DFI GH551-BC1-R2514 3.5″ SBC with AMD Ryzen Embedded R2514, Quad Display and Triple GbE

Four screens, three networks and multi-threaded software put more load on a small board than a basic controller sees. The GH551-BC1-R2514 is the R2514 build in the DFI GH551 series: a 3.5 inch SBC with three GbE ports, four DP++ outputs, or three with LVDS and a single 12 V DC input, rated -5 to 65 °C.

The AMD Ryzen Embedded R2514 is a quad-core, eight-thread processor at 2.1 GHz base and 3.7 GHz boost, which suits multi-threaded gateway, signage and HMI software. One DDR4-2400 SO-DIMM socket takes up to 16 GB in single channel, with ECC or non-ECC modules. AMD Radeon Vega Graphics drives four DP++ outputs on one part number (770-GH5512-800G) or three DP++ plus LVDS on the other (770-GH5512-900G), for four displays either way; DP++ runs at up to 4096 x 2160 at 60 Hz and LVDS at up to 1920 x 1200.

The rear edge carries three GbE ports on Realtek RTL8111HN/RTL8119I controllers, two USB 3.1 Gen 2 ports and one USB 2.0. Internal headers add one RS-232/422/485 port with RS-485 auto flow control, one USB 2.0, 8-bit DIO, one SATA 3.0 port and Realtek ALC888S audio with a 2 x 3 W speaker-out. Expansion is a full-size Mini PCIe socket, an M.2 2280/2242 M key for a SATA or PCIe SSD and an optional Nano SIM slot. The GH551-BC1-R2314 is the four-thread R2314 build, and the GH551-BC1-V1605B is the V1605B build with four DP++ outputs and published power figures.

Power is a single 12 V DC input on a 4-pin right-angle connector, with a DC jack or vertical 4-pin connector on request. The GH551-BC1-R2514 operates from -5 to 65 °C and ships with a 35.0 mm heatsink, with a heat spreader as an option. Firmware TPM 2.0 is standard, with discrete TPM 2.0 as an option. The board measures 146 x 102 mm, supports Windows 10 IoT Enterprise (64-bit) and Linux, carries CE and FCC Class B marks and is RoHS compliant.