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Axiomtek CAPA55R-I51145-H 3.5″ SBC with Intel Core i5-1145G7E, 2.5GbE and 12 to 24 V DC Input

The CAPA55R-I51145-H is the Core i5 heatsink build in the Axiomtek CAPA55R series, a 3.5 inch SBC with an onboard Intel Core i5-1145G7E, two DDR4-3200 SO-DIMMs for up to 64 GB, a 2.5GbE port and three M.2 sockets. It suits HMI, signage and data-processing designs that need more headroom.

  • Intel Core i5-1145G7E: Onboard 11th Gen processor with Intel integrated graphics, fitted with a heatsink for operation from -20 to 60 °C.
  • DDR4-3200 to 64 GB: Two dual-channel DDR4-3200 SO-DIMM sockets for up to 64 GB, which gives room for larger datasets and several applications.
  • 2.5GbE Plus GbE: One 2.5GbE port on an Intel I226 and one Gigabit port on an Intel I219-LM, for a fast uplink and a separate device network.
  • Three M.2 Sockets: M.2 Key M on PCIe x4 for NVMe, M.2 Key B with a SIM connector for cellular, and M.2 Key E.
  • 12 to 24 V DC Input: A DC jack for 12 to 24 V DC with AT auto power on, TPM 2.0 on board and a 65536-level watchdog timer.
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Triple Display SupportTriple Display Support
Ethernet Speed: 2.5GbE2.5GbE
USB Generation: USB3USB3
M.2: 33x M.2
SIM Slots: 11x SIM
Connectivity: 4G4G
Connectivity: 5G5G
Connectivity: WirelessWi-Fi
Operating Temperature: Extended TemperatureExtended Temp
Certification: CECE
Certification: FCCFCC
USA Support Team: +1 407 214 9446 Call
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CAPA55R-I51145-H Overview

An edge design that grows from a simple gateway into data collection or display work needs processor, memory and storage headroom without leaving the 3.5 inch footprint. The CAPA55R-I51145-H is the Core i5 heatsink build in the Axiomtek CAPA55R series: a 3.5 inch SBC with an onboard Intel Core i5-1145G7E, dual-channel memory, a 2.5GbE port and three M.2 sockets, running from a 12 to 24 V DC supply.

The Intel Core i5-1145G7E is an 11th Gen Intel processor, and Axiomtek rates the family at a configurable TDP of up to 28 W. It suits HMI, signage and data-processing designs that need more headroom. Two dual-channel DDR4-3200 SO-DIMM sockets take up to 64 GB. Intel integrated graphics share system memory and drive DisplayPort++, HDMI 1.4 and an 18/24-bit single or dual-channel LVDS header, with eDP available as an option, for triple-view output to a local panel and two external screens.

One 2.5GbE port on an Intel I226 controller and one Gigabit port on an Intel I219-LM give a fast uplink and a separate device network. Three USB 3.2 Gen 2 and four USB 2.0 ports, two RS-232/422/485 ports, SMBus compatible with I2C and 8-channel programmable digital I/O cover peripherals. An M.2 Key M socket on PCIe x4 takes a 2280 NVMe SSD, alongside a SATA-600 port. An M.2 Key B socket (PCIe x1, USB 3.2 Gen 2, USB 2.0) in 3042 or 3050 pairs with a SIM connector for a cellular module, and an M.2 Key E socket takes a 2230 card. Within the series, the CAPA55R-I31115-H carries the Intel Core i3-1115G4E and the CAPA55R-I71185-H carries the Intel Core i7-1185G7E.

Power comes through a DC jack at 12 to 24 V DC, with AT auto power on, which suits 12 V and 24 V cabinet supplies. TPM 2.0 is on board, and a 65536-level watchdog timer can reset a stalled system. This -H version is fitted with a heatsink and operates from -20 to 60 °C at 10 to 95% humidity, non-condensing, while the fan-cooled versions run from 0 to 60 °C. The board measures 146 x 104 mm.

CAPA55R-I51145-H Specifications

Overview
Brand & ModelAxiomtek CAPA55R-I51145-H
FeaturesCompact
Embedded
Fanless
Industrial
Performance
Processor SeriesIntel Core 11th Gen Tiger Lake
Intel Celeron 6000 Series Tiger Lake
Processor ModelsIntel Core i5-1145G7E: 1.5~4.1GHz, 4 Cores, 8 Threads, 8MB Cache, 15W
Performance Cores4 Cores
Memory2x DDR4 3200MHz SO-DIMM Slots, 64GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Graphics
Integrated GPUIntel UHD Series
Display StandardsDisplay Port 1.4a
Dual Channel LVDS
HDMI 1.4b
Multi Display SupportTriple Display Support
Display Outputs1x Display Port
1x HDMI
1x LVDS
Audio
CodecRealtek HD Audio
I/O
Ethernet2x Ethernet Ports
1x 2.5 GbE LAN [RJ45]
1x GbE LAN [RJ45]
LAN ControllersIntel I219LM
Intel I225LM
USB7x USB Ports
3x USB 3.2 Gen 2 [Type A]
4x USB 2.0 [Type A]
Serial2x Serial Ports
2x RS232/422/485 [Board]
Digital I/ODIO [8-lines]
Expansion
M.23x M.2 Expansion Slots
1x M.2 B-Key [USB 3.2/USB/SATA] [3042/3050]
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x4] [2280]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional 4G Modem
Optional 5G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
1x SATA Port
Power
Power Input12-24V DC [Barrel Connector]
Power Support ModesAT: PWR on Input
ATX: Press Button to Power
Environmental Conditions
Thermal DissipationOptional Heatsink
Operating Temperature-20°C to 70°C [-4°F to 158°F]
Humidity10% - 95% (Non-condensing)
CertificationCE
FCC
UKCA
Mechanical Properties
Weight0.15 Kg (0.33 Lbs)
Dimensions146mm x 104mm x 1.6mm (5.75" x 4.09" x 0.06")

Official Axiomtek USA Distributor

Things Embedded is an official Axiomtek USA distributor, supplying the CAPA55R-I51145-H configured for USA edge and automation projects. Within the Axiomtek range the CAPA520 takes a socketed 9th or 8th Gen Intel Core processor for per-project choice, and the CAPA13R uses onboard AMD Ryzen Embedded APUs with quad-view display.

With an onboard Core i5 the CAPA55R-I51145-H sits among our Intel SBCs, our 3.5 inch embedded boards and our industrial motherboards. Where a 3.5 inch design needs 64 GB of memory, NVMe storage and a 2.5GbE uplink, this is the configuration to specify.

Consult. Design. Integrate.

Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.