boards. Where a rugged design needs AGX Orin compute with latching I/O and data acquisition on one assembly, this is the Diamond Systems series to specify.

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