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ASRock Industrial SBC-370P 3.5″ SBC with Intel Core i7-1265UE, Quad Display and Dual 2.5GbE

The SBC-370P is the Core i7-1265UE build in the ASRock Industrial SBC-370 series, a 3.5 inch SBC with DDR4 to 64 GB, four displays including LVDS or eDP, dual 2.5GbE with vPro and 12 to 36 V DC input. It suits machine vision, HMIs and remotely managed edge systems.

  • Intel Core i7-1265UE: 12th Gen Alder Lake-P processor with two performance and eight efficient cores for vision, analytics and multi-screen HMI software.
  • Quad Display with LVDS: HDMI 2.0b, DP 1.4a, two DP outputs over USB-C and LVDS or eDP drive four screens including a built-in panel.
  • DDR4 to 64 GB and RAID: Two DDR4-3200 SO-DIMMs take 64 GB, and Intel VMD RAID 0/1 pairs the M.2 Key B and Key M drives.
  • Dual 2.5GbE and USB 3.2 Gen2x2: Two 2.5GbE ports on Intel I225 controllers and two USB 3.2 Gen2x2 Type-C ports speed up data transfer.
  • vPro Remote Management: Intel vPro on the LAN1 controller lets IT teams manage and recover the board remotely across distributed sites.
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Quad Display SupportQuad Display Support
Ethernet Speed: 2.5GbE2.5GbE
USB Connector Type: Type CType C
USB Generation: USB3USB3
M.2: 33x M.2
SIM Slots: 11x SIM
Connectivity: WirelessWi-Fi
Storage2 RAID RAID: RAIDRAID
 NVMe: NVMe SSD SupportNVMe SSD
Certification: CECE
Certification: FCCFCC
USA Support Team: +1 407 214 9446 Call
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SBC-370P Overview

Machine vision cells and multi-screen HMIs need Core i7 compute, a built-in panel output and remote management, all on a board small enough for a compact controller. The SBC-370P is the Core i7-1265UE build in the ASRock Industrial SBC-370 series: a 3.5 inch SBC measuring 147 x 102 mm.

The Intel Core i7-1265UE is a 12th Gen Alder Lake-P processor with two performance and eight efficient cores, which suits vision, analytics and multi-screen HMI software. Two 260-pin DDR4-3200 SO-DIMM sockets run in dual channel for up to 64 GB. Intel Iris Xe Graphics drives up to four displays from HDMI 2.0b, DisplayPort 1.4a, two DP 1.4a outputs over USB-C and a shared LVDS or eDP connector. HDMI and DisplayPort reach 4096 x 2160 at 60 Hz, and dual-channel 24-bit LVDS reaches 1920 x 1200, so a built-in panel and external screens run together.

I/O covers two 2.5GbE ports on Intel I225LM (LAN1, with vPro) and I225LM/I225V (LAN2) controllers, two USB 3.2 Gen2x2 Type-C (5 V/3 A) and two USB 3.2 Gen2 at the rear, plus one USB 3.2 Gen2 and two USB 2.0 inside. Three RS-232/422/485 ports and 4 GPI plus 4 GPO connect field devices. Expansion is a PCIe x1 Gen3 slot rated to 10 W, an M.2 Key B with SIM for 4G or 5G, an M.2 Key E 2230 for wireless and an M.2 Key M on PCIe x4 for an SSD, with SATA3 and Intel VMD RAID 0/1. The SBC-370M is the Core i5-1245UE build with vPro, and the SBC-370V is the Core i3-1215UE build.

Power is 12 to 36 V DC on a 4-pin wafer cable or DC jack, with a 12 V-only input as a BOM option and AT and ATX power-on modes. The SBC-370P operates from -20 to 70 °C and can be stored from -40 to 85 °C at 5 to 90% humidity. TPM 2.0 is onboard and a watchdog timer covers 0 to 255 seconds. The board, also called a 3.5 inch motherboard, is 24 mm tall.

SBC-370P Specifications

Overview
Brand & ModelASRock Industrial SBC-370P
FeaturesEmbedded
Fanless
Industrial
Performance
Processor SeriesIntel Core 12th Gen Alder Lake
Processor ModelsIntel Core i7-1265UE: 1.7~4.7GHz, 10 Cores, 12 Threads, 12MB Cache, 15W
Performance Cores10 Cores
Memory2x DDR4 3200MHz SO-DIMM Slots, 64GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Windows 11
Graphics
Integrated GPUIntel Iris Xe Series
Display StandardsDisplay Port 1.4a
Dual Channel LVDS
eDP 1.4b
HDMI 2.0b
Multi Display SupportQuad Display Support
Display Outputs1x Display Port
1x eDP
1x HDMI
1x LVDS
2x USB Type C
Audio
CodecRealtek ALC233, HD Audio
I/O
Ethernet2x Ethernet Ports
2x 2.5 GbE LAN [RJ45]
LAN ControllersIntel I225LM
USB7x USB Ports
1x USB 3.2 Gen 2 [Board]
2x USB 2.0 [Board]
2x USB 3.2 Gen 2 [Type A]
2x USB 3.2 Gen 2 [Type C]
Serial3x Serial Ports
3x RS232/422/485 [Board]
GPIOGPIO [4-in, 4-out]
Remote ManagementIntel AMT
Intel vPro
Expansion
M.23x M.2 Expansion Slots
1x M.2 B-Key [PCIe x2/USB 3.0/SATA] [3042/3052]
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x4] [2242/2260/2280]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
1x SATA Port
NVMeNVMe SSD Support
RAIDRAID 0 (Striping)
RAID 1 (Mirroring)
Power
Power Input12-36V DC Input [Terminal Block]
Power Support ModesAT: PWR on Input
ATX: Press Button to Power
Environmental Conditions
Thermal DissipationOptional Heat Spreader
Optional Heatsink
Operating Temperature0°C to 60°C [32°F to 140°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 90% (Non-condensing)
CertificationCE
FCC
Mechanical Properties
Weight0.2 Kg (0.44 Lbs)
Dimensions147mm x 24mm x 102mm (5.79" x 0.94" x 4.02")

Official ASRock Industrial USA Distributor

Things Embedded is an official ASRock Industrial USA distributor, supplying the SBC-370P configured for USA embedded and industrial projects. Within the ASRock Industrial range the SBC-371 series keeps the same layout with 13th Gen Core UE processors and Intel I226 LAN, and the SBC-372 takes socketed Alder Lake-PS processors up to 45 W with DDR5.

The SBC-370P sits among our 3.5 inch SBCs, our Intel Alder Lake products and our Intel SBCs. Its sister boards share the same I/O, so a design can change processor without changing the enclosure or cabling. Where a 3.5 inch design needs 12th Gen Core i7 compute with vPro and four displays, this is the model to specify.

Consult. Design. Integrate.

Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.