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DFI IRN556-TN-x7433RE Quad-Core Intel Atom x7433RE 3.5″ Industrial Motherboard with 9 to 36 V DC Input and -40 to 85 °C

The IRN556-TN-x7433RE is the quad-core wide-temperature build in the DFI IRN556 series, an Intel Atom x7433RE at 9 W rated from -40 to 85 °C with four COM ports and dual GbE. It suits outdoor HMIs, transport equipment and machine controllers that combine a panel with serial instruments.

  • Quad-Core Intel Atom x7433RE: Four Amston Lake cores from 1.5 to 3.4 GHz within a 9 W TDP for HMI and control software together.
  • -40 to 85 °C Operation: Extended temperature for outdoor kiosks, vehicle equipment and unheated plant rooms, cooled by a passive heatsink.
  • HDMI and LVDS: Dual-channel 24-bit LVDS up to 1920 x 1200 for the operator panel, with HDMI for a second display.
  • Four COM Ports and DIO: Two RS-232/422/485 and two RS-232 headers plus 8-bit DIO connect scanners, scales, PLCs and stack lights.
  • Dual GbE and Wide DC Input: Two Intel I210IT GbE ports and 9 to 36 V DC on a 4-pin connector.
View IRN556 Series
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Dual Display SupportDual Display Support
USB Generation: USB3USB3
M.2: 33x M.2
SIM Slots: 11x SIM
Connectivity: 4G4G
Connectivity: WirelessWi-Fi
 NVMe: NVMe SSD SupportNVMe SSD
Operating Temperature: Extended TemperatureExtended Temp
Operating Temperature: Wide Temperature [-40 to 85°C]Wide Temp
Certification: CECE
Certification: FCCFCC
USA Support Team: +1 407 214 9446 Call
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  • Overview
  • Specifications
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IRN556-TN-x7433RE Overview

An operator station on outdoor or mobile equipment typically combines a display with a handful of serial devices: a scanner, a printer, a scale or a PLC. The IRN556-TN-x7433RE handles all of them with four cores at 9 W. It is the quad-core Amston Lake option in the IRN556 series, a 3.5″ industrial motherboard with an LVDS panel output and four COM ports, rated from -40 to 85 °C.

The Intel Atom x7433RE is a quad-core Amston Lake processor running from 1.5 to 3.4 GHz within a 9 W TDP. Four cores keep a Windows or Linux HMI responsive while serial polling and logging run in the background. Memory is one DDR5 4800 MHz SO-DIMM slot for up to 16 GB, and Intel UHD Graphics decodes HEVC, VP9, AV1 and AVC in hardware. A discrete TPM 2.0 and a programmable watchdog are on board.

The dual-channel 24-bit LVDS connector drives a panel up to 1920 x 1200 at 60 Hz, and HDMI adds a second screen. Two RS-232/422/485 and two RS-232 ports sit on internal headers with 8-bit DIO and two USB 2.0 ports. On the rear are two GbE ports on Intel I210IT controllers and four USB 3.2 Gen 2 Type-A ports. M.2 sockets take an SSD, a cellular modem with nano SIM and Wi-Fi, and Realtek audio includes a 5 W speaker output for operator alerts.

The IRN556-TN-x7433RE runs fanless on 9 to 36 V DC through a 4-pin connector, with CE, FCC, UKCA and RoHS compliance. For the lowest heat at the same rating, the IRN556-TN-x7211RE runs two cores at 6 W. Where the workload needs eight cores, the IRN556-TN-x7835RE runs at 12 W.

IRN556-TN-x7433RE Specifications

Overview
Brand & ModelDFI IRN556-TN-x7433RE
FeaturesEmbedded
Fanless
Industrial
Performance
Processor SeriesIntel Atom X Series Amston Lake
Processor ModelsIntel Atom x7433RE: 1.5~3.4GHz, 4 Cores, 4 Threads, 6MB Cache, 9W
Performance Cores4 Cores
Memory1x DDR5 4800MHz SO-DIMM, 16GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Windows 11
Graphics
Integrated GPUIntel UHD Series
Display StandardsDual Channel LVDS
Multi Display SupportDual Display Support
Display Outputs1x HDMI
1x LVDS
Audio
InterfaceLine-Out
Mic-In
I/O
Ethernet2x Ethernet Ports
2x GbE LAN [RJ45]
LAN ControllersIntel I210IT
USB6x USB Ports
2x USB 2.0 [Board]
4x USB 3.2 Gen 2 [Type A]
Serial4x Serial Ports
2x RS232 [Board]
2x RS232/422/485 [Board]
Digital I/ODIO [8-lines]
Expansion
M.23x M.2 Expansion Slots
1x M.2 B-Key [PCIe x1/USB/SIM] [3052]
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x2 Gen3/SATA] [2242]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional 4G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
NVMeNVMe SSD Support
Power
Power Input9-36V DC [4-Pin]
Environmental Conditions
Operating Temperature-40°C to 85°C [-40°F to 185°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 90% (Non-condensing)
CertificationCE
FCC
RoHS
UKCA
Mechanical Properties
Dimensions146mm x 102mm (5.75" x 4.02")

Official DFI USA Distributor

Things Embedded is an official DFI USA distributor, supplying the IRN556-TN-x7433RE configured with memory, M.2 storage, wireless and your OS image, fitted with its cooling and tested before it ships. For indoor designs, the ADN553 offers triple 2.5GbE on Intel Alder Lake-N processors up to the eight-core Core i3-N305, rated from -5 to 65 °C. Our engineers can advise on the operating system image, M.2 modules and the heatsink that suits your enclosure.

This board also sits in our wide temperature computers range. See more Intel SBCs, or compare embedded motherboards.

Consult. Design. Integrate.

Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.