Diamond Systems EPS-12002L-HSK Compact Managed Ethernet Switch with 12x 1GbE Ports + 2x 1/2.5/5/10GbE SFP+ sockets, Layer 2 software & heat sink

Vehicle and industrial networks often need a dozen copper devices and a fiber uplink on a switch small enough to sit beside the computer. The EPS-12002L-HSK is the Layer 2+ build with an integrated heat sink in the Diamond Systems EPS-12002L series. Diamond builds it around its EPSM-10GX Ethernet switch module, mounted on a carrier board that provides power, magnetics and connectors, so it arrives as a complete standalone Ethernet switch board.

The board carries 12 10/100/1000 Mbps copper ports for twisted-pair links and two SFP+ sockets that run at 1, 2.5, 5 or 10 Gbps with fiber or copper transceivers, and all ports switch at non-blocking wire speed. It runs Diamond’s Layer 2+ switching software. You manage it through a GUI web interface reached over any port, or through a command language on the built-in RS-232 port when a field engineer connects locally. Diamond also offers software customization and can put your logo, color scheme and part numbers on the GUI and serial interface.

The Layer 2+ software handles 8K MAC addresses, 4K IEEE 802.1Q VLANs and 8K IPv4 and IPv6 multicast groups, with jumbo frames at all speeds. Each port has 8 priorities and 8 QoS queues with scheduling, and IEEE 802.3ad link aggregation works on Layer 2 to Layer 4 information. RSTP and MSTP manage redundant paths, alongside IEEE 802.1X and broadcast and multicast storm control. Where routing between subnets is needed, the EPS-12002L-HSK-L3 adds Layer 3 software with the same heat sink, and the EPS-12002L-HSP swaps the heat sink for a heat spreader. Our guide to VLANs explains how segmentation works.

A 5 to 36 V DC input suits a range of industrial and vehicle power supplies, and the board operates from -40 to +85 °C. It uses latching I/O connectors, and Diamond specifies MIL-STD-202G shock and vibration resistance. The integrated heat sink sits over the switch module, which suits enclosures with room above the board for its fins.