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DFI ADN553-BN-x7211E Dual-Core Intel Atom x7211E 3.5″ Industrial Motherboard with 9 to 36 V DC Input and Triple 2.5GbE

The ADN553-BN-x7211E is the lowest-power Atom build in the DFI ADN553 series, a dual-core 6 W Intel Atom x7211E with an eDP panel output and triple 2.5GbE. It suits compact controllers, thin clients and network appliances where heat and power budget come first.

  • Dual-Core Intel Atom x7211E: Two Alder Lake-N cores up to 3.2 GHz within a 6 W TDP keep heat low in sealed or compact enclosures.
  • eDP Panel Output: An internal eDP connector supports panels up to 4096 x 2160 at 60 Hz alongside the HDMI and USB-C display outputs.
  • Triple 2.5GbE: Three Intel I226V 2.5GbE ports let a small controller act as a gateway between separate networks.
  • Serial, DIO and USB: One RS-232/422/485 header, 8-bit digital I/O, three USB 3.2 Type-A ports and two USB 2.0 headers for field devices.
  • Wide DC Input, Fanless: 9 to 36 V DC on a 4-pin or barrel connector, passive heatsink cooling and a -5 to 65 °C operating range.
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Triple Display SupportTriple Display Support
Ethernet Speed: 2.5GbE2.5GbE
USB Connector Type: Type CType C
USB Generation: USB3USB3
M.2: 33x M.2
SIM Slots: 11x SIM
Connectivity: 4G4G
Connectivity: 5G5G
Connectivity: WirelessWi-Fi
 NVMe: NVMe SSD SupportNVMe SSD
Certification: CECE
Certification: FCCFCC
USA Support Team: +1 407 214 9446 Call
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ADN553-BN-x7211E Overview

Not every embedded design needs more processing; many need less heat. A network appliance, protocol converter or thin client in a small sealed housing often has little room for cooling, and a low TDP makes that job easier. The ADN553-BN-x7211E is the 6 W Atom option in the ADN553 series, a 3.5″ industrial motherboard that keeps triple 2.5GbE and the full I/O set of its siblings.

The Intel Atom x7211E is a dual-core Alder Lake-N processor running up to 3.2 GHz. Two cores handle a gateway stack, a thin-client session or a single-screen HMI comfortably, and the 6 W TDP leaves margin in the thermal design. Memory is one DDR5 4800 MHz SO-DIMM slot for up to 16 GB. Intel UHD Graphics decodes HEVC, VP9, AV1 and AVC in hardware, and DFI lists Windows 10 IoT Enterprise, Windows 11 and Linux support.

Displays run from HDMI, USB-C with DisplayPort Alt Mode and an internal eDP connector for panels up to 4096 x 2160 at 60 Hz. Three 2.5GbE ports on Intel I226V controllers sit on the rear with two USB 3.2 Gen 2 and one USB 3.2 Gen 1 port. Internal headers add two USB 2.0 ports, one RS-232/422/485 port and 8-bit DIO, and M.2 M-key, B-key and E-key sockets take an SSD, a 4G or 5G modem and Wi-Fi.

The ADN553-BN-x7211E runs fanless from -5 to 65 °C on 9 to 36 V DC, with CE, FCC, UKCA, KC and RoHS compliance. If your panel is LVDS, the ADN553-BN-x7213E keeps two Atom cores with an LVDS output at 10 W. Where the workload grows, the ADN553-BN-x7425E doubles the core count to four.

ADN553-BN-x7211E Specifications

Overview
Brand & ModelDFI ADN553-BN-x7211E
FeaturesEmbedded
Fanless
Industrial
Performance
Processor SeriesIntel Atom X Series Alder Lake
Processor ModelsIntel Atom x7211E: 1.0~3.2GHz, 2 Cores, 2 Threads, 6MB Cache, 6W
Performance Cores2 Cores
Memory1x DDR5 4800MHz SO-DIMM, 16GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Windows 11
Graphics
Integrated GPUIntel UHD Series
Multi Display SupportTriple Display Support
Display Outputs1x eDP
1x HDMI
1x USB Type C
Audio
InterfaceLine-Out
Mic-In
I/O
Ethernet3x Ethernet Ports
3x 2.5 GbE LAN [RJ45]
LAN ControllersIntel I226V
USB6x USB Ports
1x USB 3.2 [Type C]
1x USB 3.2 Gen 1 [Type A]
2x USB 2.0 [Board]
2x USB 3.2 Gen 2 [Type A]
Serial1x Serial Ports
1x RS232/422/485 [Board]
Digital I/ODIO [8-lines]
Expansion
M.23x M.2 Expansion Slots
1x M.2 B-Key [PCIe x1/USB/SIM] [3042/3052]
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x1/SATA] [2242/2280]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional 4G Modem
Optional 5G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
1x SATA Port
NVMeNVMe SSD Support
Power
Power Input9-36V DC [4-Pin]
9-36V DC [Barrel Connector]
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 90% (Non-condensing)
CertificationCE
FCC
KC
RoHS
UKCA
Mechanical Properties
Dimensions146mm x 102mm (5.75" x 4.02")

Official DFI USA Distributor

Things Embedded is an official DFI USA distributor, supplying the ADN553-BN-x7211E configured with memory, M.2 storage, wireless and your OS image, fitted with its cooling and tested before it ships. For serial-heavy control work, the IRN556 offers four COM ports and dual GbE on a 3.5" board. Our engineers can advise on the operating system image, M.2 modules and the heatsink that suits your enclosure.

This board also sits in our 3.5 inch single board computers range. See more Intel SBCs, or compare Linux SBCs.

Consult. Design. Integrate.

Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.