Diamond Systems OSB-ER-32G NVIDIA Jetson AGX Orin 32GB Rugged Carrier Board with 10GbE, Latching I/O and 1TB or 2TB SSD

Rugged AI systems in vehicles, robots and outdoor cabinets need a Jetson AGX Orin that survives shock, vibration and wide temperature swings without loose connectors. The OSB-ER-32G is the AGX Orin 32GB build in the Diamond Systems OSBOURNE-ER series, a rugged Jetson carrier board that pairs the Osbourne carrier with a latching I/O adapter on a bottom-mounted heat spreader mounting plate.

NVIDIA rates the Jetson AGX Orin 32GB module at up to 200 TOPS, which suits multi-camera inference and sensor fusion workloads that fit within 32 GB of memory. A camera adapter socket takes four 4-lane or eight 2-lane CSI-2 cameras, with adapters for CSI, GMSL and other camera types. Diamond builds the OSB-ER-32G with a 1TB or 2TB SSD, ordered as OSB-ER-32G-1T or OSB-ER-32G-2T, and preloads a Linux image based on NVIDIA L4T.

The I/O adapter carries one 1G/2.5G/5G/10G multi-gigabit Ethernet port and one Gigabit port, three USB 3.2 ports with USB 2.0 fallback and one USB 2.0 port, HDMI 2.0a/b direct from the module and audio on an ALC5640 codec. Serial covers two software-configurable RS-232/422/485 ports, one with a TTL option, and two fixed RS-232 ports, alongside two CAN 2.0 ports and eight digital I/O lines selectable for 3.3 or 5 V. A data acquisition circuit adds six 12-bit A/D inputs, two 12-bit D/A outputs and 12 GPIO, and every connector latches. Expansion runs to an M.2 M-key 2280 or 2242 NVMe socket on four PCIe Gen 3 lanes, an M.2 E-key 2230 socket and one full-size minicard socket with PCIe and USB.

Power is 7-20 V DC on a latching connector, and the OSB-ER-32G is rated from -25 to 78 °C, cooled by conduction through the heat spreader plate. A single 150-pin high-speed connector joins the carrier and I/O adapter. The OSB-ER-64G moves to the 64GB module at up to 275 TOPS, and the OSB-ER-64GXT uses the Industrial module for -40 to 83 °C. We supply each one configured, with the module fitted, storage installed, the JetPack image loaded and the assembly tested before it ships.