DFI
// Headquartered in Taiwan. Founded in 1981.
DFI USA Distributor
DFI Industrial Boards and Computers
Ten product families on Intel, AMD Ryzen and NVIDIA Jetson. Pick the family that matches the form factor or the installation, then the series that matches the processor generation and the I/O you have to connect.
1.8-Inch Femto-ITX Single Board Computers
84 x 55 mm boards for handheld devices, compact controllers and embedded modules, with memory and eMMC soldered on so nothing works loose. Choose Intel Twin Lake, Alder Lake-N and Amston Lake or AMD Ryzen Embedded R1000 and R2000, with extended-temperature builds for outdoor and vehicle use.
- TWLF51: Intel N100, N150, Core 3 N355 and Atom x7000RE, 8 GB LPDDR5 and 64 GB eMMC
- GHF51 and PCSF51: AMD Ryzen Embedded R1000 and R2000 with memory down and 64 GB eMMC
- ALF51: Intel Atom E3900 and Celeron Apollo Lake, dual GbE, -40 to 85 °C builds




2.5-Inch Pico-ITX Single Board Computers
100 x 72 mm boards for the smallest fanless enclosures, from Intel Core Series 3 Wildcat Lake and 13th Gen Core down to Atom and Celeron, with dual 2.5GbE, HDMI and LVDS on the newest boards and wide or extended temperature builds across the range.
- WCL051: Intel Core Series 3 Wildcat Lake, dual 2.5GbE, HDMI and LVDS
- ASL051 and EHL051: Intel Atom x7000RE and x6000, N-series and Celeron, -40 to 85 °C builds
- RPP051: 13th Gen Intel Core and Processor U300E, extended temperature options
- WL051, WL053 and AL05: 8th Gen Core and Apollo Lake boards, including PoE-powered models
- QCS051: Qualcomm Dragonwing QCS6490 and QCS5430 Arm boards with 128 GB UFS and CAN FD







3.5-Inch Single Board Computers
146 x 102 mm boards with the I/O of a full motherboard, for fanless boxes, controllers and machine enclosures. Processors run from Intel Atom and N-series through Core Ultra Meteor Lake and Arrow Lake to AMD Ryzen Embedded, with triple 2.5GbE, wide DC input and -40 to 85 °C builds.
- MTH556: Intel Core Ultra Meteor Lake and Arrow Lake, dual 2.5GbE, 9 to 36 V DC
- ASL553 and ADN553: Intel Atom x7000RE and Alder Lake-N, triple 2.5GbE, 9 to 36 V DC
- IRN556 and EHL556: Amston Lake, Twin Lake and Elkhart Lake with extended temperature
- GH551, WL551, KU551, AL551, AL553 and CS551: Ryzen Embedded, Core and Apollo Lake boards
- QRB551 and M8MP553: Qualcomm QRB5165 and NXP i.MX 8M Plus Arm boards, 9 to 36 V DC on M8MP553








4-Inch EPIC Single Board Computers
165 x 115 mm EPIC boards for systems that connect many devices directly: up to six COM ports, triple or quad LAN and 9 to 36 V DC input on most models, with processors from Intel Atom and Core Ultra to AMD Ryzen 8000.
- MTH253: Intel Core Ultra Meteor Lake with memory down and six COM ports
- HPT253: AMD Ryzen 8000 with triple LAN and 9 to 36 V DC
- ADP253 and ADN253: 12th Gen Core and Alder Lake-N, quad display and six COM ports
- ASL253, EHL253 and AL253: Atom x7000RE, Elkhart Lake and Apollo Lake, extended temperature builds






Mini-ITX and Thin Mini-ITX Industrial Motherboards
170 x 170 mm boards with a full expansion slot, in soldered-processor versions from Atom to Core Ultra Panther Lake and AMD Ryzen 8000, and socketed LGA1700 and LGA1851 versions, including Thin Mini-ITX boards for slim enclosures and panel PCs.
- PTH171 and PTH173: Intel Core Ultra Panther Lake, triple 2.5GbE, 12 V or 12 to 28 V DC
- ARH171, HPT171 and RPP171: Arrow Lake, Ryzen 8000 and 13th Gen Core with triple or dual 2.5GbE
- ARS101 and ADS101: socketed Core Ultra 200S and 14th Gen Core on Thin Mini-ITX
- ASL, ADN, TGU, CMS, CS, AL and WL series: Atom to 10th Gen Core with 12 V or wide-range DC






ATX and Micro-ATX Industrial Motherboards
Full-size boards for systems that carry several add-in cards, from frame grabbers and motion controllers to GPUs, with socketed Intel Core Ultra 200S, Bartlett Lake and 8th to 14th Gen Core, AMD Ryzen on AM5, PCIe Gen5 slots and legacy PCI for existing cards.
- ARS630 and ARS310: Intel Core Ultra 200S on LGA1851 with W880 or Q870
- BTS610, RPS630 and ADS630: Bartlett Lake and 14th Gen Core on LGA1700, up to seven slots
- RAP310: AMD Ryzen 9000 and 7000 on AM5 with B650
- CMS and CS series: 10th, 9th and 8th Gen Core and Xeon W or E with PCI slots






Intel Xeon Scalable Server Motherboards
Server boards for edge compute, vision servers and imaging systems that need many cores, registered ECC memory and wide PCIe expansion, in single-socket ATX and dual-socket EATX formats with optional IPMI remote management.
- ICX610: 3rd Gen Intel Xeon Scalable Ice Lake-SP on LGA 4189 with dual 10GbE
- PR810 and PR811: dual Intel Xeon Scalable on EATX with C622 and dual 10GbE
- PR610 and PR611: Intel Xeon Scalable on ATX with C621
- V and I builds add a VGA module or IPMI remote management





EC and ECX Fanless Embedded Box PCs
Fanless computers built around DFI's own boards, from low-profile Atom x7000 and Elkhart Lake systems with DFI Out-of-Band management to 12th Gen Core, Core Ultra and Ryzen R1000 small form factor PCs, Qualcomm QCS6490 and NXP i.MX 8M Mini Arm systems, and the sealed ECX700 line for outdoor, vehicle and washdown sites. We supply each one configured and tested, with memory, storage, wireless modules and your OS image fitted.
- EC70A-TGU: 11th Gen Core i7, i5, i3 and Celeron, 9-36 V DC, eleven builds across three rear I/O layouts
- EC700-AL: Atom x7-E3950 to Celeron N3350, two Mini PCIe and one M.2 slot, -40 to +70 °C
- ECX700-AL: IP67/IP69K sealed, -40 to +70 °C, 4G LTE, Wi-Fi and CAN options
- EC70A-ADP, EC70A-MTH and EC70A-ADN: 12th Gen Core, Core Ultra and Core i3-N305 fanless PCs with 9 to 36 V DC
- EC700-ASL, EC700-ADN and ED700-EHL: low-profile Atom x7000 and Elkhart Lake PCs, with DFI Out-of-Band on the X-series builds
- EC90A-GH, EC900-QCS and EC900-8MM: AMD Ryzen R1000, Qualcomm QCS6490 and NXP i.MX 8M Mini small form factor systems
- ECX700-ADP and ECX700-ASL: IP67 and IP68/IP69K sealed computers on 12th Gen Core and Atom x7000RE















X6 NVIDIA Jetson Orin Edge AI Systems
Compact fanless edge AI computers on NVIDIA Jetson Orin: the X6-ORN and X6-ORN-GMSL on Orin Nano and Orin NX with four Gigabit ports, optional PoE and, on the GMSL build, two GMSL2 camera inputs; the X6X-ORN, the same system in an IP67 sealed housing with M12 and M20 connectors; and the X6a-AGX on AGX Orin with 10 GbE, CAN and up to eight GMSL2 cameras.
- X6-ORN: Orin Nano 4 GB and 8 GB, Orin NX 8 GB and 16 GB, 4x GbE with optional 2x PoE, M.2 for Wi-Fi 6E and 5G, 9-36 V DC, optional out-of-band management
- X6-ORN-GMSL: adds two GMSL2 camera ports for machine vision and robotics
- X6X-ORN: IP67 sealed, M12 PoE and M20 USB connectors, GMSL2 cameras, for vehicles and outdoor sites
- X6a-AGX: AGX Orin up to 275 TOPS, 10 GbE, CAN, optional SDI and HDMI capture, -20 to +60 °C, 12-54 V DC




Railway and In-Vehicle Computers
Fanless computers for trains, buses and service vehicles. The RC300-CS is designed to EN 50155 requirements for rolling stock, with an MXM slot for passively cooled GPU acceleration, four M12 PoE ports and a 110 V DC input on the H builds. The in-vehicle range is built for vehicle power, with wide DC input, ignition control and, on every model except the VCX700-MTH, E-Mark compliance: VC70B-MTH and the IP67-sealed VCX700-MTH on Intel Core Ultra, VC700-ASL on Intel Amston Lake, VC500-CMS and VC500-CMS-MXM on 10th Gen Core with PoE, 10GbE or an MXM GPU, VC300-CS with MXM, and the NXP i.MX 8M VC900-M8M box with the VP070-M8M and VP101-M8M panel PCs. We supply each one configured and tested, with storage, wireless modules and your OS image fitted.
- VC70B-MTH and VCX700-MTH: Intel Core Ultra in-vehicle computers, the VCX700-MTH sealed to IP67
- VC700-ASL, VC500-CMS and VC500-CMS-MXM: Amston Lake and 10th Gen Core with PoE, 10GbE or an MXM GPU
- RC300-CS and VC300-CS: Intel Core i7-9700TE with an MXM GPU slot, RC300-CS designed to EN 50155 requirements
- VC900-M8M, VP070-M8M and VP101-M8M: NXP i.MX 8M box and 7 inch (7") and 10.1 inch (10.1") in-vehicle panel PCs










Browse DFI's Latest Products
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ADN553-BN-x7213E
ADN553 with Intel Atom x7213E, LVDS, triple 2.5GbE and 9 to 36 V DC -
ADN553-BN-N200
ADN553 with Intel N200, LVDS, triple 2.5GbE and 9 to 36 V DC -
ADN553-BN-N305
ADN553 with Intel Core i3-N305, eDP, triple 2.5GbE and 9 to 36 V DC -
ADN553-BN-N50
ADN553 with Intel N50, eDP, triple 2.5GbE and 9 to 36 V DC -
ADN553-BN-N97
ADN553 with Intel N97, eDP, triple 2.5GbE and 9 to 36 V DC -
ADN553-BN-x7211E
ADN553 with Intel Atom x7211E, eDP, triple 2.5GbE and 9 to 36 V DC -
ADN553-BN-x7425E
ADN553 with Intel Atom x7425E, LVDS, triple 2.5GbE and 9 to 36 V DC
- Memory: 1x DDR5 4800MHz SO-DIMM, 16GB
- OS: Linux, Windows 11
- Ethernet: 3x 2.5 GbE LAN [RJ45]
- USB: 1x USB 3.2 [Type C], 1x USB 3.2 Gen 1 [Type A], 2x USB 2.0 [Board], 2x USB 3.2 Gen 2 [Type A]
- Serial: 1x RS232/422/485 [Board]
- M.2: 1x M.2 B-Key [PCIe x1/USB/SIM] [3042/3052], 1x M.2 E-Key [PCIe x1/USB 2.0] [2230], 1x M.2 M-Key [PCIe x1/SATA] [2242/2280]
- Storage: 1x M.2 SSD, 1x SATA Port
- Power: 9-36V DC [4-Pin], 9-36V DC [Barrel Connector]
- Temp: -5°C to 65°C [23°F to 149°F]
- Certification: CE, FCC, KC, RoHS, UKCA
- CPU: Intel Atom X Series Alder Lake
- Display Outputs: 1x HDMI, 1x LVDS, 1x USB Type C
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ADN253-N305
ADN253 with eight-core Intel Core i3-N305, 16~GB LPDDR5, six COM and triple LAN -
ADN253-N97
ADN253 with quad-core Intel N97 (Alder Lake-N), 8~GB LPDDR5 and six COM -
ADN253-x7211E
ADN253 with dual-core Intel Atom x7211E, 8~GB LPDDR5, six COM and 9 to 36~V DC -
ADN253-x7425E
ADN253 with quad-core Intel Atom x7425E, 16~GB LPDDR5, six COM and 9 to 36~V DC
- OS: Linux, Linux Ubuntu 22.04, Windows 11
- Display Outputs: 1x eDP, 1x HDMI
- Ethernet: 1x GbE LAN [RJ45], 2x 2.5 GbE LAN [RJ45]
- USB: 1x USB 3.2 [Type C], 2x USB 2.0 [Board], 3x USB 3.2 [Type A]
- Serial: 2x RS232 [Board], 2x RS232 [DB9], 2x RS232/422/485 [DB9]
- M.2: 1x M.2 B-Key [PCIe x2/USB 3.0/USB 2.0/SIM] [3042/3052], 1x M.2 E-Key [USB/PCIe] [2230], 1x M.2 M-Key [PCIe x1/SATA] [2242/2280]
- Storage: 1x M.2 SSD, 1x SATA Port
- Power: 9-36V DC [4-Pin], 9-36V DC [Barrel Connector]
- Temp: -5°C to 80°C [23°F to 176°F]
- Certification: CE, FCC
- CPU: Intel Processor N Series Alder Lake
- Memory: 16GB Soldered On-board
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ADN173-CB-N100
ADN173 with Intel N100, dual DisplayPort, dual 2.5GbE and 9 to 36~V DC -
ADN173-CB-N50
ADN173 with dual-core Intel N50, triple display and 9 to 36~V DC -
ADN173-CB-N97
ADN173 with quad-core Intel N97, dual DisplayPort, 32~GB DDR5 support and 9 to 36~V DC -
ADN173-CB-i3-N305
ADN173 with eight-core Intel Core i3-N305, DP and HDMI, and 9 to 36~V DC -
ADN173-CB-x7213E
ADN173 with dual-core Intel Atom x7213E, DP and HDMI, and 9 to 36~V DC -
ADN173-CB-x7425E
ADN173 with quad-core Intel Atom x7425E, VGA, DP and USB-C, and 9 to 36~V DC
- OS: Linux, Windows 11
- Ethernet: 2x 2.5 GbE LAN [RJ45]
- Serial: 2x RS232/422/485 [Board], 4x RS232 [Board]
- M.2: 1x M.2 A-Key [Display] [3060], 1x M.2 B-Key [PCIe x1 Gen3/USB 2.0/SATA/SIM] [2242/3042/3052], 1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
- PCIe: 1x PCIe [x4 Slot] [x2 Signal] [Gen3]
- Storage: 1x M.2 SSD, 2x SATA Ports
- Power: 9-36V DC [4-Pin], 9-36V DC [Barrel Connector]
- Temp: -5°C to 65°C [23°F to 149°F]
- Certification: CE, FCC, KC, RoHS, UKCA
- CPU: Intel Processor N Series Alder Lake
- Memory: 1x DDR5 4800MHz SO-DIMM, 16GB
- Display Outputs: 2x Display Ports
- USB: 1x USB 2.0 [Type A], 3x USB 3.2 Gen 2 [Type A], 4x USB 2.0 [Board]
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ADN171-CB-N100
ADN171 with Intel N100, triple display, dual 2.5GbE and 12~V DC input -
ADN171-CB-N200
ADN171 with quad-core Intel N200, DP and HDMI, and four USB 3.2 Gen 2 ports -
ADN171-CB-N50
ADN171 with dual-core Intel N50 at 6~W, dual DisplayPort and dual 2.5GbE -
ADN171-CB-N97
ADN171 with quad-core Intel N97, triple display, 32~GB DDR5 support and dual 2.5GbE -
ADN171-CB-i3-N305
ADN171 with eight-core Intel Core i3-N305, DP and HDMI, and dual 2.5GbE -
ADN171-CB-x7213E
ADN171 with Intel Atom x7213E, VGA, DP and USB-C displays and dual 2.5GbE
- OS: Linux, Windows 11
- Ethernet: 2x 2.5 GbE LAN [RJ45]
- Serial: 2x RS232/422/485 [Board], 4x RS232 [Board]
- M.2: 1x M.2 A-Key [Display] [3060], 1x M.2 B-Key [PCIe x1 Gen3/USB 2.0/SATA/SIM] [2242/3042/3052], 1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
- PCIe: 1x PCIe [x4 Slot] [x2 Signal] [Gen3]
- Storage: 1x M.2 SSD, 2x SATA Ports
- Power: 12V DC [4-Pin], 12V DC [Barrel Connector]
- Temp: -5°C to 65°C [23°F to 149°F]
- Certification: CE, FCC, KC, RoHS, UKCA
- CPU: Intel Processor N Series Alder Lake
- Memory: 1x DDR5 4800MHz SO-DIMM, 16GB
- Display Outputs: 1x USB Type C, 2x Display Ports
- USB: 1x USB 3.2 Gen 2 [Type C], 3x USB 3.2 Gen 2 [Type A], 4x USB 2.0 [Board]
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ASL553-TN-x7835RE
ASL553 with Intel Atom x7835RE, triple 2.5GbE and -40 to 85 °C -
ASL553-TN-x7211RE
ASL553 with Intel Atom x7211RE, triple 2.5GbE and -40 to 85 °C -
ASL553-TN-x7213RE
ASL553 with Intel Atom x7213RE, triple 2.5GbE and -40 to 85 °C -
ASL553-TN-x7433RE
ASL553 with Intel Atom x7433RE, triple 2.5GbE and -40 to 85 °C
- CPU: Intel Atom X Series Amston Lake
- Memory: 1x DDR5 4800MHz SO-DIMM, 16GB
- OS: Linux, Windows 11
- Display Outputs: 1x HDMI, 1x LVDS, 1x USB Type C
- Ethernet: 3x 2.5 GbE LAN [RJ45]
- USB: 1x USB 3.2 [Type C], 1x USB 3.2 Gen 1 [Type A], 2x USB 2.0 [Board], 2x USB 3.2 Gen 2 [Type A]
- Serial: 1x RS232/422/485 [Board]
- M.2: 1x M.2 B-Key [PCIe x1/USB/SIM] [3042/3052], 1x M.2 E-Key [PCIe x1/USB 2.0] [2230], 1x M.2 M-Key [PCIe x1/SATA] [2242/2280]
- Storage: 1x M.2 SSD, 1x SATA Port
- Power: 9-36V DC [4-Pin], 9-36V DC [Barrel Connector]
- Temp: -40°C to 85°C [-40°F to 185°F]
- Certification: CE, FCC, RoHS, UKCA
- CPU: Intel Atom X Series Amston Lake
- Memory: 16GB Soldered On-board
- OS: Linux, Linux Ubuntu 22.04, Windows 11
- Display Outputs: 1x eDP, 1x HDMI
- Ethernet: 1x GbE LAN [RJ45], 2x 2.5 GbE LAN [RJ45]
- USB: 1x USB 2.0 [Board], 1x USB 3.2 [Type C], 3x USB 3.2 [Type A]
- Serial: 2x RS232 [Board], 2x RS232 [DB9], 2x RS232/422/485 [DB9]
- M.2: 1x M.2 B-Key [PCIe x2/USB 3.0/USB 2.0/SIM] [3042/3052], 1x M.2 E-Key [USB/PCIe] [2230], 1x M.2 M-Key [PCIe x1/SATA] [2242/2280]
- Storage: 1x M.2 SSD, 1x SATA Port
- Power: 9-36V DC [4-Pin], 9-36V DC [Barrel Connector]
- Temp: -40°C to 80°C [-40°F to 176°F]
- Certification: CE, FCC
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ASL173-CB-N150
ASL173 with Intel N150 (Twin Lake), 9 to 36~V DC and -5 to 65~°C -
ASL173-CT-x7211RE
ASL173 with 6~W Atom x7211RE, USB-C, 9 to 36~V DC and -40 to 85~°C -
ASL173-CT-x7213RE
ASL173 with dual-core Atom x7213RE, HDMI, 9 to 36~V DC and -40 to 85~°C -
ASL173-CT-x7433RE
ASL173 with quad-core Atom x7433RE, dual DP, 9 to 36~V DC and -40 to 85~°C -
ASL173-CT-x7835RE
ASL173 with Intel Atom x7835RE, eight cores, 9 to 36~V DC and -40 to 85~°C
- Memory: 1x DDR5 4800MHz SO-DIMM, 16GB
- OS: Linux, Windows 11
- Ethernet: 2x 2.5 GbE LAN [RJ45]
- Serial: 2x RS232/422/485 [Board], 4x RS232 [Board]
- M.2: 1x M.2 A-Key [Display] [3060], 1x M.2 B-Key [PCIe x1 Gen3/USB 2.0/SATA/SIM] [2242/3042/3052], 1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
- PCIe: 1x PCIe [x4 Slot] [x2 Signal] [Gen3]
- Storage: 1x M.2 SSD, 2x SATA Ports
- Power: 9-36V DC [4-Pin], 9-36V DC [Barrel Connector]
- Certification: CE, FCC, RoHS, UKCA
- CPU: Intel Processor N Series Twin Lake
- Display Outputs: 1x Display Port, 1x HDMI
- USB: 4x USB 2.0 [Board], 4x USB 3.2 Gen 2 [Type A]
- Temp: -5°C to 65°C [23°F to 149°F]
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ASL171-CB-N150
ASL171 with Intel N150 (Twin Lake), DP, HDMI, 4x USB 3.2 and -5 to 65~°C -
ASL171-CT-x7211RE
ASL171 with dual-core Intel Atom x7211RE at 6~W, dual DP and -40 to 85~°C -
ASL171-CT-x7213RE
ASL171 with dual-core Intel Atom x7213RE, DP, HDMI, 4x USB 3.2 and -40 to 85~°C -
ASL171-CT-x7433RE
ASL171 with quad-core Intel Atom x7433RE, VGA, DP, USB-C and -40 to 85~°C -
ASL171-CT-x7835RE
ASL171 with Intel Atom x7835RE, eight cores, dual 2.5GbE and -40 to 85~°C
- Memory: 1x DDR5 4800MHz SO-DIMM, 16GB
- OS: Linux, Windows 11
- Ethernet: 2x 2.5 GbE LAN [RJ45]
- Serial: 2x RS232/422/485 [Board], 4x RS232 [Board]
- M.2: 1x M.2 A-Key [Display] [3060], 1x M.2 B-Key [PCIe x1 Gen3/USB 2.0/SATA/SIM] [2242/3042/3052], 1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
- PCIe: 1x PCIe [x4 Slot] [x2 Signal] [Gen3]
- Storage: 1x M.2 SSD, 2x SATA Ports
- Power: 12V DC [4-Pin], 12V DC [Barrel Connector]
- Certification: CE, FCC, RoHS, UKCA
- CPU: Intel Processor N Series Twin Lake
- Display Outputs: 1x Display Port, 1x HDMI
- USB: 4x USB 2.0 [Board], 4x USB 3.2 Gen 2 [Type A]
- Temp: -5°C to 65°C [23°F to 149°F]
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ASL051-BCD-N97
ASL051 with Intel N97, quad-core at 12 W, dual 2.5GbE, HDMI and LVDS -
ASL051-BCD-N150
ASL051 with Intel N150, quad-core at 6 W, dual 2.5GbE, HDMI and LVDS -
ASL051-BCD-N305
ASL051 with Intel Core i3-N305, eight cores, dual 2.5GbE, HDMI and LVDS -
ASL051-BCD-N355
ASL051 with Intel Core 3 N355, eight cores, dual 2.5GbE, HDMI and LVDS -
ASL051-TTD-x7211RE
ASL051 with Intel Atom x7211RE, dual-core at 6 W and -40 to 85 °C -
ASL051-TTD-x7433RE
ASL051 with Intel Atom x7433RE, four cores at 9 W and -40 to 85 °C -
ASL051-TTD-x7835RE
ASL051 with Intel Atom x7835RE, eight cores, dual 2.5GbE and -40 to 85 °C
- Memory: 1x DDR5 4800MHz SO-DIMM, 16GB
- OS: Linux, Windows 11
- Display Outputs: 1x HDMI, 1x LVDS
- Ethernet: 2x 2.5 GbE LAN [RJ45]
- USB: 2x USB 2.0 [Board], 2x USB 3.2 Gen 2 [Type A]
- Serial: 2x RS232/422/485 [Board]
- M.2: 1x M.2 B-Key [PCIe x1 Gen3/USB 3.2 Gen 1/SATA/SIM] [2242/3042], 1x M.2 B-Key [PCIe x2 Gen3/USB 2.0/SATA] [2242], 1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
- Storage: 1x M.2 SSD
- Power: 12V DC [Terminal Block]
- Certification: CE, FCC, RoHS, UKCA
- CPU: Intel Processor N Series Alder Lake
- Temp: -5°C to 65°C [23°F to 149°F]
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TWLF51-BT-86N10
TWLF51 with Intel N100, quad-core Alder Lake-N, 8 GB LPDDR5 and 64 GB eMMC -
TWLF51-BT-86N15
TWLF51 with Intel N150, quad-core at 6 W, 8 GB LPDDR5 and 64 GB eMMC -
TWLF51-BT-86N35
TWLF51 with Intel Core 3 N355, eight cores, 8 GB LPDDR5 and 64 GB eMMC -
TWLF51-EC-86X72
TWLF51 with Intel Atom x7211RE, dual-core at 6 W and -20 to 70 °C -
TWLF51-EC-86X7213RE
TWLF51 with Intel Atom x7213RE, dual-core 2.0 GHz base, -20 to 70 °C -
TWLF51-EC-86X74
TWLF51 with Intel Atom x7433RE, four cores at 9 W and -20 to 70 °C -
TWLF51-EC-86X78
TWLF51 with Intel Atom x7835RE, eight cores and -20 to 70 °C
- Memory: 8GB Soldered On-board
- OS: Linux, Windows 11
- Display Outputs: 1x HDMI
- Ethernet: 1x GbE LAN [RJ45]
- USB: 2x USB 2.0 [Board], 2x USB 3.2 Gen 2 [Type A]
- Serial: 1x RS232/422/485 [Board]
- M.2: 1x M.2 E-Key [PCIe x1/USB 2.0] [2230]
- Storage: 64GB eMMC
- Power: 12V DC [Terminal Block]
- Certification: CE, FCC, RoHS, UKCA
- CPU: Intel Processor N Series Alder Lake
- Temp: -5°C to 65°C [23°F to 149°F]
- CPU: Intel Core Series 3 Wildcat Lake
- Memory: 1x DDR5 6400MHz SO-DIMM Slot, 64GB
- OS: Linux, Windows 11
- Display Outputs: 1x HDMI, 1x LVDS
- Ethernet: 2x 2.5 GbE LAN [RJ45]
- USB: 2x USB 2.0 [Board], 2x USB 3.2 Gen 2 [Type A]
- Serial: 2x RS232/422/485 [Board]
- M.2: 1x M.2 B-Key [PCIe x1 Gen4/USB 3.2 Gen 2/SIM] [3042], 1x M.2 E-Key [PCIe x1 Gen4/USB 2.0] [2230], 1x M.2 M-Key [PCIe x2 Gen4] [2242]
- Storage: 1x M.2 SSD
- Power: 12V DC [Terminal Block]
- Temp: 0°C to 60°C [32°F to 140°F]
- Certification: CE, FCC, RoHS, UKCA
- OS: Linux, Windows 10, Windows 11
- Ethernet: 1x 2.5 GbE LAN [Board]
- USB: 8x USB 2.0 [Board], 2x USB 3.2 Gen 2 [Board]
- Temp: -5°C to 65°C [23°F to 149°F]
- Certification: CE, FCC
- CPU: Intel Processor N Series Alder Lake
- Memory: 8GB Soldered On-board
- CPU: Intel Core Ultra Series 1 Meteor Lake
- AI Performance: 11 TOPS
- Memory: 16GB Soldered On-board, 32GB Soldered On-board
- OS: Linux, Windows 10, Windows 11
- Ethernet: 1x 2.5 GbE LAN [Board]
- USB: 8x USB 2.0 [Board], 2x USB 3.2 Gen 2 [Board]
- Temp: -40°C to 85°C [-40°F to 185°F]
- Certification: CE, FCC, RoHS, UKCA
- CPU: Intel Core 11th Gen Tiger Lake, Intel Celeron 6000 Series Tiger Lake
- Memory: 2x DDR4 3200MHz SO-DIMM Slots, 64GB
- OS: Linux, Windows 10, Windows 11
- Display Outputs: 1x LVDS, 1x VGA, 3x Display Ports
- Ethernet: 1x 2.5 GbE LAN [Board]
- USB: 4x USB 3.1 Gen 2 [Board], 8x USB 2.0 [Board]
- Certification: CE, FCC, RoHS, UKCA
Why Choose DFI
DFI has designed industrial motherboards and embedded computers in Taipei since 1981, building them in Taoyuan, Suzhou and Vietnam as part of the Qisda/BenQ Group. More than 300 R&D engineers stand behind boards, system-on-modules and industrial computers developed for 24/7 operation and supported for up to 15 years, and as an official DFI distributor we bring that to USA projects.
Your DFI Partner in the USA
Our DFI news, case studies and white papers cover the latest hardware and projects we have delivered with them. As the official DFI distributor in the USA, we help you choose the right DFI board or system, configure and test it in the USA as standard, and support it locally for the life of your project. When DFI launches, updates or retires a product, we will update you directly, with time to plan the change or a last-time buy.
Speak to a DFI Specialist.
Things Embedded is an official DFI distributor and integration partner in the USA. Tell us the form factor, the environment and the interfaces you have to connect, and we will point you to the right family, then configure, image and test the board or system before it ships.








