SolidRun RAI300 AMD Ryzen AI 9 HX 370 Industrial AI PC with NPU and Hailo AI Options

Edge AI, vision and industrial computing often have to run where a fan would be the first part to fail. The SolidRun Bedrock RAI300 is a fanless industrial AI PC for those sites, built on the AMD Ryzen AI 9 HX 370. It is the newest model in the SolidRun Bedrock range, after the BEDROCK R8000 and BEDROCK R7000 EDGE AI, in an aluminum enclosure that mounts on a DIN rail, a wall, a VESA bracket or a desk.

The Ryzen AI 9 HX 370 brings 12 Zen 5 cores and 24 threads up to 5.1 GHz, AMD Radeon 890M graphics with 16 compute units at 2900 MHz and an NPU rated at 50 TOPS, at up to 54 W. Two DDR5-5600 SO-DIMM sockets take up to 128 GB, and up to three NVMe PCIe Gen4 x4 SSDs are conduction cooled, with power loss protection available on the main drive. Two M.2 key-M 2242 sockets take Hailo-8 or Hailo-10 AI modules, each in place of an NVMe drive, for up to two modules per RAI300.

I/O is set by the networking board. The NIO R8000 4X25 gives four 2.5GbE ports on Intel I226 controllers, and the NIO R7000 Basic gives two. USB runs up to one USB4 port at 40 Gb/s plus USB 3.2, and up to four displays run over HDMI 2.1 and DisplayPort 2.1. An optional Quectel 4G or 5G modem uses up to four SMA antennas. Security comes from firmware TPM 2.0 and an Infineon TPM 2.0 chip.

Two enclosures are available for the RAI300. The 60W enclosure measures 73 x 160 x 130 mm and cools the processor through its fins; the Tile is 29 mm thick and passes the heat into a cold plate or chassis wall. Power is 12 to 60 V DC on a Phoenix terminal, and builds are rated up to -40 to 85 °C, with a commercial temperature version too. Choose the build in the configurator, with Windows 11 IoT or Linux installed.