DFI GH551-BC1-R2312 3.5″ SBC with AMD Ryzen Embedded R2312, Dual DP++, LVDS and Triple GbE

A panel device with a built-in LCD and one or two external screens rarely needs a quad-core processor. The GH551-BC1-R2312 is the R2312 build in the DFI GH551 series: a 3.5 inch SBC with three GbE ports, two DP++ outputs and LVDS and a single 12 V DC input, rated -5 to 65 °C.

The AMD Ryzen Embedded R2312 is a dual-core, four-thread processor at 2.7 GHz base and 3.5 GHz boost, which suits HMI and panel software. One DDR4-2400 SO-DIMM socket takes up to 16 GB in single channel, with ECC or non-ECC modules. AMD Radeon Vega Graphics drives two DP++ outputs plus an LVDS panel connector for three displays; DP++ runs at up to 4096 x 2160 at 60 Hz and LVDS at up to 1920 x 1200.

The rear edge carries three GbE ports on Realtek RTL8111HN/RTL8119I controllers, two USB 3.1 Gen 2 ports and one USB 2.0. Internal headers add one RS-232/422/485 port with RS-485 auto flow control, one USB 2.0, 8-bit DIO, one SATA 3.0 port and Realtek ALC888S audio with a 2 x 3 W speaker-out. Expansion is a full-size Mini PCIe socket, an M.2 2280/2242 M key for a SATA or PCIe SSD and an optional Nano SIM slot. The GH551-BC1-R2314 is the quad-core R2314 build with three DP++ plus LVDS, and the GH551-BC1-R1505G is the R1000 alternative with the same display layout.

Power is a single 12 V DC input on a 4-pin right-angle connector, with a DC jack or vertical 4-pin connector on request. The GH551-BC1-R2312 operates from -5 to 65 °C and ships with a 35.0 mm heatsink, with a heat spreader as an option. Firmware TPM 2.0 is standard, with discrete TPM 2.0 as an option. The board measures 146 x 102 mm, supports Windows 10 IoT Enterprise (64-bit) and Linux, carries CE and FCC Class B marks and is RoHS compliant.