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DFI IRN556-BN-N355 Intel Core 3 N355 3.5″ SBC with 9 to 36 V DC Input and Dual GbE

The IRN556-BN-N355 is the eight-core Twin Lake build in the DFI IRN556 series, an Intel Core 3 N355 at 15 W with four COM ports and dual GbE, rated from -5 to 65 °C. It suits indoor machine controllers, packaging lines and test stations that need the most compute in the range.

  • Eight-Core Intel Core 3 N355: Eight Twin Lake cores from 1.8 to 3.9 GHz within a 15 W TDP, the highest clock in the IRN556 series.
  • Four COM Ports and DIO: Two RS-232/422/485 and two RS-232 headers plus 8-bit DIO connect PLCs, scanners, printers and test instruments.
  • HDMI and LVDS: HDMI up to 4096 x 2160 and dual-channel 24-bit LVDS up to 1920 x 1200 for a dual-display operator station.
  • Dual GbE and Four USB 3.2: Two Intel I210IT GbE ports and four USB 3.2 Gen 2 Type-A ports on the rear.
  • Standard Temperature, Fanless: Rated from -5 to 65 °C for indoor cabinets, with passive heatsink cooling and 9 to 36 V DC input.
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Dual Display SupportDual Display Support
USB Generation: USB3USB3
M.2: 33x M.2
SIM Slots: 11x SIM
Connectivity: 4G4G
Connectivity: WirelessWi-Fi
 NVMe: NVMe SSD SupportNVMe SSD
Certification: CECE
Certification: FCCFCC
USA Support Team: +1 407 214 9446 Call
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  • Overview
  • Specifications
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IRN556-BN-N355 Overview

Test stations and packaging lines often run a vision check, a database and an operator interface on the same controller, while still talking to scales, printers and PLCs over serial. The IRN556-BN-N355 gives that mix eight cores. It is the top compute option in the IRN556 series, a 3.5″ SBC for indoor cabinets rated from -5 to 65 °C.

The Intel Core 3 N355 is an eight-core Twin Lake processor running from 1.8 to 3.9 GHz within a 15 W TDP, the highest clock in the series. It suits heavier HMI software, local databases and camera processing alongside serial polling. One DDR5 4800 MHz SO-DIMM slot takes up to 16 GB, and Intel UHD Graphics decodes HEVC, VP9, AV1 and AVC and encodes HEVC, VP9 and AVC in hardware. A discrete TPM 2.0 and a programmable watchdog are on board.

Four COM ports, two RS-232/422/485 and two RS-232, sit on internal headers with 8-bit DIO and two USB 2.0 ports. The rear carries two GbE ports on Intel I210IT controllers, four USB 3.2 Gen 2 Type-A ports for cameras and peripherals, and HDMI up to 4096 x 2160, with dual-channel LVDS for the operator panel. M.2 sockets take a PCIe Gen3 x2 or SATA SSD, a cellular modem with nano SIM and Wi-Fi.

The IRN556-BN-N355 runs fanless on 9 to 36 V DC through a 4-pin connector, with CE, FCC, UKCA and RoHS compliance. If the cabinet is unheated or outdoors, the IRN556-TN-x7835RE keeps eight cores with a -40 to 85 °C rating. For a lighter indoor workload, the IRN556-BN-N150 runs four cores at 6 W.

IRN556-BN-N355 Specifications

Overview
Brand & ModelDFI IRN556-BN-N355
FeaturesEmbedded
Fanless
Industrial
Performance
Processor SeriesIntel Processor N Series Twin Lake
Processor ModelsIntel Core 3 N355: 1.8~3.9GHz, 8 Cores, 8 Threads, 6MB Cache, 15W
Performance Cores8 Cores
Memory1x DDR5 4800MHz SO-DIMM, 16GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Windows 11
Graphics
Integrated GPUIntel UHD Series
Display StandardsDual Channel LVDS
Multi Display SupportDual Display Support
Display Outputs1x HDMI
1x LVDS
Audio
InterfaceLine-Out
Mic-In
I/O
Ethernet2x Ethernet Ports
2x GbE LAN [RJ45]
LAN ControllersIntel I210IT
USB6x USB Ports
2x USB 2.0 [Board]
4x USB 3.2 Gen 2 [Type A]
Serial4x Serial Ports
2x RS232 [Board]
2x RS232/422/485 [Board]
Digital I/ODIO [8-lines]
Expansion
M.23x M.2 Expansion Slots
1x M.2 B-Key [PCIe x1/USB/SIM] [3052]
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x2 Gen3/SATA] [2242]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional 4G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
NVMeNVMe SSD Support
Power
Power Input9-36V DC [4-Pin]
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 90% (Non-condensing)
CertificationCE
FCC
RoHS
UKCA
Mechanical Properties
Dimensions146mm x 102mm (5.75" x 4.02")

Official DFI USA Distributor

Things Embedded is an official DFI USA distributor, supplying the IRN556-BN-N355 configured with memory, M.2 storage, wireless and your OS image, fitted with its cooling and tested before it ships. For an Intel Core option, the WL551 is built on Intel Whiskey Lake processors. We can help size memory and storage, choose cellular or Wi-Fi modules and plan the panel cabling.

See the wider range of Intel Processor N boards and systems, compare our 3.5" SBCs, or browse x86 single board computers.

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Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

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