ASL553-TN-x7213RE Overview
A machine controller in an unheated building still has to respond on a cold winter morning as it does in August. For that, a steady clock often matters more than extra cores. The ASL553-TN-x7213RE is the higher-clocked dual-core option in the ASL553 series, a 3.5″ industrial motherboard rated from -40 to 85 °C with triple 2.5GbE and an LVDS panel output.
The Intel Atom x7213RE is a dual-core Amston Lake processor running from 2.0 to 3.4 GHz within a 9 W TDP. Its 2.0 GHz base clock, twice that of the x7211RE, gives more consistent performance for control loops, a single-panel HMI or a soft PLC visualization. Memory is one DDR5 4800 MHz SO-DIMM slot for up to 16 GB, and Intel UHD Graphics decodes HEVC, VP9, AV1 and AVC in hardware. A discrete TPM 2.0 and a programmable watchdog are on board.
The dual-channel 24-bit LVDS connector drives panels up to 1920 x 1200 at 60 Hz, with HDMI and USB-C DisplayPort Alt Mode for two more screens. Three 2.5GbE ports on Intel I226IT controllers, two USB 3.2 Gen 2 and one USB 3.2 Gen 1 Type-A port sit on the rear. Internal headers carry two USB 2.0 ports, one RS-232/422/485 port and 8-bit DIO, with one SATA 3.0 port and M.2 sockets for storage, 4G or 5G and Wi-Fi.
The ASL553-TN-x7213RE runs fanless on 9 to 36 V DC through a 4-pin or barrel connector, with CE, FCC, UKCA and RoHS compliance. If heat is the tighter limit, the ASL553-TN-x7211RE runs two cores at 6 W. For HMI and gateway software on one board, the ASL553-TN-x7433RE offers four cores at the same 9 W.
ASL553-TN-x7213RE Specifications
| Overview | |
|---|---|
| Brand & Model | DFI ASL553-TN-x7213RE |
| Features | Embedded Fanless Industrial |
| Performance | |
| Processor Series | Intel Atom X Series Amston Lake |
| Processor Models | Intel Atom x7213RE: Up to 3.4GHz, 2 Cores, 2 Threads, 6MB Cache, 9W |
| Performance Cores | 2 Cores |
| Memory | 1x DDR5 4800MHz SO-DIMM, 16GB |
| BIOS | AMI |
| Secure Crypto Processor | TPM 2.0 (Trusted Platform Module) |
| Operating System | Linux Windows 11 |
| Graphics | |
| Integrated GPU | Intel UHD Series |
| Display Standards | Dual Channel LVDS |
| Multi Display Support | Triple Display Support |
| Display Outputs | 1x HDMI 1x LVDS 1x USB Type C |
| Audio | |
| Interface | Line-Out Mic-In |
| I/O | |
| Ethernet | 3x Ethernet Ports |
| 3x 2.5 GbE LAN [RJ45] | |
| LAN Controllers | Intel I226IT |
| USB | 6x USB Ports |
| 1x USB 3.2 [Type C] 1x USB 3.2 Gen 1 [Type A] 2x USB 2.0 [Board] 2x USB 3.2 Gen 2 [Type A] | |
| Serial | 1x Serial Ports |
| 1x RS232/422/485 [Board] | |
| Digital I/O | DIO [8-lines] |
| Expansion | |
| M.2 | 3x M.2 Expansion Slots |
| 1x M.2 B-Key [PCIe x1/USB/SIM] [3042/3052] 1x M.2 E-Key [PCIe x1/USB 2.0] [2230] 1x M.2 M-Key [PCIe x1/SATA] [2242/2280] | |
| SIM Slots | 1x SIM Slots |
| Wireless Connectivity | Optional 4G Modem Optional 5G Modem Optional WiFi/Bluetooth |
| Storage | |
| Storage | 1x M.2 SSD 1x SATA Port |
| NVMe | NVMe SSD Support |
| Power | |
| Power Input | 9-36V DC [4-Pin] 9-36V DC [Barrel Connector] |
| Environmental Conditions | |
| Operating Temperature | -40°C to 85°C [-40°F to 185°F] |
| Storage Temperature | -40°C to 85°C [-40°F to 185°F] |
| Humidity | 5% - 90% (Non-condensing) |
| Certification | CE FCC RoHS UKCA |
| Mechanical Properties | |
| Dimensions | 146mm x 102mm (5.75" x 4.02") |
- ASL553-TN-x7213RE Datasheet Download
Official DFI USA Distributor
Things Embedded is an official DFI USA distributor, supplying the ASL553-TN-x7213RE configured with memory, M.2 storage, wireless and your OS image, fitted with its cooling and tested before it ships. For serial-heavy control work, the IRN556 offers four COM ports and dual GbE on a 3.5" board. Our engineers can advise on the operating system image, M.2 modules and the heatsink that suits your enclosure.
This board also sits in our Intel Amston Lake boards and systems range. See more industrial motherboards, or compare embedded SBCs.
Consult. Design. Integrate.
Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.
Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.