EPS-12002L-HSP Overview
Where a switch has to fit flat inside a vehicle enclosure, fins above the board can cost space the design does not have. The EPS-12002L-HSP is the Layer 2+ build with a heat spreader mounting plate in the Diamond Systems EPS-12002L series. Diamond builds it around its EPSM-10GX Ethernet switch module, mounted on a carrier board that provides power, magnetics and connectors, so it arrives as a complete standalone Ethernet switch board.
The board carries 12 10/100/1000 Mbps copper ports for twisted-pair links and two SFP+ sockets that run at 1, 2.5, 5 or 10 Gbps with fiber or copper transceivers, and all ports switch at non-blocking wire speed. Switching runs on Diamond’s Layer 2+ software package. You manage it through a GUI web interface reached over any port, or through a command language on the built-in RS-232 port when a field engineer connects locally. Diamond also offers software customization and can put your logo, color scheme and part numbers on the GUI and serial interface.
The Layer 2+ software handles 8K MAC addresses, 4K IEEE 802.1Q VLANs and 8K IPv4 and IPv6 multicast groups, with jumbo frames at all speeds. Each port has 8 priorities and 8 QoS queues with scheduling, and IEEE 802.3ad link aggregation works on Layer 2 to Layer 4 information. RSTP and MSTP manage redundant paths, alongside IEEE 802.1X and broadcast and multicast storm control. The EPS-12002L-HSK is the same Layer 2+ board with a finned heat sink, and the EPS-12002L-HSP-L3 keeps the heat spreader and adds Layer 3 routing. For background, see what a managed switch does.
A 5 to 36 V DC input suits a range of industrial and vehicle power supplies, and the board operates from -40 to +85 °C. It uses latching I/O connectors, and Diamond specifies MIL-STD-202G shock and vibration resistance. The heat spreader is a mounting plate under the board, which suits designs that bolt the switch to a flat surface rather than rely on fins.
EPS-12002L-HSP Specifications
| Overview | |
|---|---|
| Brand & Model | Diamond Systems EPS-12002L-HSP |
| Features | Compact Embedded Fanless Managed Ethernet Switch |
| I/O | |
| Serial | 1x Serial Ports |
| 1x RS232 [Board] | |
| Networking | |
| Switching Layer | Layer 2+ |
| Switch Type | Managed |
| Ethernet Ports | 12x 10/100/1000 BASE-TX [Latching] |
| Number of Ethernet Ports | 12x Ethernet Ports |
| Number of Fiber Ports | 2x 1G/10G [SFP+] |
| Networking Standards | IEEE 802.1D Spanning Tree Protocol IEEE 802.1Q VLAN IEEE 802.1s Multiple Spanning Tree Protocol IEEE 802.1w Rapid Spanning Tree Protocol IEEE 802.1X Port-Based Network Access Control IEEE 802.3 10BaseTx Ethernet IEEE 802.3ab 1000BaseTx Gigabit Ethernet IEEE 802.3ad Link Aggregation IEEE 802.3u 100BaseTx Fast Ethernet |
| Power | |
| Power Input | 5-36V DC [Latching] |
| Environmental Conditions | |
| Operating Temperature | -40°C to 85°C [-40°F to 185°F] |
| Storage Temperature | -40°C to 85°C [-40°F to 185°F] |
| Shock | MIL-STD-202G |
| Vibration | MIL-STD-202G |
| Mechanical Properties | |
| Dimensions | 136mm x 55mm (5.40” x 2.20”) |
Official Diamond Systems USA Distributor
Things Embedded is an official Diamond Systems USA distributor, supplying the EPS-12002L-HSP for USA defense and vehicle programs. Within the Diamond range the EPS-12000-CM is a miniature 12-port L2/L3 managed gigabit switch for designs short on space, and the EPSM-10GX is the switch module at the heart of this board.
With its heat spreader plate, the EPS-12002L-HSP sits among our embedded Ethernet switches, our Ethernet switch boards and our managed network switches. Where a flat mounting surface carries the heat and fins will not fit, this is the build to specify.
Consult. Design. Integrate.
Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.
Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.