NVIDIA Jetson AGX Orin NVIDIA Jetson AGX Orin Modules with up to 275 TOPS and 64GB LPDDR5

Buyers who reach a Jetson AGX Orin module page usually know the part they need: a carrier board or system has been designed around it, and the question is supply for production, replacement or a long programme. The NVIDIA Jetson AGX Orin series is the 699-pin Jetson module family with the most compute and I/O in the Orin generation, and NVIDIA positions it at up to 8x the performance of AGX Xavier in the same form factor.

Every Jetson AGX Orin module combines an NVIDIA Ampere GPU with Tensor Cores, Arm Cortex-A78AE CPU clusters at up to 2.2 GHz, two NVDLA 2.0 deep learning accelerators and 256-bit LPDDR5 at 204.8 GB/s, with 64 GB of eMMC 5.1 on the module. The connector carries 16 MIPI CSI-2 lanes (D-PHY 2.1 or C-PHY 2.0), PCIe Gen4 as two x8, one x4 and two x1 links, 3x USB 3.2 Gen2, 1x 10GbE and 1x GbE, so a carrier board can serve multi-camera and high-bandwidth designs from one module. An integrated thermal transfer plate with heatpipe gives the carrier a defined cooling interface.

The range has two commercial modules. The Jetson AGX Orin 32GB Module has an 8-core CPU, a 1792-core GPU with 56 Tensor Cores and 32 GB of memory for up to 200 TOPS at 15 W to 40 W. The Jetson AGX Orin 64GB Module moves to 12 CPU cores, a 2048-core GPU with 64 Tensor Cores and 64 GB for up to 275 TOPS at 15 W up to 60 W, with 2x 4K60 H.265 encode. Both use the same connector, so a Jetson AGX Orin carrier can usually host either.

Jetson AGX Orin modules are typically found in autonomous mobile robots, multi-camera inspection, transport analytics and generative AI at the edge. The module is rated from -25 to 80 °C at the thermal transfer plate, with a 5 V or 7 to 20 V input and a five-year 24×7 operating lifetime in the NVIDIA datasheet. NVIDIA lists the Jetson AGX Orin 32GB and 64GB as available through January 2032 and the AGX Orin Industrial through July 2033, which gives Jetson AGX Orin designs a clear supply window for long programmes.