DFI IRN556 Intel Amston Lake and Twin Lake 3.5" Industrial Motherboards with Dual GbE and 9 to 36 V DC Input

Serial devices have not gone away. Barcode scanners, weighing heads, meters, PLCs and legacy instruments still connect over RS-232 or RS-485, and a board with a single COM port often means adding a converter. The DFI IRN556 series puts four on a 146 x 102 mm board: two RS-232/422/485 and two RS-232 ports, with 8-bit DIO alongside. These 3.5″ industrial motherboards pair that serial count with dual GbE, an LVDS panel output and wide-range DC input.

Every IRN556 board takes one DDR5 4800 MHz SO-DIMM for up to 16 GB and uses Intel UHD Graphics with hardware decode of HEVC, VP9, AV1 and AVC. A discrete TPM 2.0, a programmable 1 to 255 s watchdog and Realtek ALC888S audio with a 5 W speaker output are on board, and DFI lists support for Windows 11, Windows 10 IoT Enterprise and Linux.

The range splits by temperature. Three Amston Lake builds are rated from -40 to 85 °C: the IRN556-TN-x7211RE with two cores at 6 W, the IRN556-TN-x7433RE with four cores at 9 W and the IRN556-TN-x7835RE with eight cores at 12 W. Two Twin Lake builds run from -5 to 65 °C for indoor cabinets: the IRN556-BN-N150 with four cores at 6 W and the IRN556-BN-N355, an eight-core Intel Core 3 N355 at 15 W and the highest-clocked board in the series.

Rear I/O includes two GbE ports on Intel I210IT controllers, four USB 3.2 Gen 2 Type-A ports and HDMI up to 4096 x 2160, with a dual-channel 24-bit LVDS connector for a panel up to 1920 x 1200 at 60 Hz. Internal headers carry the four COM ports, 8-bit DIO and two USB 2.0 ports. Three M.2 sockets handle storage and wireless: an M-key 2242 socket for a PCIe Gen3 x2 or SATA SSD, a B-key 3052 socket with nano SIM for a cellular modem, and an E-key 2230 socket for Wi-Fi.

Power comes in at 9 to 36 V DC on a 4-pin connector, and every board runs fanless on a passive heatsink. With CE, FCC, UKCA and RoHS compliance, the IRN556 series suits machine retrofits, weighing and packaging lines, transport equipment and energy sites where serial instruments meet Ethernet networks. Because every variant shares the same layout, one enclosure and cable set can typically serve both the indoor and the wide-temperature builds.