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DFI ADN553-BN-N50 Intel N50 (Alder Lake-N) 3.5″ Industrial Motherboard with 9 to 36 V DC Input and Triple 2.5GbE

The ADN553-BN-N50 is the entry dual-core build in the DFI ADN553 series, with the 6 W Intel Processor N50, an eDP panel output and triple 2.5GbE. It suits protocol gateways, data loggers and single-screen terminals where low heat matters more than core count.

  • Dual-Core Intel N50: Two Alder Lake-N cores up to 3.4 GHz within a 6 W TDP for gateways, loggers and single-screen terminals.
  • Triple 2.5GbE: Three Intel I226V ports let a small gateway bridge field and plant networks with a separate management port.
  • eDP Panel Output: Internal eDP up to 4096 x 2160 at 60 Hz, with HDMI and USB-C DisplayPort Alt Mode as additional outputs.
  • 4G, 5G and Wi-Fi Sockets: An M.2 B-key socket with SIM slot takes a 4G or 5G modem, and the E-key socket takes Wi-Fi.
  • Wide DC Input, Fanless: 9 to 36 V DC on a 4-pin or barrel connector, passive cooling and -5 to 65 °C operating temperature.
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Triple Display SupportTriple Display Support
Ethernet Speed: 2.5GbE2.5GbE
USB Connector Type: Type CType C
USB Generation: USB3USB3
M.2: 33x M.2
SIM Slots: 11x SIM
Connectivity: 4G4G
Connectivity: 5G5G
Connectivity: WirelessWi-Fi
 NVMe: NVMe SSD SupportNVMe SSD
Certification: CECE
Certification: FCCFCC
USA Support Team: +1 407 214 9446 Call
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  • Overview
  • Specifications
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ADN553-BN-N50 Overview

A protocol gateway or data logger spends most of its life moving small amounts of data between networks, so it rarely needs many cores but often needs several ports and a cellular link. The ADN553-BN-N50 is built for that job: the dual-core entry option in the ADN553 series, a 3.5″ industrial motherboard with three 2.5GbE ports and M.2 sockets for 4G, 5G and Wi-Fi.

The Intel Processor N50 is a dual-core Alder Lake-N part running up to 3.4 GHz within a 6 W TDP. That suits Modbus or MQTT bridging, local buffering and a lightweight web interface, with little heat inside a small enclosure. One DDR5 4800 MHz SO-DIMM slot takes up to 16 GB, and Intel UHD Graphics supports a single-screen terminal or maintenance display. A discrete TPM 2.0 helps protect credentials on remote sites, and the watchdog can reset the board after a software hang.

Three 2.5GbE ports on Intel I226V controllers sit on the rear with two USB 3.2 Gen 2 and one USB 3.2 Gen 1 Type-A port, HDMI and USB-C with DisplayPort Alt Mode. An internal eDP connector supports a panel up to 4096 x 2160 at 60 Hz. Inside are two USB 2.0 headers, one RS-232/422/485 port and 8-bit DIO for field devices, one SATA 3.0 port, and M.2 M-key, B-key with SIM slot and E-key sockets.

The ADN553-BN-N50 runs fanless from -5 to 65 °C on 9 to 36 V DC, with CE, FCC, UKCA, KC and RoHS compliance. For twice the cores at the same 6 W, see the ADN553-BN-N200, which also switches to LVDS. The ADN553-BN-x7211E is the dual-core Atom alternative at 6 W, and for sites that reach -40 °C the Amston Lake ASL553 series is the wide-temperature option.

ADN553-BN-N50 Specifications

Overview
Brand & ModelDFI ADN553-BN-N50
FeaturesEmbedded
Fanless
Industrial
Performance
Processor SeriesIntel Processor N Series Alder Lake
Processor ModelsIntel Processor N50: 1.0~3.4GHz, 2 Cores, 2 Threads, 6MB Cache, 6W
Performance Cores2 Cores
Memory1x DDR5 4800MHz SO-DIMM, 16GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Windows 11
Graphics
Integrated GPUIntel UHD Series
Multi Display SupportTriple Display Support
Display Outputs1x eDP
1x HDMI
1x USB Type C
Audio
InterfaceLine-Out
Mic-In
I/O
Ethernet3x Ethernet Ports
3x 2.5 GbE LAN [RJ45]
LAN ControllersIntel I226V
USB6x USB Ports
1x USB 3.2 [Type C]
1x USB 3.2 Gen 1 [Type A]
2x USB 2.0 [Board]
2x USB 3.2 Gen 2 [Type A]
Serial1x Serial Ports
1x RS232/422/485 [Board]
Digital I/ODIO [8-lines]
Expansion
M.23x M.2 Expansion Slots
1x M.2 B-Key [PCIe x1/USB/SIM] [3042/3052]
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x1/SATA] [2242/2280]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional 4G Modem
Optional 5G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
1x SATA Port
NVMeNVMe SSD Support
Power
Power Input9-36V DC [4-Pin]
9-36V DC [Barrel Connector]
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 90% (Non-condensing)
CertificationCE
FCC
KC
RoHS
UKCA
Mechanical Properties
Dimensions146mm x 102mm (5.75" x 4.02")

Official DFI USA Distributor

Things Embedded is an official DFI USA distributor, supplying the ADN553-BN-N50 configured with memory, M.2 storage, wireless and your OS image, fitted with its cooling and tested before it ships. If your software is already qualified on Intel Elkhart Lake, the EHL556 is the Elkhart Lake alternative in the DFI range. We can advise on I/O cabling, wireless modules and thermal design for the enclosure it goes into.

This board also sits in our Intel N-series products range. See more 3.5" SBCs, or compare embedded boards.

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Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.