EC90A-GH-R1606G-EN-DIO-LTE Overview
Remote pumps, kiosks and temporary sites often have power but no wired network, so the PC has to bring its own connection. The EC90A-GH-R1606G-EN-DIO-LTE is the AMD Ryzen Embedded R1606G build of the DFI EC90A-GH series with a fitted LTE module and two SMA antenna connectors, 64 GB of eMMC and 8-bit DIO, in a fanless ultra-compact industrial PC.
The Ryzen Embedded R1606G is a dual-core processor at 2.6 GHz with a boost of up to 3.5 GHz, rated at 12 W, on the DFI GHF51-EN board from the GHF51 series. Its AMD Vega graphics with three compute units handle H.265 encode and decode and VP9 decode, which suits signage and camera review. Memory is 4 GB of DDR4-2400 soldered down, storage is 64 GB of eMMC, and fTPM 2.0 and a watchdog timer are built in. DFI lists Windows 10 IoT Enterprise, and the system is Ubuntu-certified IoT hardware.
The front carries two micro HDMI 1.4 ports at up to 4096 x 2160 at 24 Hz, one USB 3.1 Type-C port and one GbE port on an Intel I211AT controller. The rear combo port carries 8-bit DIO and SMBus for sensors, relays or a small I/O board. The full-size Mini PCIe slot holds the fitted LTE module, with two SMA antenna connectors on the rear.
Power is 12 V DC on a locking DC jack, which keeps the lead in place on a vibrating machine or a busy kiosk. The EC90A-GH-R1606G-EN-DIO-LTE runs fanless from -20 °C to 45 °C, with storage from -40 °C to 85 °C, and mounts on a wall or a VESA bracket. DFI lists CE, FCC and UKCA. The EC90A-GH-R1606G-EN-DIO is the same build without the LTE module, and the EC90A-GH-R1606G-DIO has 32 GB of eMMC.
EC90A-GH-R1606G-EN-DIO-LTE Specifications
| Overview | |
|---|---|
| Brand & Model | DFI EC90A-GH-R1606G-EN-DIO-LTE |
| Features | Compact Embedded Fanless Industrial |
| Performance | |
| Processor Series | AMD Ryzen R-Series |
| Processor Models | AMD Ryzen Embedded R1606G: 2.6~3.5GHz, 2 Cores, 4 Threads, 4MB Cache, 12-25W |
| Performance Cores | 2 Cores |
| Memory | 4GB Soldered On-board |
| BIOS | AMI |
| Secure Crypto Processor | TPM 2.0 (Trusted Platform Module) |
| Operating System | Linux Windows 10 |
| Graphics | |
| Integrated GPU | AMD Radeon Series |
| Display Standards | HDMI 1.4 |
| Multi Display Support | Dual Display Support |
| Display Outputs | 2x Micro HDMI |
| I/O | |
| Ethernet | 1x Ethernet Ports |
| 1x GbE LAN [RJ45] | |
| LAN Controllers | Intel i211AT |
| USB | 1x USB Ports |
| 1x USB 3.1 Gen 1 [Type-C] | |
| Digital I/O | DIO [8-lines] |
| Expansion | |
| mPCIe | 1x mPCIe Slots |
| 1x mPCIe [PCIe/USB] | |
| Storage | |
| Storage | 64GB eMMC |
| Power | |
| Power Input | 12V DC [Barrel Connector] |
| Environmental Conditions | |
| Thermal Dissipation | Fanless Passively Cooled Chassis |
| Operating Temperature | -20°C to 45°C [-4°F to 113°F] |
| Storage Temperature | -40°C to 85°C [-40°F to 185°F] |
| Humidity | 5% - 90% (Non-condensing) |
| Certification | CE FCC UKCA |
| Mechanical Properties | |
| Weight | 0.7 Kg (1.5 Lbs) |
| Chassis Material | Aluminum |
| Dimensions | 112mm x 80mm x 56mm (4.42" x 3.15" x 2.21") |
| Mounting Options | VESA Mount Wall Mount |
- EC90A-GH-R1606G-EN-DIO-LTE Datasheet Download
Official DFI USA Distributor
Things Embedded is an official DFI USA distributor, and we supply the EC90A-GH-R1606G-EN-DIO-LTE configured and tested, with the memory, storage, wireless modules and operating system image fitted before it ships. Within the DFI range, the EC90A-GH-R1606G-EN-DIO is the same R1606G, 64 GB eMMC and DIO build without the LTE module.
Across our range, the EC90A-GH-R1606G-EN-DIO-LTE sits with our embedded box PCs, our AMD industrial PCs and our fanless PCs.
Consult. Design. Integrate.
Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.
Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.