Diamond Systems EPS-12002L-HSK-L3 Compact Managed Ethernet Switch with 12x 1GbE Ports + 2x 1/2.5/5/10GbE SFP+ sockets, Layer 3 software & heat sink

Once a vehicle or machine network splits into several subnets, a Layer 2 switch alone cannot pass traffic between them without a separate router. The EPS-12002L-HSK-L3 is the Layer 3 build with an integrated heat sink in the Diamond Systems EPS-12002L series. Diamond builds it around its EPSM-10GX Ethernet switch module, mounted on a carrier board that provides power, magnetics and connectors, so it arrives as a complete standalone Ethernet switch board.

The board carries 12 10/100/1000 Mbps copper ports for twisted-pair links and two SFP+ sockets that run at 1, 2.5, 5 or 10 Gbps with fiber or copper transceivers, and all ports switch at non-blocking wire speed. It runs Diamond’s Layer 3 routing and switching software. You manage it through a GUI web interface reached over any port, or through a command language on the built-in RS-232 port when a field engineer connects locally. Diamond also offers software customization and can put your logo, color scheme and part numbers on the GUI and serial interface.

The Layer 3 package keeps the Layer 2+ feature set, including 4K IEEE 802.1Q VLANs, 8K MAC addresses, 8 QoS queues per port, IEEE 802.3ad link aggregation and RSTP/MSTP, and adds hardware- and software-based IPv6 L3 static routing, RFC 2328 OSPFv2 dynamic routing, RADIUS accounting and port and queue policers. It also lists IEEE 1588 PTP, which Diamond supports with a minor board modification to fit a precision clock circuit. The EPS-12002L-HSK is the Layer 2+ board with the same heat sink, and the EPS-12002L-HSP-L3 pairs Layer 3 software with a heat spreader. Our guide to Layer 2 and Layer 3 switches sets out when routing is worth it.

A 5 to 36 V DC input suits a range of industrial and vehicle power supplies, and the board operates from -40 to +85 °C. It uses latching I/O connectors, and Diamond specifies MIL-STD-202G shock and vibration resistance. The integrated heat sink sits over the switch module, which suits enclosures with room above the board for its fins.