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DFI ADN553-BN-x7213E Intel Atom x7213E 3.5″ Embedded Board with 9 to 36 V DC Input and Triple 2.5GbE

The ADN553-BN-x7213E is the dual-core Atom build with LVDS in the DFI ADN553 series, a 10 W Intel Atom x7213E with triple 2.5GbE. It suits single-panel HMIs and machine controllers that keep an existing LVDS display and want Atom x7000E processing on a 3.5" embedded board.

  • Dual-Core Intel Atom x7213E: Two Alder Lake-N cores up to 3.2 GHz at 10 W TDP for single-panel HMI and machine control software.
  • Dual-Channel LVDS: 24-bit dual-channel LVDS up to 1920 x 1200 at 60 Hz drives an existing industrial panel without an adapter board.
  • Triple 2.5GbE: Three Intel I226V RJ45 ports connect controller, plant and remote-support networks on separate interfaces.
  • Serial and Digital I/O: One RS-232/422/485 header and 8-bit DIO connect legacy instruments, stack lights and interlocks directly to the board.
  • 9 to 36 V DC, Fanless: Wide-range DC input on a 4-pin or barrel connector, passive heatsink and -5 to 65 °C operating range.
View ADN553 Series
Processor Brand: IntelIntel
Operating Software: LinuxLinux
Operating Software: WindowsWindows
Multi Display Support: Triple Display SupportTriple Display Support
Ethernet Speed: 2.5GbE2.5GbE
USB Connector Type: Type CType C
USB Generation: USB3USB3
M.2: 33x M.2
SIM Slots: 11x SIM
Connectivity: 4G4G
Connectivity: 5G5G
Connectivity: WirelessWi-Fi
NVMe: NVMe SSD SupportNVMe SSD
Certification: CECE
Certification: FCCFCC
USA Support Team: +1 407 214 9446 Call
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  • Overview
  • Specifications
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ADN553-BN-x7213E Overview

Machine builders often carry an LVDS panel from one generation of equipment to the next, because changing the display means requalifying the operator station. The ADN553-BN-x7213E lets that panel stay. It is the dual-core Atom option with LVDS in the ADN553 series, a 3.5″ embedded board that updates the compute and networking behind an existing display.

The Intel Atom x7213E is a dual-core Alder Lake-N processor running up to 3.2 GHz within a 10 W TDP. Two cores run a single-panel HMI, a soft PLC visualization or a data-collection agent, and Intel UHD Graphics decodes HEVC, VP9, AV1 and AVC in hardware. Memory is one DDR5 4800 MHz SO-DIMM slot for up to 16 GB. DFI lists Windows 10 IoT Enterprise, Windows 11 and Linux, and a discrete TPM 2.0 and watchdog timer are on board.

The dual-channel 24-bit LVDS connector supports panels up to 1920 x 1200 at 60 Hz, and HDMI and USB-C with DisplayPort Alt Mode add two external screens. Three 2.5GbE ports on Intel I226V controllers sit on the rear with two USB 3.2 Gen 2 and one USB 3.2 Gen 1 Type-A port. Internal headers carry two USB 2.0 ports, one RS-232/422/485 port and 8-bit DIO, and M.2 sockets and a SATA 3.0 port take storage, 4G or 5G and Wi-Fi.

The ADN553-BN-x7213E runs fanless from -5 to 65 °C on 9 to 36 V DC, with CE, FCC, UKCA, KC and RoHS compliance. If the panel is eDP, the ADN553-BN-x7211E keeps two Atom cores at 6 W. For four cores with LVDS, the ADN553-BN-x7425E runs at 12 W.

ADN553-BN-x7213E Specifications

Overview
Brand & ModelDFI ADN553-BN-x7213E
FeaturesEmbedded
Fanless
Industrial
Performance
Processor SeriesIntel Atom X Series Alder Lake
Processor ModelsIntel Atom x7213E: 1.7~3.2GHz, 2 Cores, 2 Threads, 6MB Cache, 10W
Performance Cores2 Cores
Memory1x DDR5 4800MHz SO-DIMM, 16GB
BIOSAMI
Secure Crypto ProcessorTPM 2.0 (Trusted Platform Module)
Operating SystemLinux
Windows 11
Graphics
Integrated GPUIntel UHD Series
Display StandardsDual Channel LVDS
Multi Display SupportTriple Display Support
Display Outputs1x HDMI
1x LVDS
1x USB Type C
Audio
InterfaceLine-Out
Mic-In
I/O
Ethernet3x Ethernet Ports
3x 2.5 GbE LAN [RJ45]
LAN ControllersIntel I226V
USB6x USB Ports
1x USB 3.2 [Type C]
1x USB 3.2 Gen 1 [Type A]
2x USB 2.0 [Board]
2x USB 3.2 Gen 2 [Type A]
Serial1x Serial Ports
1x RS232/422/485 [Board]
Digital I/ODIO [8-lines]
Expansion
M.23x M.2 Expansion Slots
1x M.2 B-Key [PCIe x1/USB/SIM] [3042/3052]
1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
1x M.2 M-Key [PCIe x1/SATA] [2242/2280]
SIM Slots1x SIM Slots
Wireless ConnectivityOptional 4G Modem
Optional 5G Modem
Optional WiFi/Bluetooth
Storage
Storage1x M.2 SSD
1x SATA Port
NVMeNVMe SSD Support
Power
Power Input9-36V DC [4-Pin]
9-36V DC [Barrel Connector]
Environmental Conditions
Operating Temperature-5°C to 65°C [23°F to 149°F]
Storage Temperature-40°C to 85°C [-40°F to 185°F]
Humidity5% - 90% (Non-condensing)
CertificationCE
FCC
KC
RoHS
UKCA
Mechanical Properties
Dimensions146mm x 102mm (5.75" x 4.02")

Official DFI USA Distributor

Things Embedded is an official DFI USA distributor, supplying the ADN553-BN-x7213E configured with memory, M.2 storage, wireless and your OS image, fitted with its cooling and tested before it ships. If the board must run from -40 to 85 °C, the ASL553 offers the same triple 2.5GbE layout on Intel Amston Lake processors. We can help size memory and storage, choose cellular or Wi-Fi modules and plan the panel cabling.

For alternatives, browse our Intel embedded boards and industrial single board computers, or compare 3.5 inch single board computers.

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