EPS-12002L-HSP-L3 Overview
A routed network inside a vehicle needs a switch that handles subnets and time-critical traffic, yet still fits flat within a tight enclosure. The EPS-12002L-HSP-L3 is the Layer 3 build with a heat spreader mounting plate in the Diamond Systems EPS-12002L series. Diamond builds it around its EPSM-10GX Ethernet switch module, mounted on a carrier board that provides power, magnetics and connectors, so it arrives as a complete standalone Ethernet switch board.
The board carries 12 10/100/1000 Mbps copper ports for twisted-pair links and two SFP+ sockets that run at 1, 2.5, 5 or 10 Gbps with fiber or copper transceivers, and all ports switch at non-blocking wire speed. Switching and routing run on Diamond’s Layer 3 software package. You manage it through a GUI web interface reached over any port, or through a command language on the built-in RS-232 port when a field engineer connects locally. Diamond also offers software customization and can put your logo, color scheme and part numbers on the GUI and serial interface.
The Layer 3 package keeps the Layer 2+ feature set, including 4K IEEE 802.1Q VLANs, 8K MAC addresses, 8 QoS queues per port, IEEE 802.3ad link aggregation and RSTP/MSTP, and adds hardware- and software-based IPv6 L3 static routing, RFC 2328 OSPFv2 dynamic routing, RADIUS accounting and port and queue policers. It also lists IEEE 1588 PTP, which Diamond supports with a minor board modification to fit a precision clock circuit. The EPS-12002L-HSP is the Layer 2+ board with the same heat spreader, and the EPS-12002L-HSK-L3 pairs Layer 3 software with a finned heat sink. Our article on IEEE 1588 PTP timing explains how precise clocks help.
A 5 to 36 V DC input suits a range of industrial and vehicle power supplies, and the board operates from -40 to +85 °C. It uses latching I/O connectors, and Diamond specifies MIL-STD-202G shock and vibration resistance. The heat spreader is a mounting plate under the board, which suits designs that bolt the switch to a flat surface rather than rely on fins.
EPS-12002L-HSP-L3 Specifications
| Overview | |
|---|---|
| Features | Compact Embedded Fanless Managed Ethernet Switch |
| I/O | |
| Serial | 1x Serial Ports |
| 1x RS232 [Board] | |
| Networking | |
| Switching Layer | Layer 3 |
| Switch Type | Managed |
| Ethernet Ports | 12x 10/100/1000 BASE-TX [Latching] |
| Number of Ethernet Ports | 12x Ethernet Ports |
| Number of Fiber Ports | 2x 1G/10G [SFP+] |
| Networking Standards | IEEE 802.1D Spanning Tree Protocol IEEE 802.1Q VLAN IEEE 802.1s Multiple Spanning Tree Protocol IEEE 802.1w Rapid Spanning Tree Protocol IEEE 802.1X Port-Based Network Access Control IEEE 802.3 10BaseTx Ethernet IEEE 802.3ab 1000BaseTx Gigabit Ethernet IEEE 802.3ad Link Aggregation IEEE 802.3u 100BaseTx Fast Ethernet |
| Power | |
| Power Input | 5-36V DC [Latching] |
| Environmental Conditions | |
| Operating Temperature | -40°C to 85°C [-40°F to 185°F] |
| Storage Temperature | -40°C to 85°C [-40°F to 185°F] |
| Shock | MIL-STD-202G |
| Vibration | MIL-STD-202G |
| Mechanical Properties | |
| Dimensions | 136mm x 55mm (5.40” x 2.20”) |
Official Diamond Systems USA Distributor
Things Embedded is an official Diamond Systems USA distributor, supplying the EPS-12002L-HSP-L3 for USA defense and vehicle programs. Within the Diamond range the EPSM-10GX is the 26-port switch module this board is built on, for a custom carrier design, and the EPS-24G4X series offers 28 ports with four 10G ports and IEEE-1588.
As a routing board on a heat spreader plate, the EPS-12002L-HSP-L3 sits among our embedded network switches, our Ethernet switch boards and our managed Ethernet switches. Where routed traffic and a flat mounting surface both matter, this is the build to specify.
Consult. Design. Integrate.
Things Embedded is a leading USA supplier of industrial computing and edge AI systems. We combine technical expertise with a collaborative approach to deliver optimal solutions for your application. Whether it’s an off-the-shelf platform or a custom design, we stay at the forefront of the latest technologies to ensure your success at the edge. Our team works closely with you from concept through deployment, providing guidance, engineering support, and integration expertise every step of the way.
Connect with our solutions experts today to review your requirements and find the ideal solution fit for your application.