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Diamond Systems EPSM-10GX-L3 Rugged 26 Port Managed Layer 3 Ethernet Switch Module

The EPSM-10GX-L3 is the Layer 3 routing build in the Diamond Systems EPSM-10GX series, a small Ethernet switch module with 24 gigabit copper ports and two 10G SFI ports for your own carrier board. It suits vehicle and robot networks that route between subnets or need OSPFv2 on board.

  • Layer 3 Routing Software: IPv6 static routing in hardware and software, RFC 2328 OSPFv2 dynamic routing and RADIUS accounting sit on top of the Layer 2+ feature set.
  • 24 Gigabit Plus Two 10G: 24 copper 10/100/1000 ports and two 10G SFI ports for SFP+ fiber or copper transceivers on one module.
  • Web, CLI and SNMP: A web GUI over any port, a command-line interface over RS-232 and SNMP v1/v2c/v3 manage routing and switching settings.
  • Carrier-Ready Interface: Dual 120-pin Samtec ERF5 connectors carry power and all signals, leaving magnetics, connectors and power regulation to the carrier.
  • Rugged Construction: -40 to +85 °C operation and MIL-STD-202G shock and vibration resistance suit ground, air and underwater vehicles.
Operating Temperature: Extended TemperatureExtended Temp
Operating Temperature: Wide Temperature [-40 to 85°C]Wide Temp
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EPSM-10GX-L3 Overview

A vehicle or robot network that joins cameras, sensors and mission computers on separate subnets needs routing as well as switching. The EPSM-10GX-L3 is the Layer 3 build in the Diamond Systems EPSM-10GX series: a small Ethernet switch module that carries the switching core and management software, so the carrier you design supplies mainly magnetics, connectors and power.

The module provides 24 10/100/1000 copper ports with non-blocking wire-speed performance, 12 from PHYs on the module and 12 through QSGMII to a 12-port PHY on the carrier, plus two 10G SFI ports for SFP+ fiber or copper transceivers. Layer 3 routing and switching software adds hardware- and software-based IPv6 static routing, RFC 2328 OSPFv2 dynamic routing, RADIUS accounting and port and queue policers. Management is through a web GUI over any port, a command-line interface over RS-232 and SNMP v1/v2c/v3.

The Layer 2+ base covers 8K MAC addresses, 4K VLANs and jumbo frames, plus RSTP and MSTP, IEEE 802.3ad link aggregation on Layer 2 to Layer 4 information, multicast and broadcast storm control, IEEE 802.1X and 8 priorities with 8 QoS queues per port; our guide to Layer 2 and Layer 3 switches explains when routing helps. Its package also lists IEEE 1588 PTP, needing an external precision clock and 1pps source on the carrier. Two 120-pin Samtec ERF5 connectors carry all power and data to the carrier; the first handles power, nine ports and the RS-232 interface, so designs of nine ports or fewer can use it alone, and the second adds the remaining copper ports, the QSGMII lanes and the two 10G ports. The EPSM-10GX is the Layer 2+ build.

The module takes 5 V DC ±5% from the carrier and draws up to 20 W with all ports active. It runs from -40 to +85 °C with Diamond’s heat sink or heat spreader, the spreader suiting enclosures that can take heat through a wall. MIL-STD-202G shock and vibration resistance, as Diamond states it, suits vehicle use. Diamond provides a carrier design guide and a development kit.

EPSM-10GX-L3 Specifications

Overview
Brand & ModelDiamond Systems EPSM-10GX-L3
FeaturesCompact
Embedded
Fanless
Industrial
Managed Ethernet Switch
Rugged
Networking
Switching LayerLayer 3
Switch TypeManaged
Ethernet Ports24x 10/100/1000 BASE-TX [Board]
Number of Ethernet Ports24x Ethernet Ports
Number of Fiber Ports2x 10G [SFI]
Networking StandardsIEEE 802.1D Spanning Tree Protocol
IEEE 802.1Q VLAN
IEEE 802.1s Multiple Spanning Tree Protocol
IEEE 802.1w Rapid Spanning Tree Protocol
IEEE 802.1X Port-Based Network Access Control
IEEE 802.3 10BaseTx Ethernet
IEEE 802.3ab 1000BaseTx Gigabit Ethernet
IEEE 802.3ad Link Aggregation
IEEE 802.3ae 10 Gigabit Fiber
IEEE 802.3u 100BaseTx Fast Ethernet
Power
Power Input5V DC [Board]
Environmental Conditions
Operating Temperature-40°C to 85°C [-40°F to 185°F]
CertificationRoHS
Mechanical Properties
Weight85 g (3.0 oz)
Dimensions84mm x 55mm (3.31" x 2.17")
Number of Ports 24 10/100/1000Mbps Ethernet ports with non-blocking wire-speed performance
2 10G SFI ports for fiber or copper transceivers
Magnetics and 10G transceivers required on carrier board
Implementation 12 PHYs integrated on main board; QSGMII signals for additional 12-port PHY on carrier board
On-board Memory 4MB packet memory
Network Management SNMP v1/v2c/v3; Web GUI and command line interface (CLI)
Power Management ActiPHY and PerfectReach power management reduce power for shorter cable lengths and shut down power to disconnected ports
Serial Port 1 serial port for host interface; RS-232 transceiver required on carrier board
Indicator lights Serial data stream provided for 2 LEDs per port; decoder logic required on carrier board
Form Factor 55x84mm / 2.17×3.31” (Same as COM Express Type 10)
Interconnect Dual Samtec ERF5 series connectors, 120 pins each, 10mm board to board spacing
Input voltage 5VDC +/-5%
Power consumption 20W max, all ports active
Operating temperature -40 to +85°C with DSC-provided heat sink or heat spreader
Cooling Heat sink, 55x84mm, 16.6mm height
Heat spreader, 55x104mm, 7.6mm height
Weight 85G / 3.0 oz
Rohs Compliant

Official Diamond Systems USA Distributor

Things Embedded is an official Diamond Systems USA distributor, supplying the EPSM-10GX-L3 for USA unmanned vehicle and defense programs. Within the Diamond range the EPSM-10GX4-L3 runs the same Layer 3 software with four 10G ports, and the EPS-24G4X is the complete 3.5 inch switch board for projects that do not want a custom carrier.

With Layer 3 routing on the module, the EPSM-10GX-L3 sits among our board-level switch modules, our embedded Ethernet switches and our full range of network switches. Where a custom carrier has to route between subnets with OSPFv2 and still offer two 10G uplinks, this is the build to specify.

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Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.

Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.