DFI GH551 3.5" AMD Ryzen Embedded SBCs with up to Four DP++ and Triple GbE
The DFI GH551 series is a family of 3.5 inch SBCs on AMD Ryzen Embedded V1000, R1000 and R2000 processors, with one DDR4-2400 SO-DIMM for up to 16 GB, up to four DP++ outputs or three plus LVDS, three GbE ports and a 12 V DC input. The series suits multi-screen signage, HMI and gateway designs, with -30 to 80 °C builds for harsher sites.
- AMD Ryzen Embedded: V1000, R1000 and R2000 processors from dual-core to eight-thread, with DDR4-2400 up to 16 GB.
- Up to Four Displays: Up to four DP++ outputs at up to 4096 x 2160, or three DP++ plus LVDS for a built-in panel.
- Three GbE Ports: Three GbE ports keep up to three networks on separate interfaces.
- M.2, Mini PCIe and SIM: An M.2 M key for a SATA or PCIe SSD, a full-size Mini PCIe socket and an optional Nano SIM slot.
- 12 V DC, Two Ranges: Single 12 V DC input, with -5 to 65 °C and -30 to 80 °C builds and a matched heatsink.
Linux
Windows
Triple Display Support
USB3
1x M.2
1x mPCIe
1x SIM
4G
5G
Wi-Fi
NVMe SSD
CE
FCC
Extended Temp
GH551 Description
Signage walls, operator desks and gateways often need several screens and several networks from a board small enough to hide behind a display. The DFI GH551 series is built for that brief: a family of 3.5 inch SBCs on AMD Ryzen Embedded processors with up to four DP++ outputs, three GbE ports and a single 12 V DC input.
Every GH551 shares one layout. One DDR4-2400 SO-DIMM socket takes up to 16 GB in single channel, with ECC or non-ECC modules, and AMD Radeon Vega Graphics drives DP++ outputs at up to 4096 x 2160 at 60 Hz and an LVDS connector at up to 1920 x 1200 on the builds that use it. Three GbE ports on Realtek RTL8111HN/RTL8119I controllers, two USB 3.1 Gen 2 and one USB 2.0 sit on the rear, with an RS-232/422/485 port, 8-bit DIO, SATA 3.0 and Realtek ALC888S audio inside. Expansion is a full-size Mini PCIe socket, an M.2 2280/2242 M key for a SATA or PCIe SSD and an optional Nano SIM slot.
The -5 to 65 °C builds cover the range: the GH551-BC1-R1505G (two DP++ plus LVDS), the GH551-BC1-R1606G (three DP++), the GH551-BC1-R2312 (dual-core R2000, two DP++ plus LVDS), the GH551-BC1-R2314 (quad-core R2314, three DP++ plus LVDS), the GH551-BC1-R2514 (eight-thread R2514, four displays), the GH551-BC1-V1202B (three DP++ plus LVDS) and the GH551-BC1-V1605B (eight-thread, four DP++). The -30 to 80 °C builds are the GH551-EC1-R1606G with three DP++, the GH551-EC1-V1404I with four DP++ and the GH551-EC1-V1605B with four DP++.
Power is a single 12 V DC input on a 4-pin right-angle connector, with a DC jack or vertical 4-pin connector on request; DFI quotes 16.2 W typical and 28.44 W maximum for the V1605B. Each build ships with a heatsink sized to its temperature range, 35.0 mm for -5 to 65 °C and 44.9 mm for -30 to 80 °C, and storage is rated -40 to 85 °C. Firmware TPM 2.0 is standard with discrete TPM 2.0 as an option. The boards measure 146 x 102 mm, support Windows 10 IoT Enterprise (64-bit) and Linux, carry CE and FCC Class B marks and are RoHS compliant.
GH551 Specifications
| Overview | |
|---|---|
| Brand & Model | DFI GH551 |
| Features | Compact Embedded Fanless Industrial |
| Performance | |
| Processor Series | See Variant Specifications |
| Processor Models | See Variant Specifications |
| Performance Cores | See Variant Specifications |
| Memory | 1x DDR4 3200MHz SO-DIMM Slot, 16GB |
| BIOS | AMI |
| Secure Crypto Processor | TPM 2.0 (Trusted Platform Module) |
| Operating System | Linux Windows 10 |
| Graphics | |
| Integrated GPU | AMD Radeon Series |
| Multi Display Support | Triple Display Support |
| Display Outputs | See Variant Specifications |
| Audio | |
| Interface | Line-Out Mic-In |
| I/O | |
| Ethernet | 3x Ethernet Ports |
| 3x GbE LAN [RJ45] | |
| USB | 4x USB Ports |
| 1x USB 2.0 [Board] 1x USB 2.0 [Type A] 2x USB 3.1 Gen 1 [Type A] | |
| Serial | 1x Serial Ports |
| 1x RS232/422/485 [Board] | |
| Digital I/O | DIO [8-lines] |
| Expansion | |
| M.2 | 1x M.2 Expansion Slots |
| 1x M.2 M-Key [PCIe x4] [2242/2280] | |
| mPCIe | 1x mPCIe Slots |
| 1x mPCIe [PCIe/USB] | |
| SIM Slots | 1x SIM Slots |
| Wireless Connectivity | Optional 4G Modem Optional 5G Modem Optional WiFi/Bluetooth |
| Storage | |
| Storage | 1x M.2 SSD 1x SATA Port |
| NVMe | NVMe SSD Support |
| Power | |
| Power Input | 12V DC [4-Pin] |
| Environmental Conditions | |
| Thermal Dissipation | Optional Heat Spreader Optional Heatsink |
| Operating Temperature | See Variant Specifications |
| Storage Temperature | -40°C to 85°C [-40°F to 185°F] |
| Humidity | 10-90% (Non-condensing) |
| Certification | CE FCC RoHS |
| Mechanical Properties | |
| Weight | 0.2 Kg (0.44 Lbs) |
| Dimensions | 146mm x 102mm (5.75" x 4.02") |
No specifications match your search.
See product variants.
GH551 Variants
DFI GH551-BC1-R2312 3.5″ SBC with AMD Ryzen Embedded R2312, Dual DP++, LVDS and Triple GbE
GH551 with Ryzen Embedded R2312 and LVDS
| Overview | |
|---|---|
| Brand & Model | DFI GH551-BC1-R2312 |
| Performance | |
| Processor Series | R-Series, R2000 |
| Processor Models | R2312 |
| Performance Cores | 2 |
| Graphics | |
| Display Outputs | 1x LVDS, 2x Display Port |
| Environmental Conditions | |
| Operating Temperature | -5°C to 65°C [23°F to 149°F] |
DFI GH551-BC1-R2314 3.5″ SBC with AMD Ryzen Embedded R2314, Triple DP++, LVDS and Triple GbE
GH551 with Ryzen Embedded R2314 and LVDS
| Overview | |
|---|---|
| Brand & Model | DFI GH551-BC1-R2314 |
| Performance | |
| Processor Series | R-Series, R2000 |
| Processor Models | R2314 |
| Performance Cores | 4 |
| Graphics | |
| Display Outputs | 1x LVDS, 3x Display Port |
| Environmental Conditions | |
| Operating Temperature | -5°C to 65°C [23°F to 149°F] |
DFI GH551-BC1-R2514 3.5″ SBC with AMD Ryzen Embedded R2514, Quad Display and Triple GbE
GH551 with Ryzen Embedded R2514 and quad display
| Overview | |
|---|---|
| Brand & Model | DFI GH551-BC1-R2514 |
| Performance | |
| Processor Series | R-Series, R2000 |
| Processor Models | R2514 |
| Performance Cores | 4 |
| Graphics | |
| Display Outputs | 4x Display Ports |
| Environmental Conditions | |
| Operating Temperature | -5°C to 65°C [23°F to 149°F] |
DFI GH551-EC1-R1606G 3.5″ SBC with AMD Ryzen Embedded R1606G, Triple 4K DP++ and -30 to 80 °C
GH551 with Ryzen Embedded R1606G rated -30 to 80 °C
| Overview | |
|---|---|
| Brand & Model | DFI GH551-EC1-R1606G |
| Performance | |
| Processor Series | R-Series |
| Processor Models | R1606G |
| Performance Cores | 2 |
| Graphics | |
| Display Outputs | 3x Display Port |
| Environmental Conditions | |
| Operating Temperature | -30°C to 80°C [-22°F to 176°F], Extended Temperature |
DFI GH551-EC1-V1605B 3.5″ SBC with AMD Ryzen Embedded V1605B, Quad 4K DP++ and -30 to 80 °C
GH551 with Ryzen Embedded V1605B rated -30 to 80 °C
| Overview | |
|---|---|
| Brand & Model | DFI GH551-EC1-V1605B |
| Performance | |
| Processor Series | V-Series |
| Processor Models | V1605B |
| Performance Cores | 4 |
| Graphics | |
| Display Outputs | 4x Display Ports |
| Environmental Conditions | |
| Operating Temperature | -30°C to 80°C [-22°F to 176°F], Extended Temperature |
DFI GH551-BC1-R1505G 3.5″ SBC with AMD Ryzen Embedded R1505G, Dual DP++, LVDS and Triple GbE
GH551 with Ryzen Embedded R1505G and LVDS
| Overview | |
|---|---|
| Brand & Model | DFI GH551-BC1-R1505G |
| Performance | |
| Processor Series | R-Series |
| Processor Models | R1505G |
| Performance Cores | 2 |
| Graphics | |
| Display Outputs | 1x LVDS, 2x Display Port |
| Environmental Conditions | |
| Operating Temperature | -5°C to 65°C [23°F to 149°F] |
DFI GH551-BC1-R1606G 3.5″ SBC with AMD Ryzen Embedded R1606G, Triple 4K DP++ and Triple GbE
GH551 with Ryzen Embedded R1606G and three DP++ outputs
| Overview | |
|---|---|
| Brand & Model | DFI GH551-BC1-R1606G |
| Performance | |
| Processor Series | R-Series |
| Processor Models | R1606G |
| Performance Cores | 2 |
| Graphics | |
| Display Outputs | 3x Display Port |
| Environmental Conditions | |
| Operating Temperature | -5°C to 65°C [23°F to 149°F] |
DFI GH551-EC1-V1404I 3.5″ SBC with AMD Ryzen Embedded V1404I, Quad 4K DP++ and -30 to 80 °C
GH551 with Ryzen Embedded V1404I rated -30 to 80 °C
| Overview | |
|---|---|
| Brand & Model | DFI GH551-EC1-V1404I |
| Performance | |
| Processor Series | V-Series |
| Processor Models | V1404I |
| Performance Cores | 4 |
| Graphics | |
| Display Outputs | 4x Display Ports |
| Environmental Conditions | |
| Operating Temperature | -30°C to 80°C [-22°F to 176°F], Extended Temperature |
DFI GH551-BC1-V1202B 3.5″ SBC with AMD Ryzen Embedded V1202B, Triple DP++ and LVDS
GH551 with Ryzen Embedded V1202B and LVDS
| Overview | |
|---|---|
| Brand & Model | DFI GH551-BC1-V1202B |
| Performance | |
| Processor Series | V-Series |
| Processor Models | V1202B |
| Performance Cores | 2 |
| Graphics | |
| Display Outputs | 1x LVDS, 3x Display Port |
| Environmental Conditions | |
| Operating Temperature | -5°C to 65°C [23°F to 149°F] |
DFI GH551-BC1-V1605B 3.5″ SBC with AMD Ryzen Embedded V1605B, Quad 4K DP++ and Triple GbE
GH551 with Ryzen Embedded V1605B and four DP++ outputs
| Overview | |
|---|---|
| Brand & Model | DFI GH551-BC1-V1605B |
| Performance | |
| Processor Series | V-Series |
| Processor Models | V1605B |
| Performance Cores | 4 |
| Graphics | |
| Display Outputs | 4x Display Ports |
| Environmental Conditions | |
| Operating Temperature | -5°C to 65°C [23°F to 149°F] |
- GH551 Datasheet Download
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Official DFI USA Distributor
Things Embedded is an official DFI USA distributor, supplying the GH551 series configured for USA signage, HMI and gateway projects. Within the DFI range the EHL556 is a 3.5 inch Intel Elkhart Lake board rated -40 to 85 °C, and the PCSF51 puts an R2000 processor on a 1.8 inch board.
The GH551 series sits among our AMD Ryzen SBCs, our 3.5 inch SBCs and our AMD Ryzen Embedded computers. Where a compact board has to drive up to four screens and three networks, this is the DFI series to specify.
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