Diamond Systems OSB-ER-64G NVIDIA Jetson AGX Orin 64GB (275 TOPS) Rugged Carrier Board with Dual CAN, 6-Channel A/D and -25 to 78 °C

Rugged edge AI projects often need more memory once more cameras, larger models or sensor fusion arrive. The OSB-ER-64G is the AGX Orin 64GB build in the Diamond Systems OSBOURNE-ER series, a rugged Jetson carrier board that joins the Osbourne carrier and a latching I/O adapter on a bottom-mounted heat spreader mounting plate.

NVIDIA rates the Jetson AGX Orin 64GB module at up to 275 TOPS, with 64 GB of memory for larger inference models and more concurrent streams. The camera adapter socket takes four 4-lane or eight 2-lane CSI-2 cameras, and Diamond’s adapters extend it to GMSL and other camera types. Storage is a 1TB or 2TB SSD, ordered from Diamond as OSB-ER-64G-1T or OSB-ER-64G-2T, with a Linux image based on NVIDIA L4T preloaded.

The I/O adapter carries one 1G/2.5G/5G/10G multi-gigabit Ethernet port and one Gigabit port, three USB 3.2 ports with USB 2.0 fallback and one USB 2.0 port, HDMI 2.0a/b direct from the module and audio on an ALC5640 codec. Serial covers two software-configurable RS-232/422/485 ports, one with a TTL option, and two fixed RS-232 ports, alongside two CAN 2.0 ports and eight digital I/O lines selectable for 3.3 or 5 V. A data acquisition circuit adds six 12-bit A/D inputs, two 12-bit D/A outputs and 12 GPIO, and every connector latches. An M.2 M-key 2280 or 2242 NVMe socket on four PCIe Gen 3 lanes, an M.2 E-key 2230 socket for wireless and one full-size minicard socket handle expansion.

The OSB-ER-64G takes 7-20 V DC on a latching connector and is rated from -25 to 78 °C, with the heat spreader plate carrying heat into the enclosure wall. The OSB-ER-32G offers the same carrier with the 32GB module, and the OSB-ER-64GXT fits the AGX Orin Industrial 64GB for -40 to 83 °C. We supply the OSB-ER-64G configured, with the module fitted, the SSD installed, the JetPack image loaded and the whole assembly tested before delivery.