Skip to main content

Nexcom X200 3.5" SBCs with 11th Gen Intel Core and Triple 4K Display

The Nexcom X200 series is a family of 3.5 inch SBCs on 11th Gen Intel Core i3-1115G4E or i5-1145G7E processors at 15 W, with DP++, HDMI 2.0 and eDP for three 4K displays, DDR4 to 32 GB, NVMe on PCIe x4 and two Intel GbE ports, rated -20 to 70 °C on 12 V DC. The series suits multimedia and outdoor designs.

  • 11th Gen Intel Core: Onboard Core i3-1115G4E or i5-1145G7E at a 15 W TDP, with UHD or Iris Xe graphics.
  • Triple 4K Display: DP++, HDMI 2.0 and eDP, each at up to 4K and 60 Hz, for three 4K screens.
  • DDR4 to 32 GB and NVMe: One DDR4 SO-DIMM to 32 GB and an M.2 2280 Key M socket on PCIe x4.
  • Four USB 3.2 and Dual GbE: Four USB 3.2 Gen 2 ports, two Intel GbE ports, two COM ports and onboard TPM 2.0.
  • -20 to 70 °C on 12 V DC: Operates from -20 to 70 °C on a 12 V DC jack in a 146 x 102 mm footprint.
USA Support Team: +1 407 214 9446 Call
Select section
  • Description
  • Compare Variants
  • Downloads
USA Support Team: +1 407 214 9446

X200 Description

Multimedia displays, outdoor terminals and compact machine controllers increasingly want 4K on every screen and 11th Gen Core performance, from a board that fits the 3.5 inch footprint and handles a cold start. The Nexcom X200 series is a 3.5 inch SBC with an onboard 11th Gen Intel Core processor at 15 W, three 4K display outputs and a -20 to 70 °C operating range.

Every X200 shares the same layout. One 260-pin DDR4 non-ECC SO-DIMM socket takes up to 32 GB. DP++ runs at up to 4096 x 2304 at 60 Hz, HDMI 2.0 at up to 4096 x 2160 at 60 Hz and an internal eDP at up to 4096 x 2160 at 60 Hz, so one board drives three 4K screens. I/O covers two Gigabit Ethernet ports on an Intel I219-LM PHY and an Intel I211-AT controller, four USB 3.2 Gen 2 ports on the edge and four USB 2.0 internally, one RS-232/422/485 and one RS-232 port, 3 GPI and 3 GPO, and Realtek ALC888S audio with a 2 W 4 ohm speaker output. Storage is an M.2 2280 Key M socket on PCIe x4 for SSDs up to 512 GB plus a SATA 3 port with power, and an M.2 2230 Key E socket takes a Wi-Fi module. A 12 V 2 A output powers an add-on module, and TPM 2.0 and a watchdog timer are onboard.

The X200-i3 carries the dual-core Intel Core i3-1115G4E at 2.2 GHz base with 6 MB cache and Intel UHD graphics. The X200-i5 carries the Intel Core i5-1145G7E at 1.5 GHz base with 8 MB cache and Intel Iris Xe graphics, and adds Intel vPro support on the I219-LM for remote management. Nexcom lists a Core i7-1185G7E build by request.

Power is 12 V DC through a DC jack, with a 2-pin internal DC input as an option. The series operates from -20 to 70 °C, stores from -20 to 80 °C and handles 10 to 90% humidity, non-condensing. The boards measure 146 x 102 mm, with plain and finned heatsinks offered as accessories. Windows 10 and Linux are supported, and the boards carry CE approval and an FCC Class A mark. Nexcom positions the X200 for multimedia applications and for extended-temperature and outdoor use, where its low power consumption and small footprint suit a sealed enclosure.

X200 Specifications

Overview
Brand & ModelNexcom X200
FeaturesCompact
Embedded
Fanless
Industrial
Performance
Processor SeriesIntel Core 11th Gen Tiger Lake
Processor ModelsSee Variant Specifications
Performance CoresSee Variant Specifications
Memory1x DDR4 3200MHz SO-DIMM Slot, 32GB
Operating SystemLinux
Windows 10
Graphics
Integrated GPUIntel UHD Series
Display StandardseDP 1.4b
Multi Display SupportTriple Display Support
Display Outputs1x Display Port
1x eDP
1x HDMI
Audio
InterfaceLine-In
Line-Out
Mic-In
I/O
Ethernet2x Ethernet Ports
2x GbE LAN [RJ45]
LAN ControllersIntel i211AT
Intel I219LM
USB8x USB Ports
4x USB 2.0 [Board]
4x USB 3.2 Gen 2 [Type A]
Serial2x Serial Ports
1x RS232 [Board]
1x RS232/422/485 [Board]
GPIOGPIO [3-in, 3-out]
Expansion
M.22x M.2 Expansion Slots
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x4] [2280]
Wireless ConnectivityOptional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
1x SATA Port
NVMeNVMe SSD Support
Power
Power Input12V DC [Barrel Connector]
Environmental Conditions
Thermal DissipationOptional Heat Spreader
Optional Heatsink
Operating Temperature-20°C to 70°C [-4°F to 158°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 95% (Non-condensing)
CertificationCE
FCC
Mechanical Properties
Weight0.2 Kg (0.44 Lbs)
Dimensions146mm x 102mm (5.75" x 4.02")

X200 Variants

Overview
Brand & ModelNexcom X200-i5
Performance
Processor Modelsi5-1145G7E
Performance Cores4
I/O
Remote ManagementIntel vPro
Overview
Brand & ModelNexcom X200-i3
Performance
Processor Modelsi3-1115G4E
Performance Cores2

No related media available for this product series.

Official NEXCOM USA Distributor

Things Embedded is an official Nexcom USA distributor, supplying the X200 series configured for USA multimedia and outdoor projects. Within the Nexcom range the V1100 takes 11th Gen Core to an EPIC board with four HDMI outputs and 2.5GbE, and the X314 is the earlier 6th Gen Core board with LVDS.

The X200 series sits among our 3.5 inch SBCs, our wide temperature computers and our Intel single board computers. Where a compact design needs three 4K screens and 11th Gen Core from -20 °C, this is the Nexcom series to specify.

Consult. Design. Integrate.

Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.